Patents by Inventor Nirup K. Nagabandi

Nirup K. Nagabandi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10731269
    Abstract: Inefficient dissipation of heat limits the performance of electronic devices. Thermal interface materials (TIMs) can be used in electronic devices to dissipate heat more effectively and efficiently. Nanocomposites have been prepared using functionalized boron nitride nanosheets (BNNS). The incorporation of soft-ligand functionalized BNNS in a metal matrix was used to nanofabricate kinetically-trapped nanocomposites TIMs.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: August 4, 2020
    Assignee: THE TEXAS A&M UNIVERSITY SYSTEM
    Inventors: Mustafa Akbulut, Cengiz Yegin, Nirup K. Nagabandi, Blake Teipel
  • Publication number: 20180216248
    Abstract: Inefficient dissipation of heat limits the performance of electronic devices. Thermal interface materials (TIMs) can be used in electronic devices to dissipate heat more effectively and efficiently. Nanocomposites have been prepared using functionalized boron nitride nanosheets (BNNS). The incorporation of soft-ligand functionalized BNNS in a metal matrix was used to nanofabricate kinetically-trapped nanocomposites TIMs.
    Type: Application
    Filed: March 17, 2016
    Publication date: August 2, 2018
    Applicant: The Texas A&M University System
    Inventors: Mustafa Akbulut, Cengiz Yegin, Nirup K. Nagabandi, Blake Teipel