Patents by Inventor Nishihata Hideki

Nishihata Hideki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method Of Producing Bonded Wafer
    Publication number: 20090280621
    Abstract: In a method of producing a bonded wafer, a volume fraction of SiO2 particles dispersed into silicon in an oxygen ion implanted layer formed at a step of implanting oxygen ions into a wafer for active layer and a subsequent heat treatment step is set to not less than 30% but not more than 80%; and at a step of thinning a portion of the wafer for active layer, the oxygen ion implanted layer formed in the above step is used as a polishing stop layer to polish at least the portion of the wafer for active layer.
    Type: Application
    Filed: May 6, 2009
    Publication date: November 12, 2009
    Applicant: Sumco Corporation
    Inventors: Akihiko Endo, Nishihata Hideki