Patents by Inventor Niru Kumari

Niru Kumari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10401825
    Abstract: According to an example, a method for area occupancy information extraction may include receiving a signal from a sensor, and determining a number of occupants moving within a first area based on the signal. The method may further include determining when an occupant is moving and a direction of motion of the occupant based on the signal, and determining a most likely trajectory based on the direction of motion of the occupant. The method may also include controlling, by a processor, a service in the first area based on the determination of the number of occupants, the determination of when the occupant is moving and the direction of motion of the occupant, and/or the determination of the most likely trajectory.
    Type: Grant
    Filed: January 31, 2013
    Date of Patent: September 3, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Alan A. McReynolds, Cullen E. Bash, Niru Kumari, Geoff M. Lyon, Amip J. Shah, Zhikui Wang, Rongliang Zhou
  • Publication number: 20190227606
    Abstract: Apparatuses associated with liquid coolant supply are disclosed. One example apparatus is a computing cartridge which includes a first electronic device and a liquid-cooled cold plate. The computing cartridge also includes a first thermal couple between the first electronic device and the cold plate. The computing cartridge also includes an inlet fluid connector. The inlet fluid connector may supply a liquid coolant to the cold plate. The computing cartridge also includes an outlet fluid connector. The outlet fluid connector may facilitate return of the coolant from the cold plate.
    Type: Application
    Filed: March 29, 2019
    Publication date: July 25, 2019
    Inventors: John Franz, Tahir Cader, Cullen E. Bash, Niru Kumari, Sarah Anthony, Sergio Escobar-Vargas, Siamak Tavallaei
  • Publication number: 20190103290
    Abstract: In some examples, a multiple chip module (MCM) includes a heat sink; a circuit board; a first chip secured to a first location on the circuit board; a first vapor chamber thermally coupled to the first chip to pass heat generated by the first chip to the heat sink; a second chip secured to a second location on the circuit board; and a second vapor chamber thermally coupled to the second chip to pass heat generated by the second chip to the heat sink. In some examples, a portion of the second vapor chamber is positioned between a portion of the first vapor chamber and the heat sink. In some examples, the first vapor chamber is substantially thermally insulated from the second vapor chamber.
    Type: Application
    Filed: October 3, 2017
    Publication date: April 4, 2019
    Inventors: Ernesto Ferrer Medina, Niru Kumari, Chih C. Shih, Sergio Escobar-Vargas
  • Patent number: 9997434
    Abstract: An example device in accordance with an aspect of the present disclosure includes a substrate that may be disposed in a housing. The substrate includes a sprayer to spray coolant.
    Type: Grant
    Filed: May 19, 2014
    Date of Patent: June 12, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Niru Kumari, Tahir Cader, Sergio Escobar-Vargas, Cullen E. Bash
  • Patent number: 9953897
    Abstract: A device comprises a first layer of a die. The first layer comprises a microchannel. The microchannel is partially filled with a liquid and partially filled with air. The die also comprises a second layer. The second layer of the die seals a top of the microchannel of the first layer.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: April 24, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Niru Kumari, Sergio Escobar-Vargas
  • Publication number: 20180090415
    Abstract: Examples described herein include heat dissipating apparatuses with phase change material. In some examples, a heat dissipating apparatus comprises a wick structure to carry a cooling fluid to cool an electronic heat source, a vapor region to carry heated cooling fluid away from the wick structure, and a compartmentalized space separate from the vapor region comprising a phase change material to absorb energy from the heated cooling fluid.
    Type: Application
    Filed: September 27, 2016
    Publication date: March 29, 2018
    Inventors: Sergio Escobar-Vargas, Cullen E. Bash, Niru Kumari
  • Publication number: 20180025964
    Abstract: A device comprises a first layer of a die. The first layer comprises a microchannel. The microchannel is partially filled with a liquid and partially filled with air. The die also comprises a second layer. The second layer of the die seals a top of the microchannel of the first layer.
    Type: Application
    Filed: July 22, 2016
    Publication date: January 25, 2018
    Inventors: Niru Kumari, Sergio Escobar-Vargas
  • Patent number: 9713285
    Abstract: According to an example, a cooling system includes a cooling fluid reservoir, a cooling apparatus in fluid communication with the cooling fluid reservoir, a chamber having a side in thermal contact with a portion of the heat generating component, in which cooling fluid delivered by the cooling apparatus is to be heated through receipt of heat from the heat generating component, a cooling plate positioned at a distance and separated from the chamber, and a cooling fluid tube connecting the chamber and the cooling plate, in which the heated cooling fluid is to flow through the cooling fluid tube to the cooling plate. The cooling plate is also to be in thermal contact with a heat exchanger that that is to remove heat from the cooling fluid.
    Type: Grant
    Filed: March 29, 2013
    Date of Patent: July 18, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Tahir Cader, Niru Kumari, John Franz, Cullen E. Bash, David A. Moore, Sergio Escobar-Vargas
  • Publication number: 20170084514
    Abstract: An example device in accordance with an aspect of the present disclosure includes a substrate that may be disposed in a housing. The substrate includes a sprayer to spray coolant.
    Type: Application
    Filed: May 19, 2014
    Publication date: March 23, 2017
    Inventors: Niru Kumari, Tahir Cader, Sergio Escobar-Vargas, Cullen E. Bash
  • Publication number: 20170017277
    Abstract: Apparatuses associated with liquid coolant supply are disclosed. One example apparatus is a computing cartridge which includes a first electronic device and a liquid-cooled cold plate. The computing cartridge also includes a first thermal couple between the first electronic device and the cold plate. The computing cartridge also includes an inlet fluid connector. The inlet fluid connector may supply a liquid coolant to the cold plate The computing cartridge also includes an outlet fluid connector. The outlet fluid connector may facilitate return of the coolant from the cold plate.
    Type: Application
    Filed: April 11, 2014
    Publication date: January 19, 2017
    Inventors: John FRANZ, Tahir CADER, Cullen E BASH, Niru KUMARI, Sarah ANTHONY, Sergio ESCOBAR-VARGAS, Siamak TAVALLAEI
  • Publication number: 20160066472
    Abstract: According to an example, a cooling system includes a cooling fluid reservoir, a cooling apparatus in fluid communication with the cooling fluid reservoir, a chamber having a side in thermal contact with a portion of the heat generating component, in which cooling fluid delivered by the cooling apparatus is to be heated through receipt of heat from the heat generating component, a cooling plate positioned at a distance and separated from the chamber, and a cooling fluid tube connecting the chamber and the cooling plate, in which the heated cooling fluid is to flow through the cooling fluid tube to the cooling plate. The cooling plate is also to be in thermal contact with a heat exchanger that that is to remove heat from the cooling fluid.
    Type: Application
    Filed: March 29, 2013
    Publication date: March 3, 2016
    Inventors: Tahir Cader, Niru Kumari, John Franz, Cullen E. Bash, David A. Moore, Sergio Escobar-Vargas
  • Publication number: 20150362909
    Abstract: According to an example, a method for area occupancy information extraction may include receiving a signal from a sensor, and determining a number of occupants moving within a first area based on the signal. The method may further include determining when an occupant is moving and a direction of motion of the occupant based on the signal, and determining a most likely trajectory based on the direction of motion of the occupant. The method may also include controlling, by a processor, a service in the first area based on the determination of the number of occupants, the determination of when the occupant is moving and the direction of motion of the occupant, and/or the determination of the most likely trajectory.
    Type: Application
    Filed: January 31, 2013
    Publication date: December 17, 2015
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Alan A. McReynolds, Cullen E. Bash, Niru Kumari, Geoff M. Lyon, Amip J. Shah, Zhikui Wang, Rongliang Zhou
  • Patent number: 9015725
    Abstract: A data center workload distribution management system includes a cooling cost engine to determine a cooling cost or cooling capacity for each of a plurality of zones of a data center and a workload distribution engine. The workload distribution engine is to identify the zone that has a lowest cooling cost and sufficient cooling capacity and also has sufficient processing capacity for a workload, determine a local cooling efficiency index for at least one location within the identified zone, and distribute the workload to the location having a local cooling efficiency index that indicates the highest cooling efficiency.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: April 21, 2015
    Assignee: Hewlett-Packard Development Company, L. P.
    Inventors: Yuan Chen, Zhikui Wang, Cullen E. Bash, Alan A. McReynolds, Niru Kumari, Chris D. Hyser
  • Publication number: 20140278692
    Abstract: In a method for managing a facility that is to receive resources from a first resource supply, a supply of resources available from the first resource supply is predicted for a predetermined period of time. In addition, a demand for resources in the facility during the predetermined period of time is predicted. A capacity schedule for the facility is planned to meet a predefined operational goal, in which the plan of the capacity schedule uses as inputs, the predicted supply of resources available from the first resource supply and the predicted demand for resources in the facility during the predetermined period of time. Moreover, a determination as to whether the planned capacity schedule meets the predefined operational goal is made.
    Type: Application
    Filed: December 23, 2011
    Publication date: September 18, 2014
    Inventors: Manish Marwah, Alan A. McReynolds, Amip J. Shah, Zhikui Wang, Chandrakant Patel, Daniel Juergen Gmach, Chris D. Hyser, Niru Kumari, Zhenhua Liu, Cullen E. Bash, Martin Arlitt, Sergey Blagodurov, Yuan Chen, Thomas W. Christian
  • Publication number: 20140040899
    Abstract: A data center workload distribution management system includes a cooling cost engine to determine a cooling cost or cooling capacity for each of a plurality of zones of a data center and a workload distribution engine. The workload distribution engine is to identify the zone that has a lowest cooling cost and sufficient cooling capacity and also has sufficient processing capacity for a workload, determine a local cooling efficiency index for at least one location within the identified zone, and distribute the workload to the location having a local cooling efficiency index that indicates the highest cooling efficiency.
    Type: Application
    Filed: July 31, 2012
    Publication date: February 6, 2014
    Inventors: Yuan CHEN, Zhikui Wang, Cullen E. Bash, Alan A. McReynolds, Niru Kumari, Chris D. Hyser
  • Patent number: 8632670
    Abstract: Apparatus and methods for controllably wetting a microstructured surface.
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: January 21, 2014
    Assignee: Purdue Research Foundation
    Inventors: Suresh V. Garimella, Hemanth Kumar Dhavaleswarapu, Niru Kumari
  • Publication number: 20130110306
    Abstract: Systems and methods of managing multiple cooling systems in a facility are disclosed. An example method may include evaluating efficiency of multiple cooling systems for a runtime operating condition. The method may also include selecting an efficient operating configuration of the multiple cooling systems for the runtime operating condition.
    Type: Application
    Filed: October 26, 2011
    Publication date: May 2, 2013
    Inventors: Zhikui Wang, Cullen E. Bash, Niru Kumari, Amip J. Shah, Tahir Cader
  • Publication number: 20110303541
    Abstract: Apparatus and methods for controllably wetting a microstructured surface.
    Type: Application
    Filed: April 13, 2011
    Publication date: December 15, 2011
    Applicant: PURDUE RESEARCH FOUNDATION
    Inventors: Suresh V. Garimella, Hemanth Kumar Dhavaleswarapu, Niru Kumari