Abstract: Provided are a method and an apparatus for micro-hydrocyclone purification for a flue gas carbon dioxide capture system. The method comprises: performing gas-liquid micro-hydrocylone separation with ultralow pressure drop on scrubbed flue gas, to remove aerosol particulates entrained in the flue gas; performing gas-liquid micro hydrocyclone separation with ultralowpressure drop on off-gas vented from the top of an absorption column, to remove entrained aerosol particulates; performing gas-liquid micro hydrocyclone separation with ultralow pressure drop on cooled regeneration gas, to remove entrained aerosol particulates; and performing liquid-solid and liquid-liquid two-stage micro-hydrocyclone separation on a mixed amine solution lean for carbon dioxide discharged from regeneration column, to remove entrained solid particulates and machine oil.

Abstract: A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.

Abstract: Methods and systems for transparent user interface integration between remote (“published”) applications and their local counterparts are described, providing a seamless, unified user experience, and allowing integration of a start menu, dock, taskbar, desktop shortcuts, windows, window and application switching, system tray elements, client-to-host and host-to-client file type association, URL redirection, browser cookie redirection, token redirection, status message interception and redirection, and other elements. These methods and systems further enhance theme-integration between a client and remote desktop or virtual machine by remoting all UI elements to a recipient for generation, including text controls, buttons, progress bars, radio buttons, list boxes, or other elements; presenting them with the receiver's product and OS-specific UI; and returning status back to the sender. This may achieve a more unified and transparent UI integration.

Abstract: A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.

Abstract: Described are nonlinear optical (NLO) crystals, including aluminum-borate NLO crystals, that have low concentrations of contaminants that adversely affect the NLO crystal's optical properties, such as compounds that contain transition-metal elements and/or lanthanides, other than yttrium, lanthanum, and lutetium. Some NLO crystals with low concentrations of these contaminants are capable of second harmonic generation at very short wavelengths. Also described are embodiments of a method for making these NLO crystals. Some embodiments involve growing a single NLO crystal, such as an aluminum-borate NLO crystal, from a mixture containing a solvent that is substantially free of harmful contaminants. The described NLO crystals can be used, for example, in laser devices.

Abstract: Described are nonlinear optical (NLO) crystals, including aluminum-borate NLO crystals, that have low concentrations of contaminants that adversely affect the NLO crystal's optical properties, such as compounds that contain transition-metal elements and/or lanthanides, other than yttrium, lanthanum, and lutetium. Some NLO crystals with low concentrations of these contaminants are capable of second harmonic generation at very short wavelengths. Also described are embodiments of a method for making these NLO crystals. Some embodiments involve growing a single NLO crystal, such as an aluminum-borate NLO crystal, from a mixture containing a solvent that is substantially free of harmful contaminants. The described NLO crystals can be used, for example, in laser devices.

Abstract: A system for incorporating at least one window from a first desktop environment having a first themed graphical display into a second desktop environment having a second themed graphical display includes a first virtual channel, a second virtual channel, and a local agent. The first virtual channel conveys graphical data associated with a window in the first desktop environment comprising a client area and a window rectangle. The second virtual channel conveys window attribute data associated with the window and including screen coordinates for the client area. A local agent forms a corresponding window in the second desktop environment, the corresponding window displaying the graphical data received from the first virtual channel in a local client area displayed at screen coordinates in accordance with the received window attribute data, the corresponding window having a local window rectangle displayed according to a second graphical theme.

Abstract: A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts through the panel to define one or more edges of the semiconductor package. The one or more edges may be smoothed by applying a laminate to the edges. The edges receiving the laminate may include any edge between a top and bottom surface of the package.

Abstract: A portable memory card and methods of manufacturing same are disclosed. The portable memory includes a substrate having a plurality of holes formed therein. During the encapsulation process, mold compound flows over the top surface of the substrate, through the holes, and down into a recessed section formed in the bottom mold cap plate to form a projection of mold compound on the bottom surface of the substrate.

Abstract: A portable memory card and methods of manufacturing same are disclosed. The portable memory includes a substrate having a plurality of holes formed therein. During the encapsulation process, mold compound flows over the top surface of the substrate, through the holes, and down into a recessed section formed in the bottom mold cap plate to form a projection of mold compound on the bottom surface of the substrate.

Abstract: A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts through the panel to define one or more edges of the semiconductor package. The one or more edges may be smoothed by applying a laminate to the edges. The edges receiving the laminate may include any edge between a top and bottom surface of the package.

Abstract: A semiconductor package is disclosed having a single CE signal during electrical test and a plurality of CE signals during normal operation thereafter. After electrical testing of the memory die during fabrication, the electrical traces carrying the single CE signal from the memory test pad matrix to each of the memory die may be severed. Severing the electrical traces from the memory test pad matrix electrically isolates the multiple electrical traces between the controller die and memory die, and allows separate and individual CE signals between the controller die and memory die during normal usage of the memory die.

Abstract: A method of forming a semiconductor package with smooth edges, and a semiconductor package formed thereby is disclosed. In embodiments, after encapsulation, the semiconductor packages may be at least partially singulated from the panel by making one or more cuts through the panel to define one or more edges of the semiconductor package. The one or more edges may be smoothed by applying a laminate to the edges. The edges receiving the laminate may include any edge between a top and bottom surface of the package.

Abstract: A semiconductor package is discussed having a single CE signal during electrical test and a plurality of CE signals during normal operation thereafter. After electrical testing of the memory die during fabrication, the electrical traces carrying the single CE signal from the memory test pad matrix to each of the memory die may be severed. Severing the electrical traces from the memory test pad matrix electrically isolates the multiple electrical traces between the controller die and memory die, and allows separate and individual CE signals between the controller die and memory die during normal usage of the memory die.

Abstract: A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.

Abstract: A method of forming a semiconductor card. A semiconductor package having a damaged controller die is reclaimed. The reclaim process includes severing the electrical connections between the controller die and the semiconductor package substrate without exposing the passive component. In one embodiment, the cutting tool comprises a saw blade. An electrically insulating material is deposited over the exposed bond wires to complete the reclaim process. The reclaimed package and a new controller die are affixed to a second substrate to electrically couple the memory die of the reclaimed package with the new controller die—forming a new package. The new package is encapsulated to form a new memory card.

Abstract: A semiconductor package is disclosed having a single CE signal during electrical test and a plurality of CE signals during normal operation thereafter. After electrical testing of the memory die during fabrication, the electrical traces carrying the single CE signal from the memory test pad matrix to each of the memory die may be severed. Severing the electrical traces from the memory test pad matrix electrically isolates the multiple electrical traces between the controller die and memory die, and allows separate and individual CE signals between the controller die and memory die during normal usage of the memory die.

Abstract: A method of forming a semiconductor card. A semiconductor package having a damaged controller die is reclaimed. The reclaim process includes severing the electrical connections between the controller die and the semiconductor package substrate without exposing the passive component. In one embodiment, the cutting tool comprises a saw blade. An electrically insulating material is deposited over the exposed bond wires to complete the reclaim process. The reclaimed package and a new controller die are affixed to a second substrate to electrically couple the memory die of the reclaimed package with the new controller die—forming a new package. The new package is encapsulated to form a new memory card.

Abstract: A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.