Patents by Inventor Nippon Ghosh

Nippon Ghosh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240117225
    Abstract: The present invention relates to a contact adhesive composition based on chloroprene rubber, to a preparation method of the contact adhesive composition and to a method of bonding substrate by using the contact adhesive composition. In particular, the present invention relates to a contact adhesive composition comprising a fast-crystallizing chloroprene rubber and a slowly-crystallizing chloroprene rubber.
    Type: Application
    Filed: February 18, 2022
    Publication date: April 11, 2024
    Inventors: Krunal Trivedi, Mihirkumar Patel, Jayesh P. Shah, Nippon Ghosh
  • Patent number: 11541639
    Abstract: Provided herein is a solvent-based pressure sensitive adhesive comprising a polymer comprising a vinyl acetate monomer, an acrylic ester monomer, and a monomer having hydroxyl or amine functionality. The adhesive also comprise a crosslinker. The coated and dried adhesive has outgassing of less than 2000 ng/cm2, even when applied to an electronic device that is operated at elevated temperature.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: January 3, 2023
    Assignee: Avery Dennison Corporation
    Inventors: Nippon Ghosh, Sudarshana Mukherjee, Dhananjay Patil, Suman Majumder
  • Publication number: 20190144720
    Abstract: Provided herein is a solvent-based pressure sensitive adhesive comprising a polymer comprising a vinyl acetate monomer, an acrylic ester monomer, and a monomer having hydroxyl or amine functionality. The adhesive also comprise a crosslinker. The coated and dried adhesive has outgassing of less than 2000 ng/cm2, even when applied to an electronic device that is operated at elevated temperature.
    Type: Application
    Filed: October 12, 2018
    Publication date: May 16, 2019
    Applicant: Avery Dennison Corporation
    Inventors: Nippon Ghosh, Sudarshana Mukherjee, Dhananjay Patil, Suman Majumder
  • Patent number: 10125050
    Abstract: A wear resistant substrate including a metal substrate having a surface, a reinforcing support attached to the surface and cured reaction products of an inorganic curable composition disposed over and through the reinforcing support and bonded to the surface. Also a method of enhancing the wear resistance of a metal surface by attaching a reinforcing support to the surface; disposing an inorganic curable composition over and through the reinforcing support and into contact with the surface; and curing the composition.
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: November 13, 2018
    Assignees: Henkel IP & Holding GmbH, Henkel AG & Co. KGaA
    Inventors: Jayesh P. Shah, Kedar Deshmukh, Nippon Ghosh
  • Publication number: 20160168034
    Abstract: A wear resistant substrate including a metal substrate having a surface, a reinforcing support attached to the surface and cured reaction products of an inorganic curable composition disposed over and through the reinforcing support and bonded to the surface. Also a method of enhancing the wear resistance of a metal surface by attaching a reinforcing support to the surface; disposing an inorganic curable composition over and through the reinforcing support and into contact with the surface; and curing the composition.
    Type: Application
    Filed: February 3, 2016
    Publication date: June 16, 2016
    Inventors: Jayesh P. Shah, Kedar Deshmukh, Nippon Ghosh