Patents by Inventor Ning-Yuan Wang

Ning-Yuan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mirco-electro-mechanical system module and manufacturing method thereof
    Patent number: 9362257
    Abstract: The invention provides a micro-electro-mechanical system (MEMS) module, which includes a MEMS die stacked on an electronic circuit die. The electronic circuit die includes a substrate, the substrate including at least one through-silicon via (TSV) penetrating through the substrate; and at least one electronic circuit. The electronic circuit includes a circuit region, and a signal transmission layer directly connecting the TSV. At least one wire is connected between a middle part of the MEMS die and the TSV. There is no signal communication at the interfacing location where the MEMS die is stacked on and bonded with the electronic circuit die.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: June 7, 2016
    Assignee: RICHTEK TECHNOLOGY CORPORATION R.O.C.
    Inventors: Chiung-Cheng Lo, Yu-Fu Kang, Ning-Yuan Wang, Chiung-Wen Lin
  • MIRCO-ELECTRO-MECHANICAL SYSTEM MODULE AND MANUFACTURING METHOD THEREOF
    Publication number: 20150259195
    Abstract: The invention provides a micro-electro-mechanical system (MEMS) module, which includes a MEMS die stacked on an electronic circuit die. The electronic circuit die includes a substrate, the substrate including at least one through-silicon via (TSV) penetrating through the substrate; and at least one electronic circuit. The electronic circuit includes a circuit region, and a signal transmission layer directly connecting the TSV. At least one wire is connected between a middle part of the MEMS die and the TSV. There is no signal communication at the interfacing location where the MEMS die is stacked on and bonded with the electronic circuit die.
    Type: Application
    Filed: March 10, 2015
    Publication date: September 17, 2015
    Applicant: RICHTEK TECHNOLOGY CORPORATION
    Inventors: Chiung-Cheng Lo, Yu-Fu Kang, Ning-Yuan Wang, Chiung-Wen Lin