Abstract: An information handling system includes a lock, a switch, and a south bridge. The lock is configured to receive a key and to alternate between a locked position and an unlocked position. The switch is in communication with the lock. The switch is configured to receive a signal from the lock, to close if the lock is in the locked position, and to open if the lock is in the unlocked position. The south bridge is in communication with the switch. The south bridge is configured to disable a plurality of communication ports of the information handling system when the switch is closed, and configured to enable the communication ports when the switch is opened.

Abstract: An information handling system includes a lock, a switch, and a south bridge. The lock is configured to receive a key and to alternate between a locked position and an unlocked position. The switch is in communication with the lock. The switch is configured to receive a signal from the lock, to close if the lock is in the locked position, and to open if the lock is in the unlocked position. The south bridge is in communication with the switch. The south bridge is configured to disable a plurality of communication ports of the information handling system when the switch is closed, and configured to enable the communication ports when the switch is opened.

Abstract: An information handling system includes a lock, a switch, and a south bridge. The lock is configured to receive a key and to alternate between a locked position and an unlocked position. The switch is in communication with the lock. The switch is configured to receive a signal from the lock, to close if the lock is in the locked position, and to open if the lock is in the unlocked position. The south bridge is in communication with the switch. The south bridge is configured to disable a plurality of communication ports of the information handling system when the switch is closed, and configured to enable the communication ports when the switch is opened.

Abstract: An information handling system includes a lock, a switch, and a south bridge. The lock is configured to receive a key and to alternate between a locked position and an unlocked position. The switch is in communication with the lock. The switch is configured to receive a signal from the lock, to close if the lock is in the locked position, and to open if the lock is in the unlocked position. The south bridge is in communication with the switch. The south bridge is configured to disable a plurality of communication ports of the information handling system when the switch is closed, and configured to enable the communication ports when the switch is opened.

Abstract: A method for controlling a fan speed is disclosed. The fan cools a CPU in a computer. The method includes defining a CPU-max-temp value of a CPU, such that the first fan speed is linearly enhanced with the increase of a real temperature value of the CPU, when the real temperature value of the CPU is lower than the CPU-max-temp value, and changing the CPU-max-temp value to a higher CPU-max-temp value in a basic input output system. A second fan speed is linearly enhanced with an increase of the real temperature value, when the real temperature value is lower than the higher CPU-max-temp value. The second fan speed is less than the first fan speed at the real temperature value.

Abstract: A heat sink assembly includes an air duct, a heat sink and a fan. The air duct defines an air guiding channel therein. The heat sink is configured to contact a heat source to dissipate heat from a heat source. The heat sink includes a plurality of heat pipes. The heat sink is placed on one side of the air guiding channel, and the heat pipes contacts the air duct to transmit heat to the air duct. The fan is placed on the other side of the air guiding channel to communicate with the heat sink via the air duct. The fan forces air to flow through the air guiding channel to the heat sink to dissipate heat on the air duct and the heat sink.

Abstract: A computer enclosure includes a chassis, a heat dissipation fan, a first duct, and a second duct. The chassis includes a bottom panel with a heat generating component and a side panel a vent defined therein. The first duct is attached between a first side of the fan and the vent of the chassis. The second duct is attached to a second side of the fan and covers the heat generating component. The second duct includes a resilient latch structure latchably secured to the second side of the fan.

Abstract: A heat sink apparatus for dissipating heat generated from a heat generating component includes a first heat dissipating assembly attached to one side of the heat generating component, a second heat dissipating assembly attached to another side of the heat generating component; and a connecting device connecting between the first heat dissipating assembly and the second heat dissipating assembly thereby forming a continuous heat dissipation passage between the first heat dissipating assembly and the second heat dissipating assembly.

Abstract: A heat sink includes a plurality of fins parallel to each other. The fins include a top portion having a flange. The opposite ends of each flange are rounded. Two rounded corners are located below the plane defined by the flange.

Abstract: An assembly includes a circuit board and a heat sink apparatus attached to the motherboard. The heat sink apparatus has at least two screws, and a first mistake-proof structure. A plurality of screw holes are defined in the circuit board corresponding to the screws. The circuit board has a second mistake-proof structure corresponding to the first mistake-proof structure. The first mistake-proof structure engages with the second mistake-proof structure to align the heat sink apparatus to the circuit board in only one configuration.

Abstract: A heat sink apparatus for dissipating heat generated from a heat generating component includes a first heat dissipating assembly attached to one side of the heat generating component, a second heat dissipating assembly attached to another side of the heat generating component; and a connecting device connecting between the first heat dissipating assembly and the second heat dissipating assembly thereby forming a continuous heat dissipation passage between the first heat dissipating assembly and the second heat dissipating assembly.

Abstract: An electronic device includes a first heat source, a second heat source adjacent to the first heat source, a heat sink, and a fan. The heat sink is mounted on the first heat source for transferring heat from the first heat source to the heat sink. The fan has an air inlet and an air outlet. The air outlet faces the second heat source to drive air flowing through the second heat source if the air inlet faces the heat sink. The air outlet faces the heat sink to drive air flowing through the heat sink if the air inlet faces the second heat source.

Abstract: A heat sink assembly includes an air duct, a heat sink and a fan. The air duct defines an air guiding channel therein. The heat sink is configured to contact a heat source to dissipate heat from a heat source. The heat sink includes a plurality of heat pipes. The heat sink is placed on one side of the air guiding channel, and the heat pipes contacts the air duct to transmit heat to the air duct. The fan is placed on the other side of the air guiding channel to communicate with the heat sink via the air duct. The fan forces air to flow through the air guiding channel to the heat sink to dissipate heat on the air duct and the heat sink.

Abstract: A computer enclosure includes a chassis, a heat dissipation fan, a first duct, and a second duct. The chassis includes a bottom panel with a heat generating component and a side panel a vent defined therein. The first duct is attached between a first side of the fan and the vent of the chassis. The second duct is attached to a second side of the fan and covers the heat generating component. The second duct includes a resilient latch structure latchably securied to the second side of the fan.

Abstract: A heat sink assembly includes a base and a mounting apparatus. The base defines a stepped hole. A step is formed in the stepped hole. A cutout is defined on an edge of the base and communicates with the stepped hole. The mounting apparatus includes a bolt and a spring. The bolt defines a groove at a portion of the bolt to form an engaging portion thereof. The engaging portion passes through the cutout. The step engages in the groove of the bolt. The spring is retained around the bolt, received in the stepped hole, and abuts against the step to retain the bolt in the stepped hole.

Abstract: A heat sink includes a plurality of fins parallel to each other. The fins include a top portion having a flange. The opposite ends of each flange are rounded. Two rounded corners are located below the plane defined by the flange.

Abstract: A method for controlling a fan speed is disclosed. The fan cools a CPU in a computer. The method includes defining a CPU-max-temp value of a CPU, such that the first fan speed is linearly enhanced with the increase of a real temperature value of the CPU, when the real temperature value of the CPU is lower than the CPU-max-temp value, and changing the CPU-max-temp value to a higher CPU-max-temp value in a basic input output system. A second fan speed is linearly enhanced with an increase of the real temperature value, when the real temperature value is lower than the higher CPU-max-temp value. The second fan speed is less than the first fan speed at the real temperature value.

Abstract: A protective cap for use with a heat sink, includes a cover plate for enclosing thermal grease on the heat sink, and a plurality of strengthening ribs positioned on the cover plate. The strengthening ribs resist the heat sink to prevent the thermal grease from being pressed against the cover plate.

Abstract: A heat dissipating system includes a chassis (10), and a fan (50). The chassis includes a rear plate (14). The rear plate has an inner surface. The fan is secured to the rear plate inside the chassis. A distance is formed between the fan and the inner surface of the rear plate.

Abstract: A heat dissipation device includes a heat sink (10) and a fan (30). The heat sink includes a plurality of fins (15), and a guiding portion (184) is formed in the fins. The fan is secured to the heat sink. An airflow (F) is generated by the fan for flowing through the heat sink. When the airflow meets with the guiding portion, the airflow is deflected. The deflected airflow is guided to flow across heat-generating elements.