Patents by Inventor Niro Katane

Niro Katane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Aperture plate and a method of manufacturing the same
    Patent number: 5520297
    Abstract: A semiconductor substrate has a plurality of chip portions and chip separating portions for partitioning the plurality of chip portions into each other. The plurality of chip portions and the separating portions are etched on one side of the semiconductor substrate so that each of the plurality of chip portions is provided with stencil patterns. Furthermore, the plurality of chip portions and chip separating portions are etched on the other side of the semiconductor substrate so that the stencil patterns are exposed and the plurality of chip portions are capable of being substantially separated from each other.
    Type: Grant
    Filed: June 14, 1994
    Date of Patent: May 28, 1996
    Assignee: Hitachi, Ltd.
    Inventors: Teruyuki Kagami, Sakae Yaita, Niro Katane, Mitsuo Tanabe, Yoshinori Nakayama, Hidetoshi Satoh