Patents by Inventor Nisha Pillai

Nisha Pillai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9570291
    Abstract: Semiconductor substrates and methods for processing semiconductor substrates are provided. A method for processing a semiconductor substrate includes providing a semiconductor substrate having an outer edge, a central region, and a peripheral region between the outer edge and the central region. The semiconductor substrate also has an upper surface. The method includes forming an amorphous material over the upper surface of the semiconductor substrate in the peripheral region. Also, the method includes irradiating the upper surface of the semiconductor substrate, wherein the amorphous material inhibits cracking at the outer edge of the semiconductor substrate.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: February 14, 2017
    Assignee: GLOBALFOUNDRIES, INC.
    Inventors: Shishir Ray, Sandeep Gaan, Sheldon Meyers, Nisha Pillai, Edmund Kenneth Banghart, Kyle Jung
  • Publication number: 20170018426
    Abstract: Semiconductor substrates and methods for fabricating integrated circuits are provided. A method for fabricating an integrated circuit includes providing a semiconductor substrate having an outer edge, a central region, and a peripheral region between the outer edge and the central region. The semiconductor substrate also has an upper surface. The method includes forming an amorphous material over the upper surface of the semiconductor substrate in the peripheral region. Also, the method includes irradiating the upper surface of the semiconductor substrate, wherein the amorphous material inhibits cracking at the outer edge of the semiconductor substrate.
    Type: Application
    Filed: July 14, 2015
    Publication date: January 19, 2017
    Inventors: Shishir Ray, Sandeep Gaan, Sheldon Meyers, Nisha Pillai, Edmund Kenneth Banghart, Kyle Jung
  • Publication number: 20070011080
    Abstract: A system and method for implementing a double-sided exchange. In an illustrative embodiment, the double-sided exchange may be an exchange wherein both buyers and sellers provide bids for matching via the exchange. A first interface receives one or more buy bids from one or more buyers and a second interface receives one or more sell bids from one or more sellers. A controller matches the one or more sell bids with the one or more buy bids, yielding one or more matched buy bids and one or more matched sell bids in response thereto so that allocations of the matched one or more buy bids and the one or more matched sell bids maximize a surplus of the exchange. Certain embodiments of the present invention may provide an allocation that substantially maximizes an auctioneer's profit and/or announces payments based on one or more sell bids. The announced allocations and prices can be shown to be a substantially competitive equilibrium in some applications.
    Type: Application
    Filed: March 23, 2006
    Publication date: January 11, 2007
    Applicant: The Regents of the University of California
    Inventors: Rahul Jain, Charis Kaskiris, Pravin Varaiya, Jun Shu, Ram Rajagopal, Nisha Pillai