Abstract: The system includes a light source that emits partially coherent or coherent light split into a reference beam and an object beam and a stage that supports a workpiece in a path of the object beam, that is transmitted through the workpiece. The workpiece includes a vertical interconnect access (VIA) extending from a first side to a second side of the workpiece. A first beam splitter combines the reference beam with the object beam transmitted through the workpiece into a combined beam, and a camera detects the combined beam received. A processor generates an interference image of the workpiece based on the combined beam, determines amplitude and phase information of the object beam based on the interference image, generates a plurality of depth images of the workpiece based on the amplitude and phase information, and determines a critical dimension (CD) of the VIA based on the plurality of depth images.

Abstract: The system includes a light source that emits partially coherent or coherent light split into a reference beam and an object beam and a stage that supports a workpiece in a path of the object beam that is transmitted through the workpiece. A first beam splitter combines the reference beam with the object beam transmitted through the workpiece into a combined beam, and a camera detects the combined beam. A processor generates a first interference image of the workpiece based on the combined beam, determines amplitude and phase information of the object beam based on the first interference image, generates a plurality of depth images of the workpiece based on the amplitude and phase information, determines a focus score of each pixel of the plurality of depth images, and generates a first 3D map of the workpiece based on the focus scores, which includes depth-integrated refractive index (DIRI) information.

Abstract: Infrared radiation, and specifically short-wave infrared radiation, may be used as a heat source for an active thermography process in the context semiconductor inspection. Ultrasonic acoustic waves may also be used as a heat source for an active thermography process in the context of semiconductor inspection. Short-wave infrared interference may be used to detect dynamic temperature changes at internal surfaces of a semiconductor, and specifically near a semiconductor direct-bond interface. Either of the short-wave infrared radiation as the heat source or the ultrasonic acoustic waves as the heat source may be combined with the use of short-wave infrared interference to detect dynamic temperature changes, which allows for improved detection resolution. Short-wave infrared interference may also be used to directly detect subsurface voids at the semiconductor direct-bond interface. The short-wave infrared interference may or may not require thermal perturbation.

Abstract: A method for reconstructing a digital hologram of a surface having at least one three-dimensional feature thereon, including acquiring a digital hologram of the surface, reconstructing a wavefront based on the digital hologram, generating a phase map of at least a portion of the surface based on the wavefront, the phase map including phase ambiguities, obtaining at least one additional image of the surface, obtaining height data relating to the three-dimensional feature from the at least one additional image of the surface, the height data being obtained with a first precision, resolving the phase ambiguities based on the height data and deriving a height of the at least one three-dimensional feature based on the phase map following the resolving of the phase ambiguities therein, the height being derived with a second precision more precise than the first precision.

Abstract: The system includes a first laser light source configured to emit laser light, a first focusing lens configured to direct the laser light from the first laser light onto a first face of a workpiece, a thermal camera configured to capture a thermal image of a second face of the workpiece that is orthogonal to the first face, and a processor configured to identify a crack in the workpiece based on the thermal image.

Abstract: In the system, an illumination source emits light, a first beam splitter directs a portion of the light toward a sample and directs another portion of the light toward a reference surface that reflects the light back to the first beam splitter to be recombined with light reflected by the sample, at least one second beam splitter that directs n portions of the light toward n detectors, each of the n portions of the light having a preset phase shift and n?2, and a processor receives intensities of the n portions of the light. The processor calculates an interferogram envelope based on the intensities measured by the n detectors as the reference surface moves between a plurality of signal collection positions.

Abstract: A method for reconstructing a digital hologram of a surface having at least one three- dimensional feature thereon, including acquiring a digital hologram of the surface, reconstructing a wavefront based on the digital hologram, generating a phase map of at least a portion of the surface based on the wavefront, the phase map including phase ambiguities, obtaining at least one additional image of the surface, obtaining height data relating to the three-dimensional feature from the at least one additional image of the surface, the height data being obtained with a first precision, resolving the phase ambiguities based on the height data and deriving a height of the at least one three- dimensional feature based on the phase map following the resolving of the phase ambiguities therein, the height being derived with a second precision more precise than the first precision.

Abstract: The present invention relates to a new interferometric module which may be implemented as holographic/interferometric portable optical setups that are based on the interferometry with multiple wavelengths acquired simultaneously, without changing the imaging parameters, such as the magnification and the resolution, and recording the quantitative complex wave front (i.e. amplitude and phase) imaging in several wavelengths simultaneously. This may be used for multiple-wavelength phase unwrapping, for recording higher or optically thicker samples or for spectroscopic holography, without loss of camera frame rate due to wavelength scanning.

Abstract: The present invention relates to a new interferometric module which may be implemented as holographic/interferometric portable optical setups that are based on the interferometry with multiple wavelengths acquired simultaneously, without changing the imaging parameters, such as the magnification and the resolution, and recording the quantitative complex wave front (i.e. amplitude and phase) imaging in several wavelengths simultaneously. This may be used for multiple-wavelength phase unwrapping, for recording higher or optically thicker samples or for spectroscopic holography, without loss of camera frame rate due to wavelength scanning.