Abstract: A retractable load-carrying device is described herein, comprising a harness assembly configured to be worn on a user's torso, the harness assembly including a pair of shoulder straps and a hip belt configured to transfer at least a portion of a load to the user's hips, a rigid back-frame coupled to the harness assembly, at least one retractable arm mounted to the rigid back-frame, a linear guiding mechanism coupled to the rigid back-frame and configured to guide movement of the at least one retractable arm between a stored position in which the at least one retractable arm is positioned adjacent to the rigid back-frame and an extracted position in which the at least one retractable arm extends forward of the user, and a quick-release coupling mechanism coupled to a distal end of the at least one retractable arm and configured to releasably secure a load positioned in front of the user, wherein, in the extracted position, forces from the load are transferred through the at least one retractable arm to the rig

Abstract: A method of forming a semiconductor device includes through-package debug features enabling debug of a BGA package while mounted to a printed circuit board or other host device. In one example, the through-package debug features are filled or plated vias extending from a surface of the semiconductor device, through a device housing, down to test pads on the substrate. In another example, the through-package debug features are open channels formed from a surface of the semiconductor device.

Abstract: A method of forming a semiconductor device is disclosed including through-package debug features enabling debug of a BGA package while mounted to a printed circuit board or other host device. In one example, the through-package debug features are filled or plated vias extending from a surface of the semiconductor device, through a device housing, down to test pads on the substrate. In another example, the through-package debug features are open channels formed from a surface of the semiconductor device.

Abstract: A semiconductor device includes through-package debug features enabling debug of a BGA package while mounted to a printed circuit board or other host device. In one example, the through-package debug features are filled or plated vias extending from a surface of the semiconductor device, through a device housing, down to test pads on the substrate. In another example, the through-package debug features are open channels formed from a surface of the semiconductor device.

Abstract: A semiconductor device is disclosed including through-package debug features enabling debug of a BGA package while mounted to a printed circuit board or other host device. In one example, the through-package debug features are filled or plated vias extending from a surface of the semiconductor device, through a device housing, down to test pads on the substrate. In another example, the through-package debug features are open channels formed from a surface of the semiconductor device.

Abstract: Methods, systems, and computer readable media for storage device workload detection using power consumption are disclosed. One aspect of the subject matter described herein includes a storage device. The storage device includes non-volatile storage. The storage device further includes a device controller for controlling access to the non-volatile storage. A power management controller separate from the device controller senses an indication of power used by at least one of the non-volatile storage and the device controller, compares the sensed indication of power to at least one threshold, and, in response to a predetermined relationship between the sensed indication of power and the at least one threshold, signals the device controller of a workload state of the storage device.

Abstract: A storage system and method for adaptive thermal throttling are disclosed. In one embodiment, a method for adaptive thermal throttling is provided that is performed in a storage system having a memory. This method comprises determining if a temperature of the storage system is above a threshold temperature; and in response to determining that the temperature of the storage system is above the threshold temperature: reducing performance of the storage system in an iterative manner until the temperature of the storage system is within a temperature envelope around the threshold temperature; and storing, in the memory, a value indicating what the performance of the storage system was reduced to in order to get the temperature within the temperature envelope. Other embodiments are possible, and each of the embodiments can be used alone or together in combination.

Abstract: Methods, systems, and computer readable media for storage device workload detection using power consumption are disclosed. One aspect of the subject matter described herein includes a storage device. The storage device includes non-volatile storage. The storage device further includes a device controller for controlling access to the non-volatile storage. A power management controller separate from the device controller senses an indication of power used by at least one of the non-volatile storage and the device controller, compares the sensed indication of power to at least one threshold, and, in response to a predetermined relationship between the sensed indication of power and the at least one threshold, signals the device controller of a workload state of the storage device.

Abstract: A storage system and method for adaptive thermal throttling are disclosed. In one embodiment, a method for adaptive thermal throttling is provided that is performed in a storage system having a memory. This method comprises determining if a temperature of the storage system is above a threshold temperature; and in response to determining that the temperature of the storage system is above the threshold temperature: reducing performance of the storage system in an iterative manner until the temperature of the storage system is within a temperature envelope around the threshold temperature; and storing, in the memory, a value indicating what the performance of the storage system was reduced to in order to get the temperature within the temperature envelope. Other embodiments are possible, and each of the embodiments can be used alone or together in combination.

Abstract: Articles-of-manufacturing comprising an object having a surface and a therapeutically active agent being deposited onto at least a portion of the surface, while at least a portion of said therapeutically active agent being in a crystalline form thereof are disclosed. Methods utilizing such articles-of-manufacturing for treating medical conditions are also disclosed. Processes of preparing the articles-of-manufacturing by contacting a surface of the object with a solution containing the therapeutically active agent; and cooling the surface to a temperature below a temperature of the solution, and apparatus for performing these processes, are also disclosed.