Patents by Inventor Ninao Sato
Ninao Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11942495Abstract: A semiconductor device includes a semiconductor chip, a circuit board, a heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.Type: GrantFiled: June 21, 2019Date of Patent: March 26, 2024Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Daisuke Chino, Hiroyuki Shigeta, Shigekazu Ishii, Koyo Hosokawa, Hirohisa Yasukawa, Mitsuhito Kanatake, Kosuke Hareyama, Yutaka Ootaki, Kiyohisa Sakai, Atsushi Tsukada, Hirotaka Kobayashi, Ninao Sato, Yuki Yamane
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Publication number: 20220246665Abstract: A yield drop of a semiconductor package including a via is reduced. The semiconductor package includes a solid-state imaging element, a circuit layer, a wiring layer, and a support substrate. The solid-state imaging element in the semiconductor package generates image data. A signal processing circuit that performs predetermined signal processing on the image data is disposed in the circuit layer. An output side via the other end of which is connected to an external terminal penetrates the support substrate. The wiring layer is disposed between the support substrate and the circuit layer. A signal line that connects the signal processing circuit and one end of the output side via is wired in the wiring layer.Type: ApplicationFiled: May 22, 2020Publication date: August 4, 2022Inventors: HIKARU OHIRA, NINAO SATO, YIOCHIRO FUJINAGA, ATSUSHI TSUKADA
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Publication number: 20210233949Abstract: Deformation of a semiconductor chip is to be prevented in a semiconductor device in which a heat releasing plate and a circuit board are disposed. The semiconductor device includes the semiconductor chip, the circuit board, the heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.Type: ApplicationFiled: June 21, 2019Publication date: July 29, 2021Inventors: DAISUKE CHINO, HIROYUKI SHIGETA, SHIGEKAZU ISHII, KOYO HOSOKAWA, HIROHISA YASUKAWA, MITSUHITO KANATAKE, KOSUKE HAREYAMA, YUTAKA OOTAKI, KIYOHISA SAKAI, ATSUSHI TSUKADA, HIROTAKA KOBAYASHI, NINAO SATO, YUKI YAMANE
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Patent number: 9380195Abstract: A camera module includes a solid-state image sensing device having a light receiving surface on which a plurality of pixels are provided, and a lens disposed above the solid-state image sensing device and configured to direct light into each of the pixels of the solid-state image sensing device. The lens includes at least one convex portion on a surface facing the light receiving surface of the solid-state image sensing device, and the light receiving surface of the solid-state image sensing device is curved so that chief rays of the light directed by the lens are incident on the respective pixels at substantially the same angles.Type: GrantFiled: February 26, 2014Date of Patent: June 28, 2016Assignee: KABUSHIKI KAISHA TOSHIBAInventors: Kazuhiro Nagata, Katsuo Iwata, Ninao Sato, Takayuki Ogasahara
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Patent number: 9257466Abstract: Certain embodiments provide a solid state imaging device including a plurality of pixels. Each of the pixels has a semiconductor layer which has a charge accumulating layer at a front surface thereof and a filter layer provided above a rear surface of the semiconductor layer. Transmissive wavelength bands of the filter layers included in the pixels are different from each other, and thicknesses which a plurality of the semiconductor layers included in the pixels and including a plurality of the charge accumulating layers have are different from each other.Type: GrantFiled: January 24, 2014Date of Patent: February 9, 2016Assignee: Kabushiki Kaisha ToshibaInventors: Kazuhiro Nagata, Takayuki Ogasahara, Katsuo Iwata, Ninao Sato
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Patent number: 9231004Abstract: According to one embodiment, there is provided a solid-state imaging apparatus having an imaging region. In the imaging region, a plurality of pixels are two-dimensionally arranged. The plurality of pixels include a first pixel and a second pixel. The first pixel is arranged near a center of the imaging region. The second pixel is arranged at a position farther away from the center of the imaging region than the first pixel. The first pixel includes a first micro lens having a substantially circular shape as viewed in a plan view. The second pixel includes a second micro lens having a substantially elliptical shape as viewed in a plan view and having an area larger than an area of the first micro lens.Type: GrantFiled: September 12, 2014Date of Patent: January 5, 2016Assignee: Kabushiki Kaisha ToshibaInventors: Kazuhiro Nagata, Ninao Sato, Katsuo Iwata, Takayuki Ogasahawa
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Publication number: 20150264265Abstract: Certain embodiments provide a camera module including a blur correcting lens, a lens holder, a solid state imaging chip, and a distortion correction processing chip. The lens holder is arranged on a mounting substrate and includes the blur correcting lens inside the lens holder. The solid state imaging chip is arranged on the mounting substrate so as to be covered by the lens holder, and includes a logic circuit and a pixel unit having a plurality of pixels. The distortion correction processing chip is arranged on the mounting substrate inside the lens holder, and corrects an image signal output from the solid state imaging chip to correct distortion of the image formed by the image signal.Type: ApplicationFiled: February 18, 2015Publication date: September 17, 2015Applicant: Kabushiki Kaisha ToshibaInventors: Katsuo IWATA, Takayuki Ogasahara, Kazuhiro Nagata, Ninao Sato
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Publication number: 20150264330Abstract: According to one embodiment, a solid state imaging device has a color mixture correction circuit. The color mixture correction circuit is provided with an adjustment circuit. The adjustment circuit adjusts a relationship between a signal level and a wavelength of light of each color component from an image sensor based on a first correction coefficient. The first correction coefficient is a correction coefficient for color mixture correction. A second correction coefficient is a correction coefficient corresponding to a sensitivity difference among color pixels. The adjustment circuit adjusts the signal level of each of the color components based on the second correction coefficient, which has been read according to a distance from center of an image.Type: ApplicationFiled: February 6, 2015Publication date: September 17, 2015Applicant: Kabushiki Kaisha ToshibaInventors: Takayuki OGASAHARA, Katsuo IWATA, Kazuhiro NAGATA, Ninao SATO
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Patent number: 9100560Abstract: Certain embodiments provide a camera module including a housing of a substantially cuboid shape, a light reflecting portion, a plurality of solid-state imaging device, a lens, and an optical spectroscope. The light reflecting portion is arranged inside the housing and reflects the light incident from the opening portion which is formed on a top surface of the housing, in a direction parallel to a longitudinal direction of the housing. Each of a plurality of solid-state imaging devices has a light receiving surface which is provided in the housing vertically to the bottom surface of the housing. The lens is arranged inside the housing such that an optical axis is parallel to the longitudinal direction of the housing. The optical spectroscope is arranged inside the housing and separates the light which has passed through the lens into lights.Type: GrantFiled: January 24, 2014Date of Patent: August 4, 2015Assignee: Kabushiki Kaisha ToshibaInventors: Katsuo Iwata, Takayuki Ogasahara, Kazuhiro Nagata, Ninao Sato
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Publication number: 20150168739Abstract: According to one embodiment, an image stabilizer includes a lens drive controller. The lens drive controller performs a first control and a second control. The lens drive controller controls the driving of a correction lens according to the amount of shake in the first control. In the second control, the lens drive controller controls the driving of the correction lens so that a first area is in focus and a second area is not in focus.Type: ApplicationFiled: August 28, 2014Publication date: June 18, 2015Applicant: Kabushiki Kaisha ToshibaInventors: Takayuki Ogasahara, Katsuo Iwata, Kazuhiro Nagata, Ninao Sato
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Publication number: 20150156431Abstract: According to one embodiment, there is provided a solid-state imaging apparatus having an imaging region. In the imaging region, a plurality of pixels are two-dimensionally arranged. The plurality of pixels include a first pixel and a second pixel. The first pixel is arranged near a center of the imaging region. The second pixel is arranged at a position farther away from the center of the imaging region than the first pixel. The first pixel includes a first micro lens having a substantially circular shape as viewed in a plan view. The second pixel includes a second micro lens having a substantially elliptical shape as viewed in a plan view and having an area larger than an area of the first micro lens.Type: ApplicationFiled: September 12, 2014Publication date: June 4, 2015Applicant: Kabushiki Kaisha ToshibaInventors: Kazuhiro NAGATA, Ninao SATO, Katsuo IWATA, Takayuki OGASAHAWA
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Publication number: 20150146046Abstract: According to one embodiment, a solid-state imaging device includes an image sensor and a resolution reconstruction circuit. The image sensor captures an object image. The resolution reconstruction circuit performs a resolution reconstruction process on the object image. The resolution reconstruction circuit performs a filtering process as the resolution reconstruction process. A filter has a filter property of reducing a modulation transfer function relative to an ideal modulation transfer function in a frequency range of a frequency higher than a frequency set in advance.Type: ApplicationFiled: August 18, 2014Publication date: May 28, 2015Applicant: Kabushiki Kaisha ToshibaInventors: Takayuki OGASAHARA, Ken Tanabe, Katsuo Iwata, Kazuhiro Nagata, Ninao Sato
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Publication number: 20150146034Abstract: According to one embodiment, a solid-state imaging device includes a demosaic processing unit. A pixel block includes a red pixel, a blue pixel, a first green pixel, and a second green pixel. A first green component detected by the first green pixel and a second green component detected by the second green pixel are green components of the same wavelength region. The demosaic processing unit generates image signals of four components. The four components are a red component, a blue component, the first green component, and the second green component.Type: ApplicationFiled: August 14, 2014Publication date: May 28, 2015Applicant: Kabushiki Kaisha ToshibaInventors: Takayuki OGASAHARA, Ken TANABE, Katsuo IWATA, Kazuhiro NAGATA, Ninao SATO
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Publication number: 20150029369Abstract: A camera module includes a solid-state image sensing device having a light receiving surface on which a plurality of pixels are provided, and a lens disposed above the solid-state image sensing device and configured to direct light into each of the pixels of the solid-state image sensing device. The lens includes at least one convex portion on a surface facing the light receiving surface of the solid-state image sensing device, and the light receiving surface of the solid-state image sensing device is curved so that chief rays of the light directed by the lens are incident on the respective pixels at substantially the same angles.Type: ApplicationFiled: February 26, 2014Publication date: January 29, 2015Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Kazuhiro NAGATA, Katsuo IWATA, Ninao SATO, Takayuki OGASAHARA
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Publication number: 20140285688Abstract: According to one embodiment, an optical system of electrical equipment includes an imaging optical system and an optical function complementary processing circuit. The imaging optical system captures light from a subject. The imaging optical system forms a subject image. The electrical equipment includes the imaging optical system, a solid state imaging device, and an image signal processing circuit. The solid state imaging device images the subject image. The solid state imaging device outputs an image signal. The image signal processing circuit executes processing of the image signal. The optical function complementary processing circuit is provided in a processing path between the solid state imaging device and the image signal processing circuit. The optical function complementary processing circuit executes processing for complementing functions of the imaging optical system regarding formation of the subject image.Type: ApplicationFiled: November 26, 2013Publication date: September 25, 2014Applicant: Kabushiki Kaisha ToshibaInventors: Takayuki OGASAHARA, Ninao Sato, Kazuhiro Nagata, Katsuo Iwata
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Publication number: 20140267844Abstract: Certain embodiments provide a camera module including a housing of a substantially cuboid shape, a light reflecting portion, a plurality of solid-state imaging device, a lens, and an optical spectroscope. The light reflecting portion is arranged inside the housing and reflects the light incident from the opening portion which is formed on a top surface of the housing, in a direction parallel to a longitudinal direction of the housing. Each of a plurality of solid-state imaging devices has a light receiving surface which is provided in the housing vertically to the bottom surface of the housing. The lens is arranged inside the housing such that an optical axis is parallel to the longitudinal direction of the housing. The optical spectroscope is arranged inside the housing and separates the light which has passed through the lens into lights.Type: ApplicationFiled: January 24, 2014Publication date: September 18, 2014Applicant: Kabushiki Kaisha ToshibaInventors: Katsuo Iwata, Takayuki Ogasahara, Kazuhiro Nagata, Ninao Sato
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Publication number: 20140264690Abstract: Certain embodiments provide a solid state imaging device including a plurality of pixels. Each of the pixels has a semiconductor layer which has a charge accumulating layer at a front surface thereof and a filter layer provided above a rear surface of the semiconductor layer. Transmissive wavelength bands of the filter layers included in the pixels are different from each other, and thicknesses which a plurality of the semiconductor layers included in the pixels and including a plurality of the charge accumulating layers have are different from each other.Type: ApplicationFiled: January 24, 2014Publication date: September 18, 2014Applicant: Kabushiki Kaisha ToshibaInventors: Kazuhiro NAGATA, Takayuki Ogasahara, Katsuo Iwata, Ninao Sato
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Patent number: 7888778Abstract: A semiconductor device includes a semiconductor substrate having a through hole. An active layer is formed on a first surface of the semiconductor substrate. An inner wall surface of the through hole, a bottom surface of the through hole closed by the active layer and a second surface of the semiconductor substrate are covered with an insulating layer. A first opening is formed in the insulating layer which is present on the bottom surface of the through hole. A second opening is formed in the insulating layer which is present on the second surface of the semiconductor substrate. A first wiring layer is formed from within the through hole onto the second surface of the semiconductor substrate. A second wiring layer is formed to connect to the second surface through the second opening.Type: GrantFiled: September 9, 2008Date of Patent: February 15, 2011Assignee: Kabushiki Kaisha ToshibaInventors: Kazumasa Tanida, Masahiro Sekiguchi, Ninao Sato, Kenji Takahashi
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Publication number: 20090065906Abstract: A semiconductor device includes a semiconductor substrate having a through hole. An active layer is formed on a first surface of the semiconductor substrate. An inner wall surface of the through hole, a bottom surface of the through hole closed by the active layer and a second surface of the semiconductor substrate are covered with an insulating layer. A first opening is formed in the insulating layer which is present on the bottom surface of the through hole. A second opening is formed in the insulating layer which is present on the second surface of the semiconductor substrate. A first wiring layer is formed from within the through hole onto the second surface of the semiconductor substrate. A second wiring layer is formed to connect to the second surface through the second opening.Type: ApplicationFiled: September 9, 2008Publication date: March 12, 2009Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Kazumasa Tanida, Masahiro Sekiguchi, Ninao Sato, Kenji Takahashi
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Publication number: 20070235882Abstract: A semiconductor device includes a semiconductor substrate with an electrode pad on a main surface of the semiconductor substrate; a first penetrating electrode which includes a through hole formed through the semiconductor substrate in the thickness direction so as to reach a metallic bump formed on the electrode pad, an insulating resin formed to fill the through hole in and a conductor formed in the through hole with insulated from the semiconductor substrate by the insulating resin and electrically to connect the electrode pad and the rear surface of the semiconductor wafer; a semiconductor chip mounted on the rear surface of the semiconductor wafer so that a rear surface of the semiconductor chip is faced to the rear surface of the semiconductor wafer; and a wiring to electrically connect the first penetrating electrode and an electrode formed on the semiconductor chip.Type: ApplicationFiled: April 9, 2007Publication date: October 11, 2007Inventors: Masahiro Sekiguchi, Kenji Takahashi, Hideo Numata, Tatsuhiko Shirakawa, Ninao Sato