Patents by Inventor Ning-Chun HSU

Ning-Chun HSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method, system for utilizing a probe card, and the probe card
    Patent number: 10352966
    Abstract: A method for utilizing a probe card includes steps as follows. Providing a probe card having three alignment marks on a reference plane of a circuit board; moving the circuit board to be oriented to a wafer-loading plane of a wafer stage with the reference plane; determining whether a geometric plane defined by the alignment marks is parallel to the wafer-loading plane; and when the geometric plane is not parallel to the wafer-loading plane, adjusting a levelness of the circuit board until the reference plane is parallel to the wafer-loading plane.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: July 16, 2019
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chang-Ming Liu, Chien-Hao Lin, Shih-Hua Hsu, Ning-Chun Hsu
  • METHOD, SYSTEM FOR UTILIZING A PROBE CARD, AND THE PROBE CARD
    Publication number: 20170276701
    Abstract: A method for utilizing a probe card includes steps as follows. Providing a probe card having three alignment marks on a reference plane of a circuit board; moving the circuit board to be oriented to a wafer-loading plane of a wafer stage with the reference plane; determining whether a geometric plane defined by the alignment marks is parallel to the wafer-loading plane; and when the geometric plane is not parallel to the wafer-loading plane, adjusting a levelness of the circuit board until the reference plane is parallel to the wafer-loading plane.
    Type: Application
    Filed: September 1, 2016
    Publication date: September 28, 2017
    Inventors: Chang-Ming LIU, Chien-Hao LIN, Shih-Hua HSU, Ning-Chun HSU