Abstract: A mobile wireless communications device may include a housing, an antenna carried by the housing, and a circuit board carried by the housing. The mobile wireless communications device may also include a power amplifier carried by the circuit board, an antenna switch carried by the circuit board and configured to selectively couple the power amplifier to the antenna, a first radio frequency (RF) shield covering the power amplifier and the antenna switch, and a second RF shield within the first RF shield and covering the antenna switch.

Abstract: A mobile wireless communications device may include a housing, an antenna carried by the housing, and a circuit board carried by the housing. The mobile wireless communications device may also include a power amplifier carried by the circuit board, an antenna switch carried by the circuit board and configured to selectively couple the power amplifier to the antenna, a first radio frequency (RF) shield covering the power amplifier and the antenna switch, and a second RF shield within the first RF shield and covering the antenna switch.

Abstract: A high flow polyphenylene ether resin composition comprises a blend of at least two polyphenylene ether resins, a first resin having an intrinsic viscosity of at least 0.3 dl/g, and a second resin having an intrinsic viscosity of less than 0.17 dl/g and preferably having a particle size of at least about 100 ?m. Fiber reinforced and flame retarded compositions exhibit high HDT values.

Abstract: A high flow polyphenylene ether resin composition comprises a blend of at least two polyphenylene ether resins, a first resin having an intrinsic viscosity of at least 0.3 dl/g, and a second resin having an intrinsic viscosity of less than 0.17 dl/g and preferably having a particle size of at least about 100 μm. Fiber reinforced and flame retarded compositions exhibit high HDT values.

Abstract: Carbon fiber-filled PC-ABS resin compositions which have improved electrical properties at a given level of carbon fibers, and which do not suffer from as significant a decrease in impact strength as would result from the introduction of generic carbon fibers are achieved using carbon fibers treated with a polyamide terpolymer binder. The bundles are dispersed within the PC-ABS blend. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include, but are not limited to electronic devices, dust handling equipment and notebook computer enclosures.

Abstract: Polyphenylene ether (PPE) compositions with good fire and flame-retardant characteristics utilize lower levels of organophosphate fire-retardant, and therefore do not suffer from the drawbacks of previously known fire- and flame-retardant PPE compositions. The compositions include (a) a polymer component containing at least 50% of a polyphenylene ether; (b) glass reinforcing fibers in an amount sufficient to increase the modulus and strength of the polymer component; (c) a fire retardant component which is preferably an organophosphate fire retardant; (d) an organoclay component in an amount effective to enhance the flame-retardant characteristics of the composition; and (e) a mineral component. Other conventional additives utilized in formulation of PPE may be included. The composition is made by mixing the ingredients and compounding into a composition which is suitable for injection molding.

Abstract: A high flow polyphenylene ether resin composition with improved HDT values and flame retardance comprising a blend of at least two polyphenylene ether resins, a first resin having an intrinsic viscosity of at least 0.3 dl/g, and a second resin having an intrinsic viscosity of less than 0.25 dl/g and preferably having a particle size of at least about 100 &mgr;m. The composition preferably contains less than 30 wt % of the low viscosity polyphenylene ether based on the weight of the total composition. Fiber reinforced and flame retarded compositions also exhibit high HDT values.

Abstract: Carbon fiber-filled, thermoplastic resin compositions having improved electrical properties at a given level of carbon fibers are formed from thermoplastic resin and carbon fibers associated into bundles with a binder. The thermoplastic resin and the binder are selected to be incompatible such that the adhesion of the fiber to the resin is poor. An exemplary composition is formed from a thermoplastic polymer selected from among polystyrene, high impact polystyrene, polycarbonate, polybutylene terephthalate, polyethylene terephthalate, polyphenylene ether, polyether imide and blends thereof; and carbon fibers associated into bundles with a polyamide terpolymer binder. The bundles are dispersed within the thermoplastic polymer. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include electronic devices, dust handling equipment and notebook computer enclosures.

Abstract: A high flow polyphenylene ether resin composition with improved HDT values and flame retardance comprising a blend of at least two polyphenylene ether resins, a first resin having an intrinsic viscosity of at least 0.3 dl/g, and a second resin having an intrinsic viscosity of less than 0.25 dl/g and preferably having a particle size of at least about 100 &mgr;m. The composition preferably contains less than 30 wt % of the low viscosity polyphenylene ether based on the weight of the total composition. Fiber reinforced and flame retarded compositions also exhibit high HDT values.

Abstract: Polyphenylene ether (PPE) compositions with good fire and flame-retardant characteristics utilize lower levels of organophosphate fire-retardant, and therefore do not suffer from the drawbacks of previously known fire- and flame-retardant PPE compositions.

Abstract: Carbon fiber-filled PC-ABS resin compositions which have improved electrical properties at a given level of carbon fibers, and which do not suffer from as significant a decrease in impact strength as would result from the introduction of generic carbon fibers are achieved using carbon fibers treated with a polyamide terpolymer binder. The bundles are dispersed within the PC-ABS blend. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include, but are not limited to electronic devices, dust handling equipment and notebook computer enclosures.

Abstract: Carbon fiber-filled, thermoplastic resin compositions having improved electrical properties at a given level of carbon fibers are formed from thermoplastic resin and carbon fibers associated into bundles with a binder. The thermoplastic resin and the binder are selected to be incompatible such that the adhesion of the fiber to the resin is poor. An exemplary composition is formed from a thermoplastic polymer selected from among polystyrene, high impact polystyrene, polycarbonate, polybutylene terephthalate, polyethylene terephthalate, polyphenylene ether, polyether imide and blends thereof; and carbon fibers associated into bundles with a polyamide terpolymer binder. The bundles are dispersed within the thermoplastic polymer. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include electronic devices, dust handling equipment and notebook computer enclosures.

Abstract: Carbon fiber-filled, thermoplastic resin compositions having improved electrical properties at a given level of carbon fibers are formed from thermoplastic resin and carbon fibers associated into bundles with a binder. The thermoplastic resin and the binder are selected to be incompatible such that the adhesion of the fiber to the resin is poor. An exemplary composition is formed from a thermoplastic polymer selected from among polystyrene, high impact polystyrene, polycarbonate, polybutylene terephthalate, polyethylene terephthalate, polyphenylene ether, polyether imide and blends thereof; and carbon fibers associated into bundles with a polyamide terpolymer binder. The bundles are dispersed within the thermoplastic polymer. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include electronic devices, dust handling equipment and notebook computer enclosures.

Abstract: Carbon fiber-filled PC-ABS resin compositions which have improved electrical properties at a given level of carbon fibers, and which do not suffer from as significant a decrease in impact strength as would result from the introduction of generic carbon fibers are achieved using carbon fibers treated with a polyamide terpolymer binder. The bundles are dispersed within the PC-ABS blend. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include, but are not limited to electronic devices, dust handling equipment and notebook computer enclosures.