Patents by Inventor Nishi Kunihiko

Nishi Kunihiko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and its manufacturing method
    Publication number: 20030207572
    Abstract: The occurrence of a package crack in the back vicinity of a die pad is restrained by making the outward appearance of the die pad of a lead frame smaller than that of a semiconductor chip which is mounted on it, and also the occurrence of a package crack in the main surface vicinity of the semiconductor chip is restrained by forming a layer of organic material with good adhesion property with the resin that constitutes the package body on the final passivation film (final passivation film) that covers the top layer of conductive wirings of the semiconductor chip.
    Type: Application
    Filed: May 15, 2003
    Publication date: November 6, 2003
    Inventors: Miyaki Yoshinori, Suzuki Hiromichi, Suzuki Kazunari, Nishita Takafumi, Ito Fujio, Tsubosaki Kunihiro, Kameoka Akihiko, Nishi Kunihiko