Abstract: A seat assembly, and method of operation, including a lateral support beans located adjacent to a seat back and having a pair of forward extending arms extending on opposite sides of a seat occupant's head, with each of the arms including a microphone fixed in the arm, flush with a passenger facing surface of the respective arm and located between a respective ear and a mouth of an occupant's head, and a speaker mounted in the arm adjacent to a respective one of the ears of the occupant's head; wherein at least one of the microphones communicates with a controller that actuates vehicle functions based on voice commands received from the microphone, and wherein each of the microphones and the speaker corresponding to each microphone communicate with an active noise cancelation system such that ambient noise detected by each of the microphones is canceled out by the corresponding speaker.

Abstract: A tin-based solder melt or aqueous tin plating bath composition comprising a source of tin and a stabilizing additive of chemical structure: wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, and R10 are independently selected from hydrogen atom, hydrocarbon groups R having at least one and up to twelve carbon atoms, groups OR? wherein R? is selected from hydrogen atom and hydrocarbon groups R, and halogen atoms, and wherein any two, three, or four of R1, R2, R3, R4, and R5 or any two, three, or four of R6, R7, R8, R9, and R10 are optionally interconnected to form a fused ring system; R11 and R12 are independently selected from hydrogen atom and hydrocarbon groups R; and r is either 0 or 1. Methods for coating and/or bonding metal substrates by use of the above-described solder compositions are also described.

Abstract: A tin-based solder melt or aqueous tin plating bath composition comprising a source of tin and a stabilizing additive of chemical structure: wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, and R10 are independently selected from hydrogen atom, hydrocarbon groups R having at least one and up to twelve carbon atoms, groups OR? wherein R? is selected from hydrogen atom and hydrocarbon groups R, and halogen atoms, and wherein any two, three, or four of R1, R2, R3, R4, and R5 or any two, three, or four of R6, R7, R8, R9, and R10 are optionally interconnected to form a fused ring system; R11 and R12 are independently selected from hydrogen atom and hydrocarbon groups R; and r is either 0 or 1. Methods for coating and/or bonding metal substrates by use of the above-described solder compositions are also described.

Abstract: A semiconductor wafer includes a nonstick region. During integrated circuit fabrication processes, the wafer may be inserted into an electrodeposition (e.g. plating, etc.) tool. The tool may contact the nonstick region to e.g. prevent leaks, prevent plating upon a shorting layer of the wafer, etc. When the wafer is removed the nonstick region has a propensity to not transfer to the tool, improving tool availability and reducing wafer scraps. The nonstick region may contain a nonstick seal formed from a liquid photoresist based material, an organic dielectric, etc.

Abstract: A method of posting a payment from a payor comprises creating a payment record, identifying a set of charges to which the payment is applied to, comparing the set of charges to the payment record, and creating an exception record based on the payment record and the set of charges. Once a payment is posted a user is presented with an option to write-off the exception record. Alternatively, a user may also alter a set of charges applied to the account based on the exception record.