Patents by Inventor Ning Hou
Ning Hou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200154559Abstract: Manufacturing a rigid-flex circuit board includes providing an inner flexible circuit board and a first flexible metal clad laminate, laminating the first flexible metal clad laminate on a surface of the inner flexible circuit board through a first adhesive film, causing the first copper layer to form a third conductive circuit layer, partially covering the metal protective layer exposed by the third conductive circuit layer, removing the metal protective layer exposed by the third conductive circuit layer and the covered area, providing a second copper foil, laminating the second copper foil on a surface of the third conductive circuit layer through a second adhesive film, removing the metal protective layer at the opening area, and causing the second copper foil to form a fifth conductive circuit layer. The first flexible metal clad laminate includes a second base material layer, a metal protective layer, and a first copper layer.Type: ApplicationFiled: December 13, 2019Publication date: May 14, 2020Inventors: NING HOU, WEI-XIANG LI
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Patent number: 10524057Abstract: A flexible printed circuit board used in a loudspeaker as a dome and a holder supporting the dome has a top surface and a bottom surface opposite to the top surface. The flexible printed circuit board comprises a dome portion and a supporting portion surrounding the dome portion. The dome portion is formed by the top surface being depressed from the top surface to the bottom surface and the bottom surface projecting from the top surface to the bottom surface; and a supporting portion surrounds the dome portion.Type: GrantFiled: July 28, 2017Date of Patent: December 31, 2019Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.Inventors: Biao Li, Ning Hou, Hao-Wen Zhong, Xiao-Wei Kang
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Publication number: 20190320550Abstract: A method for manufacturing the ultrathin heat dissipation structure includes providing a copper clad sheet, the copper clad sheet comprising an insulation layer and a copper clad layer; stamping the copper clad sheet to form a plurality of containing grooves and a plurality of ribs around each of the plurality of containing grooves, the cooper clad layer is used as an inner surface of the containing groove and the insulation layer is then an outer surface of the containing groove; providing bond blocks on each of the plurality of ribs; infilling phase-change material into the containing grooves of the copper clad sheet; providing a cover, pressing the cover to the bond blocks, the cover is fixed with the copper clad sheet by the bond blocks, the cover seals the containing grooves, and the phase-change material is received in the containing grooves; and solidifying the bond blocks.Type: ApplicationFiled: June 28, 2019Publication date: October 17, 2019Inventors: NING HOU, CONG LEI, BIAO LI, MING-JAAN HO
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Patent number: 10448540Abstract: An ultrathin heat dissipation structure includes a copper clad sheet, a cover, a number of bond blocks, and a phase-change material. The copper clad sheet is given containing grooves and a number of ribs round each containing groove. The containing grooves are formed by stamping. The copper clad sheet includes an insulation layer. The copper clad layer is inner surface of the containing groove. The bond blocks are arranged on the ribs and cover is pressed to the stamped copper clad sheet and secured using the bond blocks. The containing grooves form sealing cavities and the phase-change material in the sealed cavity gathers and transfers out any heat generated by components.Type: GrantFiled: June 24, 2016Date of Patent: October 15, 2019Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., GARUDA TECHNOLOGY CO., LTD.Inventors: Ning Hou, Cong Lei, Biao Li, Ming-Jaan Ho
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Publication number: 20190281392Abstract: A method for manufacturing a flexible printed circuit board comprising: providing a first flexible precursor board having a layer; adhering a first covering layer with a lower opening, a portion of the circuit layer exposed; adhering a second covering layer with an upper opening to the first covering layer, the upper opening being formed in the lower opening, and a portion of circuit layer being exposed to obtain a second flexible precursor board; providing an upper mound having a protruding portion and a lower mound having a recessed portion, moving the second flexible precursor board between the upper mound and the lower mound, the upper opening being positioned away from the protruding portion and the recessed portion, pressing the upper mound to the lower mound to press the protruding portion into the recessed portion; removing the upper mound and the lower mound to get the flexible printed circuit board.Type: ApplicationFiled: May 30, 2019Publication date: September 12, 2019Inventors: BIAO LI, NING HOU, HAO-WEN ZHONG, XIAO-WEI KANG
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Patent number: 10383223Abstract: A circuit board film-plated against corrosion of conductive traces comprises a substrate, a conductive circuit layer attached to the substrate, a plating film attached to outer surface of the conductive circuit layer, and a covering film. Each plating film comprises a top outer surface and a side surface. The circuit board defines at least one through hole. Each through hole passes through substrate, conductive circuit layer, and the plating film. The covering film covers the conductive circuit layer, the side surfaces, and the through holes. The conductive circuit layer and the side surfaces of the plating films are sealed against the atmosphere and cannot be corroded. A method for making the circuit board is also provided.Type: GrantFiled: November 13, 2018Date of Patent: August 13, 2019Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.Inventors: Ning Hou, Si-Hong He, Biao Li, Mei-Hua Huang
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Patent number: 10356909Abstract: An embedded circuit board includes a flexible printed circuit board, a component, a conductive material, two adhesive layers, and two substrates. The flexible printed circuit board defines at least one cavity passing through the flexible printed circuit board. The flexible printed circuit board includes a base layer, a first conductive circuit layer formed on at least one surface of the base layer, and a protective layer formed on both sides of the base layer. The base layer and the first conductive circuit layer protrude into the cavity. The component is received within the cavity and abuts against the first conductive circuit layer protruding into the cavity. The conductive material is applied in a gap between the component and the first conductive circuit layer. The two substrates are adhered to the flexible printed circuit board by the two adhesive layers.Type: GrantFiled: September 29, 2018Date of Patent: July 16, 2019Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.Inventors: Ning Hou, Biao Li, Hao-Wen Zhong, Ming-Hui Wang
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Publication number: 20190098754Abstract: A circuit board film-plated against corrosion of conductive traces comprises a substrate, a conductive circuit layer attached to the substrate, a plating film attached to outer surface of the conductive circuit layer, and a covering film. Each plating film comprises a top outer surface and a side surface. The circuit board defines at least one through hole. Each through hole passes through substrate, conductive circuit layer, and the plating film. The covering film covers the conductive circuit layer, the side surfaces, and the through holes. The conductive circuit layer and the side surfaces of the plating films are sealed against the atmosphere and cannot be corroded. A method for making the circuit board is also provided.Type: ApplicationFiled: November 13, 2018Publication date: March 28, 2019Inventors: NING HOU, SI-HONG HE, BIAO LI, MEI-HUA HUANG
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Patent number: 10187984Abstract: A circuit board film-plated against corrosion of conductive traces comprises a substrate, at least one conductive circuit layer attached to the substrate, at least one plating film attached to a surface of the conductive circuit layer away from the substrate, and a covering film. Each of the at least one plating film comprises a surface away from the conductive circuit layer, and at least one side surface. The circuit board defines at least one through hole. Each of the at least one through hole passes through substrate, conductive circuit layer, and the plating film. The covering film covers the conductive circuit layer, the side surface of the plating film, and the through hole. The film-covered conductive circuit layer and the film-covered side surface of the plating film cannot be corroded. A method for making the circuit board is also provided.Type: GrantFiled: November 20, 2017Date of Patent: January 22, 2019Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) CoInventors: Ning Hou, Si-Hong He, Biao Li, Mei-Hua Huang
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Publication number: 20190007774Abstract: A flexible printed circuit board used in a loudspeaker as a dome and a holder supporting the dome has a top surface and a bottom surface opposite to the top surface. The flexible printed circuit board comprises a dome portion and a supporting portion surrounding the dome portion. The dome portion is formed by the top surface being depressed from the top surface to the bottom surface and the bottom surface projecting from the top surface to the bottom surface; and a supporting portion surrounds the dome portion.Type: ApplicationFiled: July 28, 2017Publication date: January 3, 2019Inventors: BIAO LI, NING HOU, HAO-WEN ZHONG, XIAO-WEI KANG
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Publication number: 20170325356Abstract: An ultrathin heat dissipation structure includes a copper clad sheet, a cover, a number of bond blocks, and a phase-change material. The copper clad sheet is given containing grooves and a number of ribs round each containing groove. The containing grooves are formed by stamping. The copper clad sheet includes an insulation layer. The copper clad layer is inner surface of the containing groove. The bond blocks are arranged on the ribs and cover is pressed to the stamped copper clad sheet and secured using the bond blocks. The containing grooves form sealing cavities and the phase-change material in the sealed cavity gathers and transfers out any heat generated by components.Type: ApplicationFiled: June 24, 2016Publication date: November 9, 2017Inventors: NING HOU, CONG LEI, BIAO LI, MING-JAAN HO
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Patent number: 9072173Abstract: An RFPCB includes a reinforcement layer and at least two FPCBs spliced together to match the reinforcement layer in shape and size. The FPCBs are adhered onto the reinforcement layer. The reinforcement layer includes circuits connected with the FPCB and has portions removed to obtain a desired flexibility.Type: GrantFiled: December 24, 2013Date of Patent: June 30, 2015Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., Zhen Ding Technology Co., Ltd.Inventor: Ning Hou
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Publication number: 20140182900Abstract: An RFPCB includes a reinforcement layer and at least two FPCBs spliced together to match the reinforcement layer in shape and size. The FPCBs are adhered onto the reinforcement layer. The reinforcement layer includes circuits connected with the FPCB and has portions removed to obtain a desired flexibility.Type: ApplicationFiled: December 24, 2013Publication date: July 3, 2014Applicants: ZHEN DING TECHNOLOGY CO., LTD., FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.Inventor: NING HOU
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Patent number: 7511962Abstract: A flexible printed circuit board includes a flexible base, a working trace region, and at least one reinforcement trace. The working trace region and the at least one reinforcement trace are formed on the flexible base. The working trace is formed by a number of working traces. In the flexible base, the at least one reinforcement trace is disposed at a periphery of the working trace region.Type: GrantFiled: December 19, 2007Date of Patent: March 31, 2009Assignees: FuKui Precision Component (Shenzhen) Co., Ltd., Foxconn Advanced Technology Inc.Inventors: Ning Hou, Shing-Tza Liou
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Publication number: 20090038828Abstract: The present invention relates to a flexible printed circuit board substrate and FPCB made from the flexible printed circuit board substrate. In one embodiment, a flexible printed circuit board substrate includes a dielectric layer, a rolled copper foil and an electroplated copper foil disposed on two opposite surfaces of the dielectric layer respectively. The contact fingers are made from electroplated copper foil, as a result, the contact fingers are stronger than that made from rolled copper foil. Furthermore, electroplated copper foils are cheaper than rolled copper foils.Type: ApplicationFiled: April 23, 2008Publication date: February 12, 2009Applicants: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD., FOXCONN ADVANCED TECHNOLOGY INC.Inventors: NING HOU, SHING-TZA LIOU
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Publication number: 20080285241Abstract: A flexible printed circuit board includes a flexible base, a working trace region, and at least one reinforcement trace. The working trace region and the at least one reinforcement trace are formed on the flexible base. The working trace is formed by a number of working traces. In the flexible base, the at least one reinforcement trace is disposed at a periphery of the working trace region.Type: ApplicationFiled: December 19, 2007Publication date: November 20, 2008Applicants: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD., FOXCONN ADVANCED TECHNOLOGY INC.Inventors: NING HOU, SHING-TZA LIOU