Patents by Inventor Nirupama Vaidya

Nirupama Vaidya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12584061
    Abstract: A system for consolidating particles in a subterranean formation includes a treatment fluid (e.g., a consolidation fluid) having a viscosity lower than 5 cP. The treatment fluid includes a resin system, a surfactant, and a curing agent. A method for consolidating particles in a subterranean formation includes preparing the treatment fluid, introducing the treatment fluid into the subterranean formation, and allowing the treatment fluid to cure to consolidate the particles in the subterranean formation.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: March 24, 2026
    Assignee: Schlumberger Technology Corporation
    Inventors: Nirupama Vaidya, Rasika Prabhu, Patrice Abivin
  • Publication number: 20260043316
    Abstract: A method includes placing, via a bailer, a slurry into a wellbore to deposit a slurry downhole. The slurry includes a solids mixture and a fluid. The method also includes terminating placement of the slurry for a period of time. A viscous pill inhibits settling of the solids mixture, and the slurry displaces the viscous pill in contact with a surface of a screen.
    Type: Application
    Filed: October 17, 2025
    Publication date: February 12, 2026
    Inventors: Juan-Carlos Santamaria, Kinga Hendum, Nirupama Vaidya, Elvin Yusifzada, Balkrishna Gadiyar, Christopher Daeffler
  • Patent number: 12448871
    Abstract: A method includes placing, via a bailer, a slurry into a wellbore to deposit a slurry downhole. The slurry includes a solids mixture and a fluid. The method also includes terminating placement of the slurry for a period of time. A viscous pill inhibits settling of the solids mixture, and the slurry displaces the viscous pill in contact with a surface of a screen.
    Type: Grant
    Filed: July 2, 2024
    Date of Patent: October 21, 2025
    Assignee: Schlumberger Technology Corporation
    Inventors: Juan-Carlos Santamaria, Kinga Hendum, Nirupama Vaidya, Elvin Yusifzada, Balkrishna Gadiyar, Christopher Daeffler
  • Publication number: 20250320403
    Abstract: A system for consolidating particles in a subterranean formation includes a treatment fluid (e.g., a consolidation fluid) having a viscosity lower than 5 cP. The treatment fluid includes a resin system, a surfactant, and a curing agent. A method for consolidating particles in a subterranean formation includes preparing the treatment fluid, introducing the treatment fluid into the subterranean formation, and allowing the treatment fluid to cure to consolidate the particles in the subterranean formation.
    Type: Application
    Filed: December 7, 2022
    Publication date: October 16, 2025
    Inventors: Nirupama Vaidya, Rasika Prabhu, Patrice Abivin
  • Publication number: 20250043661
    Abstract: A method includes placing, via a bailer, a slurry into a wellbore to deposit a slurry downhole. The slurry includes a solids mixture and a fluid. The method also includes terminating placement of the slurry for a period of time. A viscous pill inhibits settling of the solids mixture, and the slurry displaces the viscous pill in contact with a surface of a screen.
    Type: Application
    Filed: July 2, 2024
    Publication date: February 6, 2025
    Inventors: Juan-Carlos Santamaria, Kinga Hendum, Nirupama Vaidya, Elvin Yusifzada, Balkrishna Gadiyar, Christopher Daeffler