Patents by Inventor Nirmala HJ

Nirmala HJ has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11852550
    Abstract: Example apparatuses and systems for a combined temperature and pressure sensing device with improved electronic protection are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.
    Type: Grant
    Filed: January 26, 2023
    Date of Patent: December 26, 2023
    Assignee: Honeywell International Inc.
    Inventors: Palani Thanigachalam, Vijayakumar S, Nirmala HJ
  • Publication number: 20230168140
    Abstract: Example methods, apparatuses and systems for a combined temperature and pressure sensing device are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.
    Type: Application
    Filed: January 26, 2023
    Publication date: June 1, 2023
    Inventors: Palani THANIGACHALAM, Vijayakumar S, Nirmala HJ
  • Publication number: 20220244125
    Abstract: Example methods, apparatuses and systems for a combined temperature and pressure sensing device are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.
    Type: Application
    Filed: February 2, 2021
    Publication date: August 4, 2022
    Inventors: Palani THANIGACHALAM, Vijayakumar S, Nirmala HJ