Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed are electrode materials that exhibit very sharp pore size distribution within the range of mesopores and include pores having a pore diameter within a range of X±&agr; nm (3.0≦X<10, &agr;=1.0; range of pore size distribution) of which volume accounts for 15% or more of the total volume of mesopores having a pore diameter within a range from 2.0 to 50 nm, and are suited for use in electric double layer capacitor, battery or the like of large capacitance and discharge of large current. These electrode materials are obtained by adding at least one transition metal or at least one transition metal compound to a carbon material or a carbon material precursor, and subjecting to a heat treatment at a temperature of 600° C. or higher.

Abstract: A molecular sieving carbon characterized by (A) having a structure in which a number of spherical carbonaceous particles having a particle diameter of 0.8 to 120 micrometers overlap and coalesce three-dimensionally at random, (B) in which continuous pathways running three-dimensionally at random exist between a number of the carbonaceous particles, (C) in which a number of the carbonaceous particles have each a number of micropores communicating with the pathways existing between the particles, and (D) having a carbon content of at least 85% by weight. The molecular sieving carbon is useful for obtaining, for example, a nitrogen gas, oxygen gas or gaseous mixture enriched with either the nitrogen gas or the oxygen gas from a gaseous mixture containing the nitrogen gas and oxygen gas.

Abstract: A molecular sieving carbon characterized by (A) having a structure in which a number of spherical carbonaceous particles having a particle diameter of 0.8 to 120 micrometers overlap and coalesce three-dimensionally at random, (B) in which continuous pathways running three-dimensionally at random exist between a number of the carbonaceous particles, (C) in which a number of the carbonaceous particles have each a number of micropores communicating with the pathways existing between the particles, and (D) having a carbon content of at least 85% by weight. The molecular sieving carbon is useful for obtaining, for example, a nitrogen gas, oxygen gas or gaseous mixture enriched with either the nitrogen gas or the oxygen gas from a gaseous mixture containing the nitrogen gas and oxygen gas.