Abstract: Systems and methods for facilitating authentication of an electronic device accessing plurality of mobile applications are disclosed. The system may receive a device public key and authentication information of the electronic device. The system may validate the authentication information to initiate a device session with the electronic device and create an authentication token signed with a server signature. The system may enable the electronic device to access a first mobile application based on the authentication information validated. Further, the system may receive the authentication token signed with a device signature. The system may authorize the authentication token by verifying the device signature and the server signature on the authentication token with a device public key and a server public key respectively. The system may then enable the electronic device to access the second mobile application using the authentication token authorized.

Abstract: Systems and methods for facilitating authentication of an electronic device accessing plurality of mobile applications are disclosed. The system may receive a device public key and authentication information of the electronic device. The system may validate the authentication information to initiate a device session with the electronic device and create an authentication token signed with a server signature. The system may enable the electronic device to access a first mobile application based on the authentication information validated. Further, the system may receive the authentication token signed with a device signature. The system may authorize the authentication token by verifying the device signature and the server signature on the authentication token with a device public key and a server public key respectively. The system may then enable the electronic device to access the second mobile application using the authentication token authorized.

Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, a method of forming an electrical connecting device includes the steps of: depositing an elastomeric material on an electrically insulating carrier; and metallizing the elastomeric material so as to form an electrically conductive layer running continuously through a plane of the carrier and along a surface of the elastomeric material.

Abstract: A probe structure for an electronic device is provided. In one aspect, the probe structure includes an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure includes an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. The probe structure includes one or more other contact structures adapted for connection to a test apparatus.

Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.

Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, a method of forming an electrical connecting device includes the steps of: depositing an elastomeric material on an electrically insulating carrier; and metallizing the elastomeric material so as to form an electrically conductive layer running continuously through a plane of the carrier and along a surface of the elastomeric material.

Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.

Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.

Abstract: A probe structure for an electronic device is provided. In one aspect, the probe structure includes an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure includes an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. The probe structure includes one or more other contact structures adapted for connection to a test apparatus.

Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.