Abstract: A method for determining a patterning device pattern. The method includes obtaining (i) an initial patterning device pattern having at least one feature, and (ii) a desired feature size of the at least one feature, obtaining, based on a patterning process model, the initial patterning device pattern and a target pattern for a substrate, a difference value between a predicted pattern of the substrate image by the initial patterning device and the target pattern for the substrate, determining a penalty value related the manufacturability of the at least one feature, wherein the penalty value varies as a function of the size of the at least one feature, and determining the patterning device pattern based on the initial patterning device pattern and the desired feature size such that a sum of the difference value and the penalty value is reduced.

Abstract: A resin composition includes a polyphenylene ether resin of Formula (1) and an additive. The additive may include maleimide resin, unsaturated C?C double bond-containing crosslinking agent, polyolefin, flame retardant, filler, curing accelerator, or a combination thereof. An article is made from the resin composition. The article includes a prepreg, a resin film, a laminate or a printed circuit board and achieves improvements in one or more properties including comparative tracking index, breakdown voltage, dissipation factor and copper foil peeling strength.

Abstract: A resin composition includes 100 parts by weight of an unsaturated C?C double bond-containing polyphenylene ether resin; 15 parts by weight to 40 parts by weight of a hydrogenated styrene-butadiene-styrene triblock copolymer; 1 part by weight to 20 parts by weight of a compound of Formula (1); and 0.001 part by weight to 0.5 part by weight of a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

Abstract: A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 ?m copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.

Abstract: A filler includes a first precursor and a second precursor; the first precursor is a hollow filler with a surface covered by a first silane coupling agent; the second precursor is a non-hollow filler with a surface covered by a second silane coupling agent; the first precursor and the second precursor are connected by a covalent bond formed by a chemical reaction between the first silane coupling agent and the second silane coupling agent. Also included are a preparation method of the filler and a resin composition containing the filler. A prepreg, a resin film, a laminate, or a printed circuit board made from the resin composition has excellent thermal resistance after moisture absorption, low Df variation rate under moisture and heat, low water absorption rate, high copper foil peeling strength, the prepreg having a smooth appearance and even color, and absence of branch-like pattern on laminate.

Abstract: A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 ?m copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.

Abstract: A resin composition includes an unsaturated C?C double bond-containing polyphenylene ether resin, a polyolefin and silica; in an X-ray diffraction analysis pattern of the silica as measured by reference to JY/T 009-1996, only one diffraction peak exists in a 2? ranging from 10° to 30°, and the diffraction peak has a full width at half maximum of 5.0° to 7.7°. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one of the properties including dissipation factor, resin filling property in open area, hole drilling limit value, and precision of hole position Cpk.

Abstract: A resin composition includes a polyphenylene ether resin of Formula (1) and an additive. The additive may include maleimide resin, unsaturated C?C double bond-containing crosslinking agent, polyolefin, flame retardant, filler, curing accelerator, or a combination thereof. An article is made from the resin composition. The article includes a prepreg, a resin film, a laminate or a printed circuit board and achieves improvements in one or more properties including comparative tracking index, breakdown voltage, dissipation factor and copper foil peeling strength.

Abstract: A filler includes a first precursor and a second precursor; the first precursor is a hollow filler with a surface covered by a first silane coupling agent; the second precursor is a non-hollow filler with a surface covered by a second silane coupling agent; the first precursor and the second precursor are connected by a covalent bond formed by a chemical reaction between the first silane coupling agent and the second silane coupling agent. Also included are a preparation method of the filler and a resin composition containing the filler. A prepreg, a resin film, a laminate, or a printed circuit board made from the resin composition has excellent thermal resistance after moisture absorption, low Df variation rate under moisture and heat, low water absorption rate, high copper foil peeling strength, the prepreg having a smooth appearance and even color, and absence of branch-like pattern on laminate.

Abstract: A method for determining a patterning device pattern. The method includes obtaining (i) an initial patterning device pattern having at least one feature, and (ii) a desired feature size of the at least one feature, obtaining, based on a patterning process model, the initial patterning device pattern and a target pattern for a substrate, a difference value between a predicted pattern of the substrate image by the initial patterning device and the target pattern for the substrate, determining a penalty value related the manufacturability of the at least one feature, wherein the penalty value varies as a function of the size of the at least one feature, and determining the patterning device pattern based on the initial patterning device pattern and the desired feature size such that a sum of the difference value and the penalty value is reduced.

Abstract: A resin composition includes 100 parts by weight of an unsaturated C?C double bond-containing polyphenylene ether resin; 15 parts by weight to 40 parts by weight of a hydrogenated styrene-butadiene-styrene triblock copolymer; 1 part by weight to 20 parts by weight of a compound of Formula (1); and 0.001 part by weight to 0.5 part by weight of a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

Abstract: A method for determining a patterning device pattern. The method includes obtaining (i) an initial patterning device pattern having at least one feature, and (ii) a desired feature size of the at least one feature, obtaining, based on a patterning process model, the initial patterning device pattern and a target pattern for a substrate, a difference value between a predicted pattern of the substrate image by the initial patterning device and the target pattern for the substrate, determining a penalty value related the manufacturability of the at least one feature, wherein the penalty value varies as a function of the size of the at least one feature, and determining the patterning device pattern based on the initial patterning device pattern and the desired feature size such that a sum of the difference value and the penalty value is reduced.

Abstract: A resin composition is useful for preparing an article such as a prepreg, a resin film, a laminate or a printed circuit board. The resin composition includes a benzoxazine resin of Formula (1) and a maleimide resin. The article made from the resin composition has high thermal resistance, low dielectric properties and high dimensional stability and meets the processability requirements of printed circuit boards involving multiple lamination processes and multiple assembly operations.

Abstract: A resin composition includes an unsaturated C?C double bond-containing polyphenylene ether resin, a polyolefin and silica; in an X-ray diffraction analysis pattern of the silica as measured by reference to JY/T 009-1996, only one diffraction peak exists in a 2? ranging from 10° to 30°, and the diffraction peak has a full width at half maximum of 5.0° to 7.7°. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one of the properties including dissipation factor, resin filling property in open area, hole drilling limit value, and precision of hole position Cpk.

Abstract: A resin composition comprises a prepolymer of crosslinking agent and benzoxazine resin and a maleimide resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including laminate reflow shrinkage, T288 thermal resistance, ten-layer board T300 thermal resistance, dissipation factor, copper foil peeling strength, and resin filling property in open area.

Abstract: A method for determining a patterning device pattern. The method includes obtaining (i) an initial patterning device pattern having at least one feature, and (ii) a desired feature size of the at least one feature, obtaining, based on a patterning process model, the initial patterning device pattern and a target pattern for a substrate, a difference value between a predicted pattern of the substrate image by the initial patterning device and the target pattern for the substrate, determining a penalty value related the manufacturability of the at least one feature, wherein the penalty value varies as a function of the size of the at least one feature, and determining the patterning device pattern based on the initial patterning device pattern and the desired feature size such that a sum of the difference value and the penalty value is reduced.

Abstract: A resin composition is useful for preparing an article such as a prepreg, a resin film, a laminate or a printed circuit board. The resin composition includes a benzoxazine resin of Formula (1) and a maleimide resin. The article made from the resin composition has high thermal resistance, low dielectric properties and high dimensional stability and meets the processability requirements of printed circuit boards involving multiple lamination processes and multiple assembly operations.

Abstract: A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 ?m copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.

Abstract: A resin composition comprises a prepolymer of crosslinking agent and benzoxazine resin and a maleimide resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including laminate reflow shrinkage, T288 thermal resistance, ten-layer board T300 thermal resistance, dissipation factor, copper foil peeling strength, and resin filling property in open area.

Abstract: Disclosed herein is a resin composition, comprising: a crosslinking agent, its prepolymer, or a combination thereof; and a first unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board and achieve improvement in at least one, more or all properties including volatile content of prepreg, stickiness of prepreg, resin filling property of prepreg, glass transition temperature, dimensional stability under heat, T288 thermal resistance, thermal resistance after moisture absorption, dielectric constant and dissipation factor.