Patents by Inventor Nir Leshem

Nir Leshem has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12112113
    Abstract: A system includes a first instance and a second instance of an integrated circuit. The integrated circuits include respective external interfaces with a physical pin layout having transmit and receive pins for a particular bus located in complementary positions relative to an axis of symmetry. The external interfaces of the first and second instances of the integrated circuit are positioned such that the transmit and receive pins for the given I/O signal on the first instance are aligned, respectively, with the receive and transmit pins for the given I/O signal on the second instance.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: October 8, 2024
    Assignee: Apple Inc.
    Inventors: Sergio Kolor, Dany Davidov, Nir Leshem, Mark Pilip, Lior Zimet
  • Patent number: 12047302
    Abstract: An apparatus includes an interface circuit and an encoder circuit. The interface circuit is configured to send a data packet via a plurality of segments, and to send an idle value via the plurality of segments when no data packet is available. The idle value is configured to cause a segment in a receiving apparatus to idle. The encoder circuit is configured to receive a particular data packet, and, if a portion of the particular data packet has a same value as the idle value for a subset of the plurality of segments, to replace at least a portion of the data packet with a mask value to generate a modified data packet. The mask value indicates how to recreate the particular data packet. The encoder circuit is further configured to send the modified data packet to the receiving apparatus via the plurality of segments of the interface circuit.
    Type: Grant
    Filed: May 31, 2023
    Date of Patent: July 23, 2024
    Assignee: Apple Inc.
    Inventors: Dany Davidov, Nir Leshem, Mark Pilip, Sergio Kolor
  • Publication number: 20240241561
    Abstract: Various techniques and circuit implementations for power reduction management in integrated circuits are disclosed. Trigger logic circuits and rate control circuits may be implemented in combination with a power management circuit to control power provided to components of the integrated circuits. Power may be controlled based on receiving trigger signals from a power management unit. The power management circuit may implement power budgets for various components in the integrated circuits.
    Type: Application
    Filed: March 29, 2024
    Publication date: July 18, 2024
    Inventors: Doron Rajwan, Karl D. Wulcan, Tal Kuzi, Inder M. Sodhi, Achmed R. Zahir, Ilya Granovsky, Nir Leshem, Lior Zimet
  • Publication number: 20230388241
    Abstract: An apparatus includes an interface circuit and an encoder circuit. The interface circuit is configured to send a data packet via a plurality of segments, and to send an idle value via the plurality of segments when no data packet is available. The idle value is configured to cause a segment in a receiving apparatus to idle. The encoder circuit is configured to receive a particular data packet, and, if a portion of the particular data packet has a same value as the idle value for a subset of the plurality of segments, to replace at least a portion of the data packet with a mask value to generate a modified data packet. The mask value indicates how to recreate the particular data packet. The encoder circuit is further configured to send the modified data packet to the receiving apparatus via the plurality of segments of the interface circuit.
    Type: Application
    Filed: May 31, 2023
    Publication date: November 30, 2023
    Inventors: Dany Davidov, Nir Leshem, Mark Pilip, Sergio Kolor
  • Patent number: 11803471
    Abstract: An integrated circuit (IC) including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture. For example, the IC may include an interconnect fabric configured to provide communication between the one or more memory controller circuits and the processor cores, graphics processing units, and peripheral devices; and an off-chip interconnect coupled to the interconnect fabric and configured to couple the interconnect fabric to a corresponding interconnect fabric on another instance of the integrated circuit, wherein the interconnect fabric and the off-chip interconnect provide an interface that transparently connects the one or more memory controller circuits, the processor cores, graphics processing units, and peripheral devices in either a single instance of the integrated circuit or two or more instances of the integrated circuit.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: October 31, 2023
    Assignee: Apple Inc.
    Inventors: Per H. Hammarlund, Lior Zimet, Sergio Kolor, Sagi Lahav, James Vash, Gaurav Garg, Tal Kuzi, Jeffry E. Gonion, Charles E. Tucker, Lital Levy-Rubin, Dany Davidov, Steven Fishwick, Nir Leshem, Mark Pilip, Gerard R. Williams, III, Harshavardhan Kaushikkar, Srinivasa Rangan Sridharan
  • Patent number: 11706150
    Abstract: An apparatus includes an interface circuit and an encoder circuit. The interface circuit is configured to send a data packet via a plurality of segments, and to send an idle value via the plurality of segments when no data packet is available. The idle value is configured to cause a segment in a receiving apparatus to idle. The encoder circuit is configured to receive a particular data packet, and, if a portion of the particular data packet has a same value as the idle value for a subset of the plurality of segments, to replace at least a portion of the data packet with a mask value to generate a modified data packet. The mask value indicates how to recreate the particular data packet. The encoder circuit is further configured to send the modified data packet to the receiving apparatus via the plurality of segments of the interface circuit.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: July 18, 2023
    Assignee: Apple Inc.
    Inventors: Dany Davidov, Nir Leshem, Mark Pilip, Sergio Kolor
  • Patent number: 11693472
    Abstract: Various techniques and circuit implementations for power reduction management in integrated circuits are disclosed. Certain techniques include the implementation of rate control circuits to control a clock rate for circuits associated with a communication fabric in an integrated circuit. The clock rate may be reduced based trigger signals received from power delivery trigger circuits coupled to the integrated circuit and voltage regulators providing power to the integrated circuit. Additional techniques may include the use of rate limiter circuits in a memory pipeline.
    Type: Grant
    Filed: February 21, 2022
    Date of Patent: July 4, 2023
    Assignee: Apple Inc.
    Inventors: Ilya Granovsky, Doron Rajwan, Tal Kuzi, Nir Leshem, Lior Zimet
  • Publication number: 20230063331
    Abstract: Various techniques and circuit implementations for power reduction management in integrated circuits are disclosed. Certain techniques include the implementation of rate control circuits to control a clock rate for circuits associated with a communication fabric in an integrated circuit. The clock rate may be reduced based trigger signals received from power delivery trigger circuits coupled to the integrated circuit and voltage regulators providing power to the integrated circuit. Additional techniques may include the use of rate limiter circuits in a memory pipeline.
    Type: Application
    Filed: February 21, 2022
    Publication date: March 2, 2023
    Inventors: Ilya Granovsky, Doron Rajwan, Tal Kuzi, Nir Leshem, Lior Zimet
  • Publication number: 20230058989
    Abstract: An integrated circuit (IC) including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture. For example, the IC may include an interconnect fabric configured to provide communication between the one or more memory controller circuits and the processor cores, graphics processing units, and peripheral devices; and an off-chip interconnect coupled to the interconnect fabric and configured to couple the interconnect fabric to a corresponding interconnect fabric on another instance of the integrated circuit, wherein the interconnect fabric and the off-chip interconnect provide an interface that transparently connects the one or more memory controller circuits, the processor cores, graphics processing units, and peripheral devices in either a single instance of the integrated circuit or two or more instances of the integrated circuit.
    Type: Application
    Filed: August 22, 2022
    Publication date: February 23, 2023
    Inventors: Per H. Hammarlund, Lior Zimet, Sergio Kolor, Sagi Lahav, James Vash, Gaurav Garg, Tal Kuzi, Jeffry E. Gonion, Charles E. Tucker, Lital Levy-Rubin, Dany Davidov, Steven Fishwick, Nir Leshem, Mark Pilip, Gerard R. Williams, III, Harshavardhan Kaushikkar, Srinivasan Rangan Sridharan
  • Publication number: 20220321490
    Abstract: An apparatus includes an interface circuit and an encoder circuit. The interface circuit is configured to send a data packet via a plurality of segments, and to send an idle value via the plurality of segments when no data packet is available. The idle value is configured to cause a segment in a receiving apparatus to idle. The encoder circuit is configured to receive a particular data packet, and, if a portion of the particular data packet has a same value as the idle value for a subset of the plurality of segments, to replace at least a portion of the data packet with a mask value to generate a modified data packet. The mask value indicates how to recreate the particular data packet. The encoder circuit is further configured to send the modified data packet to the receiving apparatus via the plurality of segments of the interface circuit.
    Type: Application
    Filed: April 6, 2021
    Publication date: October 6, 2022
    Inventors: Dany Davidov, Nir Leshem, Mark Pilip, Sergio Kolor
  • Publication number: 20220284163
    Abstract: A system includes a first instance and a second instance of an integrated circuit. The integrated circuits include respective external interfaces with a physical pin layout having transmit and receive pins for a particular bus located in complementary positions relative to an axis of symmetry. The external interfaces of the first and second instances of the integrated circuit are positioned such that the transmit and receive pins for the given I/O signal on the first instance are aligned, respectively, with the receive and transmit pins for the given I/O signal on the second instance.
    Type: Application
    Filed: March 5, 2021
    Publication date: September 8, 2022
    Inventors: Sergio Kolor, Dany Davidov, Nir Leshem, Mark Pilip
  • Patent number: 8103806
    Abstract: A circuit capable of reading an input from a device on one pin of an integrated circuit package during one time period and either writing data to another device or reading an input from the other device through the same pin during another time period. In one exemplary implementation in which the one pin is used to write data to the other device, the circuit may sense when data is not being written and change the function of the one pin from that of an output pin to that of an input pin until such time as further data is to be written.
    Type: Grant
    Filed: May 23, 2008
    Date of Patent: January 24, 2012
    Assignee: Zoran Corporation
    Inventors: Liron Ain-Kedem, Nir Leshem