Patents by Inventor Ninao Sato

Ninao Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220246665
    Abstract: A yield drop of a semiconductor package including a via is reduced. The semiconductor package includes a solid-state imaging element, a circuit layer, a wiring layer, and a support substrate. The solid-state imaging element in the semiconductor package generates image data. A signal processing circuit that performs predetermined signal processing on the image data is disposed in the circuit layer. An output side via the other end of which is connected to an external terminal penetrates the support substrate. The wiring layer is disposed between the support substrate and the circuit layer. A signal line that connects the signal processing circuit and one end of the output side via is wired in the wiring layer.
    Type: Application
    Filed: May 22, 2020
    Publication date: August 4, 2022
    Inventors: HIKARU OHIRA, NINAO SATO, YIOCHIRO FUJINAGA, ATSUSHI TSUKADA
  • Publication number: 20210233949
    Abstract: Deformation of a semiconductor chip is to be prevented in a semiconductor device in which a heat releasing plate and a circuit board are disposed. The semiconductor device includes the semiconductor chip, the circuit board, the heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.
    Type: Application
    Filed: June 21, 2019
    Publication date: July 29, 2021
    Inventors: DAISUKE CHINO, HIROYUKI SHIGETA, SHIGEKAZU ISHII, KOYO HOSOKAWA, HIROHISA YASUKAWA, MITSUHITO KANATAKE, KOSUKE HAREYAMA, YUTAKA OOTAKI, KIYOHISA SAKAI, ATSUSHI TSUKADA, HIROTAKA KOBAYASHI, NINAO SATO, YUKI YAMANE
  • Patent number: 9380195
    Abstract: A camera module includes a solid-state image sensing device having a light receiving surface on which a plurality of pixels are provided, and a lens disposed above the solid-state image sensing device and configured to direct light into each of the pixels of the solid-state image sensing device. The lens includes at least one convex portion on a surface facing the light receiving surface of the solid-state image sensing device, and the light receiving surface of the solid-state image sensing device is curved so that chief rays of the light directed by the lens are incident on the respective pixels at substantially the same angles.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: June 28, 2016
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kazuhiro Nagata, Katsuo Iwata, Ninao Sato, Takayuki Ogasahara
  • Patent number: 9257466
    Abstract: Certain embodiments provide a solid state imaging device including a plurality of pixels. Each of the pixels has a semiconductor layer which has a charge accumulating layer at a front surface thereof and a filter layer provided above a rear surface of the semiconductor layer. Transmissive wavelength bands of the filter layers included in the pixels are different from each other, and thicknesses which a plurality of the semiconductor layers included in the pixels and including a plurality of the charge accumulating layers have are different from each other.
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: February 9, 2016
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kazuhiro Nagata, Takayuki Ogasahara, Katsuo Iwata, Ninao Sato
  • Patent number: 9231004
    Abstract: According to one embodiment, there is provided a solid-state imaging apparatus having an imaging region. In the imaging region, a plurality of pixels are two-dimensionally arranged. The plurality of pixels include a first pixel and a second pixel. The first pixel is arranged near a center of the imaging region. The second pixel is arranged at a position farther away from the center of the imaging region than the first pixel. The first pixel includes a first micro lens having a substantially circular shape as viewed in a plan view. The second pixel includes a second micro lens having a substantially elliptical shape as viewed in a plan view and having an area larger than an area of the first micro lens.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: January 5, 2016
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kazuhiro Nagata, Ninao Sato, Katsuo Iwata, Takayuki Ogasahawa
  • Publication number: 20150264265
    Abstract: Certain embodiments provide a camera module including a blur correcting lens, a lens holder, a solid state imaging chip, and a distortion correction processing chip. The lens holder is arranged on a mounting substrate and includes the blur correcting lens inside the lens holder. The solid state imaging chip is arranged on the mounting substrate so as to be covered by the lens holder, and includes a logic circuit and a pixel unit having a plurality of pixels. The distortion correction processing chip is arranged on the mounting substrate inside the lens holder, and corrects an image signal output from the solid state imaging chip to correct distortion of the image formed by the image signal.
    Type: Application
    Filed: February 18, 2015
    Publication date: September 17, 2015
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Katsuo IWATA, Takayuki Ogasahara, Kazuhiro Nagata, Ninao Sato
  • Publication number: 20150264330
    Abstract: According to one embodiment, a solid state imaging device has a color mixture correction circuit. The color mixture correction circuit is provided with an adjustment circuit. The adjustment circuit adjusts a relationship between a signal level and a wavelength of light of each color component from an image sensor based on a first correction coefficient. The first correction coefficient is a correction coefficient for color mixture correction. A second correction coefficient is a correction coefficient corresponding to a sensitivity difference among color pixels. The adjustment circuit adjusts the signal level of each of the color components based on the second correction coefficient, which has been read according to a distance from center of an image.
    Type: Application
    Filed: February 6, 2015
    Publication date: September 17, 2015
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Takayuki OGASAHARA, Katsuo IWATA, Kazuhiro NAGATA, Ninao SATO
  • Patent number: 9100560
    Abstract: Certain embodiments provide a camera module including a housing of a substantially cuboid shape, a light reflecting portion, a plurality of solid-state imaging device, a lens, and an optical spectroscope. The light reflecting portion is arranged inside the housing and reflects the light incident from the opening portion which is formed on a top surface of the housing, in a direction parallel to a longitudinal direction of the housing. Each of a plurality of solid-state imaging devices has a light receiving surface which is provided in the housing vertically to the bottom surface of the housing. The lens is arranged inside the housing such that an optical axis is parallel to the longitudinal direction of the housing. The optical spectroscope is arranged inside the housing and separates the light which has passed through the lens into lights.
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: August 4, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Katsuo Iwata, Takayuki Ogasahara, Kazuhiro Nagata, Ninao Sato
  • Publication number: 20150168739
    Abstract: According to one embodiment, an image stabilizer includes a lens drive controller. The lens drive controller performs a first control and a second control. The lens drive controller controls the driving of a correction lens according to the amount of shake in the first control. In the second control, the lens drive controller controls the driving of the correction lens so that a first area is in focus and a second area is not in focus.
    Type: Application
    Filed: August 28, 2014
    Publication date: June 18, 2015
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Takayuki Ogasahara, Katsuo Iwata, Kazuhiro Nagata, Ninao Sato
  • Publication number: 20150156431
    Abstract: According to one embodiment, there is provided a solid-state imaging apparatus having an imaging region. In the imaging region, a plurality of pixels are two-dimensionally arranged. The plurality of pixels include a first pixel and a second pixel. The first pixel is arranged near a center of the imaging region. The second pixel is arranged at a position farther away from the center of the imaging region than the first pixel. The first pixel includes a first micro lens having a substantially circular shape as viewed in a plan view. The second pixel includes a second micro lens having a substantially elliptical shape as viewed in a plan view and having an area larger than an area of the first micro lens.
    Type: Application
    Filed: September 12, 2014
    Publication date: June 4, 2015
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Kazuhiro NAGATA, Ninao SATO, Katsuo IWATA, Takayuki OGASAHAWA
  • Publication number: 20150146046
    Abstract: According to one embodiment, a solid-state imaging device includes an image sensor and a resolution reconstruction circuit. The image sensor captures an object image. The resolution reconstruction circuit performs a resolution reconstruction process on the object image. The resolution reconstruction circuit performs a filtering process as the resolution reconstruction process. A filter has a filter property of reducing a modulation transfer function relative to an ideal modulation transfer function in a frequency range of a frequency higher than a frequency set in advance.
    Type: Application
    Filed: August 18, 2014
    Publication date: May 28, 2015
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Takayuki OGASAHARA, Ken Tanabe, Katsuo Iwata, Kazuhiro Nagata, Ninao Sato
  • Publication number: 20150146034
    Abstract: According to one embodiment, a solid-state imaging device includes a demosaic processing unit. A pixel block includes a red pixel, a blue pixel, a first green pixel, and a second green pixel. A first green component detected by the first green pixel and a second green component detected by the second green pixel are green components of the same wavelength region. The demosaic processing unit generates image signals of four components. The four components are a red component, a blue component, the first green component, and the second green component.
    Type: Application
    Filed: August 14, 2014
    Publication date: May 28, 2015
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Takayuki OGASAHARA, Ken TANABE, Katsuo IWATA, Kazuhiro NAGATA, Ninao SATO
  • Publication number: 20150029369
    Abstract: A camera module includes a solid-state image sensing device having a light receiving surface on which a plurality of pixels are provided, and a lens disposed above the solid-state image sensing device and configured to direct light into each of the pixels of the solid-state image sensing device. The lens includes at least one convex portion on a surface facing the light receiving surface of the solid-state image sensing device, and the light receiving surface of the solid-state image sensing device is curved so that chief rays of the light directed by the lens are incident on the respective pixels at substantially the same angles.
    Type: Application
    Filed: February 26, 2014
    Publication date: January 29, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kazuhiro NAGATA, Katsuo IWATA, Ninao SATO, Takayuki OGASAHARA
  • Publication number: 20140285688
    Abstract: According to one embodiment, an optical system of electrical equipment includes an imaging optical system and an optical function complementary processing circuit. The imaging optical system captures light from a subject. The imaging optical system forms a subject image. The electrical equipment includes the imaging optical system, a solid state imaging device, and an image signal processing circuit. The solid state imaging device images the subject image. The solid state imaging device outputs an image signal. The image signal processing circuit executes processing of the image signal. The optical function complementary processing circuit is provided in a processing path between the solid state imaging device and the image signal processing circuit. The optical function complementary processing circuit executes processing for complementing functions of the imaging optical system regarding formation of the subject image.
    Type: Application
    Filed: November 26, 2013
    Publication date: September 25, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Takayuki OGASAHARA, Ninao Sato, Kazuhiro Nagata, Katsuo Iwata
  • Publication number: 20140267844
    Abstract: Certain embodiments provide a camera module including a housing of a substantially cuboid shape, a light reflecting portion, a plurality of solid-state imaging device, a lens, and an optical spectroscope. The light reflecting portion is arranged inside the housing and reflects the light incident from the opening portion which is formed on a top surface of the housing, in a direction parallel to a longitudinal direction of the housing. Each of a plurality of solid-state imaging devices has a light receiving surface which is provided in the housing vertically to the bottom surface of the housing. The lens is arranged inside the housing such that an optical axis is parallel to the longitudinal direction of the housing. The optical spectroscope is arranged inside the housing and separates the light which has passed through the lens into lights.
    Type: Application
    Filed: January 24, 2014
    Publication date: September 18, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Katsuo Iwata, Takayuki Ogasahara, Kazuhiro Nagata, Ninao Sato
  • Publication number: 20140264690
    Abstract: Certain embodiments provide a solid state imaging device including a plurality of pixels. Each of the pixels has a semiconductor layer which has a charge accumulating layer at a front surface thereof and a filter layer provided above a rear surface of the semiconductor layer. Transmissive wavelength bands of the filter layers included in the pixels are different from each other, and thicknesses which a plurality of the semiconductor layers included in the pixels and including a plurality of the charge accumulating layers have are different from each other.
    Type: Application
    Filed: January 24, 2014
    Publication date: September 18, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Kazuhiro NAGATA, Takayuki Ogasahara, Katsuo Iwata, Ninao Sato
  • Patent number: 7888778
    Abstract: A semiconductor device includes a semiconductor substrate having a through hole. An active layer is formed on a first surface of the semiconductor substrate. An inner wall surface of the through hole, a bottom surface of the through hole closed by the active layer and a second surface of the semiconductor substrate are covered with an insulating layer. A first opening is formed in the insulating layer which is present on the bottom surface of the through hole. A second opening is formed in the insulating layer which is present on the second surface of the semiconductor substrate. A first wiring layer is formed from within the through hole onto the second surface of the semiconductor substrate. A second wiring layer is formed to connect to the second surface through the second opening.
    Type: Grant
    Filed: September 9, 2008
    Date of Patent: February 15, 2011
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kazumasa Tanida, Masahiro Sekiguchi, Ninao Sato, Kenji Takahashi
  • Publication number: 20090065906
    Abstract: A semiconductor device includes a semiconductor substrate having a through hole. An active layer is formed on a first surface of the semiconductor substrate. An inner wall surface of the through hole, a bottom surface of the through hole closed by the active layer and a second surface of the semiconductor substrate are covered with an insulating layer. A first opening is formed in the insulating layer which is present on the bottom surface of the through hole. A second opening is formed in the insulating layer which is present on the second surface of the semiconductor substrate. A first wiring layer is formed from within the through hole onto the second surface of the semiconductor substrate. A second wiring layer is formed to connect to the second surface through the second opening.
    Type: Application
    Filed: September 9, 2008
    Publication date: March 12, 2009
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kazumasa Tanida, Masahiro Sekiguchi, Ninao Sato, Kenji Takahashi
  • Publication number: 20070235882
    Abstract: A semiconductor device includes a semiconductor substrate with an electrode pad on a main surface of the semiconductor substrate; a first penetrating electrode which includes a through hole formed through the semiconductor substrate in the thickness direction so as to reach a metallic bump formed on the electrode pad, an insulating resin formed to fill the through hole in and a conductor formed in the through hole with insulated from the semiconductor substrate by the insulating resin and electrically to connect the electrode pad and the rear surface of the semiconductor wafer; a semiconductor chip mounted on the rear surface of the semiconductor wafer so that a rear surface of the semiconductor chip is faced to the rear surface of the semiconductor wafer; and a wiring to electrically connect the first penetrating electrode and an electrode formed on the semiconductor chip.
    Type: Application
    Filed: April 9, 2007
    Publication date: October 11, 2007
    Inventors: Masahiro Sekiguchi, Kenji Takahashi, Hideo Numata, Tatsuhiko Shirakawa, Ninao Sato
  • Patent number: 7138297
    Abstract: A semiconductor chip is formed by dividing a semiconductor wafer by use of the laser dicing technique. The semiconductor chip has a laser dicing region on the side surface thereof. A dummy wiring layer is formed along the laser dicing region on the surface layer of the laser dicing region. A laser beam is applied to the dummy wiring layer to divide the semiconductor wafer.
    Type: Grant
    Filed: August 16, 2004
    Date of Patent: November 21, 2006
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Toshitsune Iijima, Ninao Sato