Abstract: Disclosed are a display substrate and a manufacturing method therefor, and a display device. The display substrate comprises: a substrate base, and an active layer, a gate insulating layer, a first metal film layer, an interlayer insulating layer, a second metal film layer, and a passivation layer stacked in sequence on the substrate base. The first metal film layer comprises a pattern of a gate and a gate line. The second metal film layer comprises a pattern of a source/drain and a data line. The gate line and the data line are partially arranged opposite to each other. An oxide metal layer is provided on the surface of the side of the region of the gate line opposite to the data line facing the data line.

Abstract: A display substrate including a drive-circuit layer and a light-emitting structure layer, a preparation method thereof, and a display device, the light-emitting structure layer includes an anode, a pixel definition layer, an organic light-emitting layer and a cathode, and an auxiliary electrode and an organic light-emitting block, arranged sequentially, the pixel definition layer includes an anode opening exposing the anode and an electrode opening exposing the auxiliary electrode, the organic light-emitting block is separated from the organic light-emitting layer, the auxiliary electrode includes the first, second and third auxiliary electrodes arranged sequentially; the cathode includes a first horizontal lapping part lapping with the first auxiliary electrode and a second sidewall lapping part lapping with the second auxiliary electrode, the thickness of the second sidewall lapping part in the direction parallel to the substrate is greater than that of the first horizontal lapping part in the direction per

Abstract: An antenna module is disposed to an electronic device includes a fixed member, a rotating component, a reflector, a director, and an antenna unit. The electronic device includes a first body and a second body. The first body has a first surface and a second surface. The fixed member is disposed to the first body fixedly. The rotating component is connected to the fixed member rotatably. The reflector and the director are disposed to the rotating component. The antenna unit is disposed to the first body and between the reflector and the director. When the first body and the second body rotate relative to each other, the reflector is located between the antenna unit and one of the first surface and the second surface, and the director is located between the antenna unit and another one of the first surface and the second surface.

Abstract: Semiconductor structures and the manufacturing method thereof are disclosed. An exemplary semiconductor structure according to the present disclosure includes a substrate having a p-type well or an n-type well, a first base portion over the p-type well, a second base portion over the n-type well, a first plurality of channel members over the first base portion, a second plurality of channel members over the second base portion, an isolation feature disposed between the first base portion and the second base portion, and a deep isolation structure in the substrate disposed below the isolation feature.

Abstract: Semiconductor devices and methods of forming the same are provided. In an embodiment, an exemplary semiconductor device includes a vertical stack of channel members disposed over a substrate, a gate structure wrapping around each channel member of the vertical stack of channel members, a source/drain feature electrically coupled to the vertical stack of channel members, a silicide layer formed on more than one side of the source/drain feature, and a source/drain contact electrically coupled to the source/drain feature via the silicide layer.

Abstract: A chamber liner for a semiconductor process chamber. The chamber liner includes an outer sidewall having a first circumference, and an inner sidewall have a second circumference that is less than the first circumference. The chamber liner also includes a chamber liner fence that is positioned between the outer sidewall and the inner sidewall. The chamber liner fence includes a first zone having one or more first zone openings, a second zone having one or more second zone openings, and a third zone having one or more third zone opening. The chamber liner further includes a split door positioned in the outer sidewall. Each of the first, second, and third zones have different widths, with the width of the third zone opening less than the width of the second zone opening, and the second zone opening less than or equal to the width of the first zone opening.

Abstract: Some implementations of the disclosure are directed to a method, comprising: receiving a sheet of graphite comprising a first surface and a second surface opposite the first surface; and perforating the sheet in a first plurality of locations from the first surface through the second surface to form a first plurality of perforations through the sheet and a first plurality of protrusions of the graphite oriented outward from the second surface, the first plurality of protrusions configured to conduct heat away from a plane of the sheet. Further implementations comprise perforating the sheet in a second plurality of locations from the second surface through the first surface to form a second plurality of perforations through the sheet and a second plurality of protrusions of graphite material oriented outward from the first surface, wherein the second plurality of protrusions are configured to conduct heat away from the plane of the sheet.

Abstract: Methods, systems, and apparatus, including computer programs stored on a computer-readable storage medium, for peer-to-peer location-based messaging. In some implementations, a mobile device selectively displays displayable messages associated with beacons corresponding to specific locations that the mobile device visits. The mobile device can extract identifiers from wireless messages from beacons and determine whether to display a message corresponding to a beacon based on filter parameters of a user and data indicating characteristics of a property where a beacon is located. The displayable messages corresponding to beacons can be messages users who associated with the beacons have previously designated for presentation upon detection of the beacons. The mobile device can display the displayable message for a beacon while the mobile device is a detection range to receive the wireless message from the beacon.

Abstract: High reliability leadfree solder alloys for harsh service conditions are disclosed. In some embodiments, a solder alloy comprises 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a component comprising: a main ceramic body, and a side surface having disposed thereon an electrode and a thermal pad; a copper substrate; and a solder alloy electrically coupling the component and the copper substrate, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a light-emitting diode (LED) component; a Metal Core Printed Circuit Board (MCPCB); and a solder alloy electrically coupling the LED component and the MCPCB, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn.

Abstract: Some implementations of the disclosure relate to a lead-free solder paste with mixed solder powders that is particularly suitable for high temperature soldering applications involving multiple board-level reflow operations. In one implementation, the solder paste consists of 10 wt % to 90 wt % of a first solder alloy powder, the first solder alloy powder consisting of an SnSbCuAg solder alloy that has a wt % ratio of Sn:Sb of 0.75 to 1.1; 10 wt % to 90 wt % of a second solder alloy powder, the second solder alloy powder consisting of an Sn solder alloy including at least 80 wt % of Sn; and a remainder of flux.

Abstract: Solder pastes comprise a high temperature solder powder, a low temperature solder powder and flux. The melting temperature of the low temperature solder powder is lower than that of the high temperature solder powder. The high temperature solder powder and the low temperature solder powder are both capable of wetting upon heating.

Abstract: Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.

Abstract: Methods and systems for obtaining serviceable areas for a robotic system in a metropolitan area are described. A computing device obtains information about places where (i) the system can route to and from in the area and/or (ii) the system can stop in the area. The computing device uses the information to generate clusters of places where the robotic system can route or stop in the metropolitan area. The computing device creates a geometric shape for each cluster, wherein each shape which has a boundary defined by outermost places contained in the cluster. The computing device uses the geometric shapes to define the serviceable areas for the robotic system within the metropolitan area. The computing device uses the serviceable areas to generate a map displaying at least one geographic area representing a portion of the metropolitan area where a concentrated number of the places exist.

Abstract: Methods and systems that use a phantom vehicle to help generate a planned path for a real-world vehicle are described. The system will identify a starting point and a destination for a trip of the real-world vehicle. The system will select, from the data store of vehicle profiles, a phantom vehicle having an associated motion planning system that corresponds to a system that is deployed on the real-world vehicle. The system will use a high definition map to generate a planned route for the real-world vehicle from the starting point to the destination in the map. The system will run a simulation in which the phantom vehicle moves along the planned route in the map. The system will then output a record of the simulation to a user of the real world-vehicle or to a system of the real-world vehicle.

Abstract: Methods and systems for generating a planned path for a vehicle are disclosed. Upon receiving a trip service request, a processor will access a data store containing multiple candidate motion planning systems, each of which is associated with at least one vehicle or fleet. The processor will identify a starting point and a destination for the trip service request, and it will use an identifier for the vehicle or its fleet to select, from the candidate systems, a motion planning system. The processor will use the functions of the selected motion planning system to generate candidate trajectories for the first vehicle from the starting point to the destination in a high definition map. The processor will select a planned route from the candidate trajectories, and it will output trip instructions to cause the vehicle to move along the planned route.

Abstract: Methods and systems for estimating a time of arrival for a vehicle at a destination are disclosed. The system will access an adjacency graph comprising nodes and edges. Each node is associated with a unique location in a geographic area in which the vehicle is traveling. Each edge connects two of the nodes and is associated with an estimated travel time between the two connected nodes. The system will select, from the locations in adjacency graph, a first location that is near the vehicle and a second location that is near the destination. The location and destination are each associated with nodes in adjacency graph. The system will calculate a shortest path along the edges in the adjacency graph from the location and destination nodes, and it will calculate an estimated time of arrival for the vehicle as a function of the estimated travel times along the shortest path.

Abstract: Systems and methods for managing permissions and authorizing access to a service supported by a computing device. The methods comprise by a computing device: intercepting a request to access the service sent along with a certificate including a first tenant identifier (the first tenant identifier identifying a first business entity other than a second business entity providing the service); using the first tenant identifier to obtain permission information from a datastore (the permission information specifying which resources of a plurality of resources can be returned in response to requests from the first business entity); generating a web authentication token including the first tenant identifier and the permission information; and initiating operations of the service in response to a validation of the web authentication token.

Abstract: Some implementations of the disclosure are directed to a thermal interface material. In some implementations, a method comprises: applying a solder paste between a surface of a heat generating device and a surface of a heat transferring device to form an assembly; and reflow soldering the assembly to form a solder composite, wherein the solder composite provides a thermal interface between the heat generating device and the heat transferring device, wherein the solder paste comprises: a solder powder; particles having a higher melting temperature than a soldering temperature of the solder paste, wherein the solder paste has a volume ratio of solder powder to high melting temperature particles between 5:1 and 1:1.5; and flux.

Abstract: Some implementations of the disclosure are directed to a method, comprising: receiving a sheet of graphite comprising a first surface and a second surface opposite the first surface; and perforating the sheet in a first plurality of locations from the first surface through the second surface to form a first plurality of perforations through the sheet and a first plurality of protrusions of the graphite oriented outward from the second surface, the first plurality of protrusions configured to conduct heat away from a plane of the sheet. Further implementations comprise perforating the sheet in a second plurality of locations from the second surface through the first surface to form a second plurality of perforations through the sheet and a second plurality of protrusions of graphite material oriented outward from the first surface, wherein the second plurality of protrusions are configured to conduct heat away from the plane of the sheet.

Abstract: Some implementations of the disclosure are directed to low melting temperature (e.g., liquidus temperature below 210° C.) SnIn solder alloys. A SnIn solder alloy may consist of: 8 to 20 wt % In; greater than 0 wt % to 4 wt % Ag; optionally, one or more of greater than 0 wt % to 5 wt % Sb, greater than 0 wt % to 3 wt % Cu, greater than 0 wt % to 2.5 wt % Zn, greater than 0 wt % to 1.5 wt % Ni, greater than 0 wt % to 1.5 wt % Co, greater than 0 wt % to 1.5 wt % Ge, greater than 0 wt % to 1.5 wt % P, and greater than 0 wt % to 1.5 wt % Mn; and a remainder of Sn.