Abstract: The invention discloses a charging gun that can realize changeable color according to temperature change and a preparation method thereof, relating to the field of charging gun, including a gun head with one end provided with silicone waterproof pad, the rear side of silicone waterproof pad is connected with terminal cover; interior of said terminal cover is connected with terminals, and outer side of the terminals are provided with terminal rubber coatings, one end of said terminals is connected with a terminal wiring harness. The invention realizes changeable color block different from the material used elsewhere, which adopts PC and temperature-sensitive material mixed injection molding, in the charging process of charging gun, phenomenon of heat will occur in the event of improper use or poor contact, at this time temperature change can be perceived through color change of gun shell so as to confirm using state of charging gun.

Abstract: A method for preparing a semiconductor device includes: forming a metal oxide semiconductor layer on a substrate; forming a second insulating dielectric layer on a side of the metal oxide semiconductor layer away from the substrate; wherein further including: forming a metal oxide isolation layer on a side of the second insulating dielectric layer away from the substrate; wherein the metal oxide isolation layer is in contact with a surface of the second insulating dielectric layer away from the substrate, a concentration of elemental oxygen in the metal oxide isolation layer is greater than a concentration of elemental oxygen in the second insulating dielectric layer, and the concentration of elemental oxygen in the second insulating dielectric layer is greater than a concentration of elemental oxygen in the metal oxide semiconductor layer. An array substrate and a display panel are also provided.

Abstract: A system and a method for manipulating a beam of an Advanced Charge Controller module in different planes in an e-beam system are provided. Some embodiments of the system include a lens system configured to manipulate a beam in the tangential plane and the sagittal plane such that the beam spot is projected onto the wafer with high luminous energy. Some embodiments of the system include a lens system comprising at least two cylindrical lens.

Abstract: The present invention relates to novel pyridazin-3-yl phenol compounds of formula (I): wherein R1, R2, R3, R4 and R5 are defined herein, which inhibit NOD-like receptor protein 3 (NLRP3) inflammasome activity. The invention further relates to the processes for their preparation, pharmaceutical compositions and medicaments containing them, and their use in the treatment of diseases and disorders mediated by NLRP3.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for using a general fixture for robotic motion planning. One of the methods includes receiving a request to generate a motion plan for manipulating a component that is part of a robotic assembly process in an operating environment, the operating environment including a fixture having a base and a mesh surface, the mesh surface having openings that are configured to constrain the orientation of the component that is part of the robotic assembly process; in response, generating a motion plan that when executed causes a robot to place an instance of the component on the mesh surface.

Abstract: A snap fit bracket for a capacitor slideably couples the capacitor to an opening defined by a substrate. The snap fit bracket includes four sidewalls that form a perimeter. The perimeter defines an opening into which the capacitor is horizontally positioned. A first channel is provided on a first side of the snap fit bracket and a second channel is provided on a second side of the snap fit bracket. Each of the first channel and the second channel are slideably coupled to respective edges within the opening of the substrate. A snap fit fastener is included in one or both of the first channel and the second channel. A portion of the snap fit fastener is received into a notch that is provided within the opening of the substrate which secures the snap fit bracket to the substrate.

Abstract: A snap fit bracket for an electrolytic capacitor is vertically mounted within an opening defined by a substrate. The bracket includes four sidewalls that form a perimeter. A first flange extends from one sidewall and forms a first ledge that sits on a top surface of the substrate when the bracket is mounted within the opening defined by the substrate. A second flange extends from another sidewall and forms a second ledge that sits on the top surface of the substrate when the bracket is mounted within the opening defined by the substrate. A fastener extends from two or more of the sidewalls. A top surface of each fastener contacts a bottom surface of the substrate when the bracket is mounted within the opening defined by the substrate. After vertically mounting the bracket within the substrate, the capacitor disposed within the bracket is horizontally mounted with respect to the PCB.

Abstract: A method of forming a semiconductor device includes forming vertical contact fingers in a substrate having side portions that are flexible. Contact fingers are formed near one or more edges of the flexible side portions of the substrate. After semiconductor dies are mounted to and electrically coupled to the substrate, the semiconductor device may be encapsulated by placing the device in a mold chase including upper and lower mold plates. The lower mold plate is sized smaller than the substrate so that the flexible side portions of the substrate including the contact fingers fold vertically upward to fit within the mold.

Abstract: A data storage device including, in one implementation, a number of memory die packages disposed on a substrate within the data storage device. Each memory die package has a die density that includes one or more memory dies. The die density of each memory die package is configured to provide an even thermal distribution across the number of memory die packages. The respective die densities of two memory of the die packages are different from each other.

Abstract: Provided are system, method, and device for performing multimodal video retrieval. According to embodiments, the method may include: obtaining a first plurality of frames of a video; selecting a second plurality of frames from among the first plurality of frames using a frame selection module, wherein a number of the second plurality of frames may be less than a number of the first plurality of frames; determining a representation of the video based on the selected second plurality of frames using a neural network model; and storing the representation of the video in a memory.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for using learnable robotic control plans. One of the methods comprises obtaining a learnable robotic control plan comprising data defining a state machine that includes a plurality of states and a plurality of transitions between states, wherein: one or more states are learnable states, and each learnable state comprises data defining (i) one or more learnable parameters of the learnable state and (ii) a machine learning procedure for automatically learning a respective value for each learnable parameter of the learnable state; and processing the learnable robotic control plan to generate a specific robotic control plan, comprising: obtaining data characterizing a robotic execution environment; and for each learnable state, executing, using the obtained data, the respective machine learning procedures defined by the learnable state to generate a respective value for each learnable parameter of the learnable state.

Abstract: A method of real-time video event detection includes: obtaining, based on a natural language query, a query vector; performing multimodal feature extraction on a video stream to obtain a video vector, obtaining a similarity score by comparing the query vector to the video vector; comparing the similarity score to a predetermined threshold; and activating, based on the similarity score being above the predetermined threshold, an action trigger. The multimodal feature extraction is performed using a plurality of overlapping windows that include sequential frames of the video stream.

Abstract: Apparatuses, systems, and methods for providing beams for controlling charges on a sample surface of charged particle beam system. In some embodiments, a module comprising a laser source configured to emit a beam. The beam may illuminate an area adjacent to a pixel on a wafer to indirectly heat the pixel to mitigate a cause of a direct photon-induced effect at the pixel. An electron beam tool configured to detect a defect in the pixel, wherein the defect is induced by the indirect heating of the pixel.

Abstract: A system and a method for monitoring a beam in an inspection system are provided. The system includes an image sensor configured to collect a sequence of images of a beam spot of a beam formed on a surface, each image of the sequence of images having been collected at a different exposure time of the image sensor, and a controller configured to combine the sequence of images to obtain a beam profile of the beam.

Abstract: A semiconductor package includes a flip chip die communicatively coupled to a substrate. A lid is also coupled to the substrate and covers the flip chip die. A non-curing thermal conductive liquid coolant fills a volume defined by the lid and is used to dissipate heat that is generated by the flip chip die. The non-curing thermal conductive liquid coolant may include nanometer-sized particles that enhance the heat dissipation properties of the non-curing thermal conductive liquid coolant. The semiconductor package also may include a micro-rotator that causes the non-curing thermal conductive liquid coolant to circulate within the volume when a temperature of the flip chip die exceeds a temperature threshold.

Abstract: A data storage device including, in one implementation, a number of memory die packages disposed on a substrate within the data storage device. Each memory die package has a die density that includes one or more memory dies. The die density of each memory die package is configured to provide an even thermal distribution across the number of memory die packages. The respective die densities of two memory of the die packages are different from each other.

Abstract: Approaches directed at increasing the production yield of integrated circuits including layers of low-k dielectrics. One example provides a flip-chip assembly including a semiconductor chip attached to a substrate using pillars or bumps. The semiconductor chip has a thickness profile such that the chip is thinner near the corners than in middle portions. The thinner corner portions beneficially alleviate chip-integrity issues related to the stresses generated during the solder reflow operation while the thicker middle portions beneficially alleviate chip-integrity issues related to the stresses generated during the chip or die pick-up operation. Due to the alleviation of both types of chip-integrity issues, the number of instances in which the low-k dielectrics crack during the corresponding assembly operations is significantly reduced, thereby beneficially increasing the manufacturing yield.

Abstract: A semiconductor device includes a substrate, semiconductor dies on the substrate, molding compound and a reinforcing layer suspended within the molding compound. The reinforcing layer may for example be a copper foil formed in the molding compound over the semiconductor dies during the compression molding process. The reinforcing layer may have a structural rigidity which provides additional strength to the semiconductor device. The reinforcing layer may also be formed of a thermal conductor to draw heat away from a controller die within the semiconductor device.

Abstract: A protective enclosure for a PCB assembly, e.g., a solid-state-drive assembly. In an example embodiment, the enclosure comprises a flexible, stamped-metal heat spreader connected, by way of cured-liquid TIM parts, to at least some of the packaged integrated circuits on one side of the PCB assembly. In some embodiments, additional cured-liquid TIM parts may be connected between the body of the protective enclosure and packaged integrated circuits on the other side of the PCB assembly and/or the assembly's PCB. The PCB assembly, heat spreader, and various TIM parts are arranged in a manner that helps to significantly lower the risk of solder-joint failure under thermal cycling.

Abstract: Methods and apparatus for detecting a failed temperature sensor within a data storage device and for mitigating the loss of the sensor are provided. One such data storage device includes a non-volatile memory (NVM), a set of temperature sensors, and a processor coupled to the NVM and the temperature sensors. The processor is configured to detect failure of one of the temperature sensors and obtain temperature data from the other temperature sensors. The processor is further configured to estimate, based on the obtained temperature data, the temperature at the failed sensor, and then control at least one function of the data storage device based on the estimated temperature, such as controlling entry into a Read Only mode. In some examples, the processor estimates the temperature at the failed sensor or at various virtual sensor locations using pre-determined formulas having offsets and coefficients determined during an initial machine learning calibration procedure.