Patents by Inventor Nish ANANTHAKRISHNAN

Nish ANANTHAKRISHNAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • NO-FLOW ADHESIVE FOR SECOND AND THIRD LEVEL INTERCONNECTS
    Publication number: 20180324955
    Abstract: An apparatus is described. The apparatus includes a first planar board to second planar board interface. The first planar board to second planar board interface includes a reflowed solder electrical connection structure between the first and second boards and a no flow adhesive. The reflowed solder electrical connection structure includes a reflowed solder ball and a reflowed tinned pad.
    Type: Application
    Filed: December 23, 2015
    Publication date: November 8, 2018
    Inventors: Mohit SOOD, Huili XU, Wei TAN, Suriyakala RAMALINGAM, Jan KRAJNIAK, Nish ANANTHAKRISHNAN