Patents by Inventor Nitin Parbhoo

Nitin Parbhoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polymeric edge seal for bonded substrates
    Patent number: 8894800
    Abstract: A layer of polymer material is applied on a peripheral region of at least one of the two substrates to be bonded prior to bonding. The bonded structure formed thereby includes a first substrate, a second substrate in direct contact with the first substrate, and a ring of the polymer material in direct contact with the first substrate at a first interface and in direct contact with the second substrate. The ring of polymer material laterally surrounds and seals the interface at which the first substrate contacts the second substrate. A ring-shaped cavity can be formed within the polymeric ring. Alternately, the first interface and the second interface can be contiguous without a ring-shaped cavity between the first and second substrates.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: November 25, 2014
    Assignee: International Business Machines Corporation
    Inventors: Mutka G. Farooq, Thomas F. Houghton, Nitin Parbhoo, Richard P. Volant
  • Polymeric edge seal for bonded substrates
    Patent number: 8613996
    Abstract: A layer of polymer material is applied on a peripheral region of at least one of the two substrates to be bonded prior to bonding. The bonded structure formed thereby includes a first substrate, a second substrate in direct contact with the first substrate, and a ring of the polymer material in direct contact with the first substrate at a first interface and in direct contact with the second substrate. The ring of polymer material laterally surrounds and seals the interface at which the first substrate contacts the second substrate. A ring-shaped cavity can be formed within the polymeric ring. Alternately, the first interface and the second interface can be contiguous without a ring-shaped cavity between the first and second substrates.
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: December 24, 2013
    Assignee: International Business Machines Corporation
    Inventors: Mukta G. Farooq, Thomas F. Houghton, Nitin Parbhoo, Richard P. Volant
  • POLYMERIC EDGE SEAL FOR BONDED SUBSTRATES
    Publication number: 20110091685
    Abstract: A layer of polymer material is applied on a peripheral region of at least one of the two substrates to be bonded prior to bonding. The bonded structure formed thereby includes a first substrate, a second substrate in direct contact with the first substrate, and a ring of the polymer material in direct contact with the first substrate at a first interface and in direct contact with the second substrate. The ring of polymer material laterally surrounds and seals the interface at which the first substrate contacts the second substrate. A ring-shaped cavity can be formed within the polymeric ring. Alternately, the first interface and the second interface can be contiguous without a ring-shaped cavity between the first and second substrates.
    Type: Application
    Filed: October 21, 2009
    Publication date: April 21, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Mukta G. Farooq, Thomas F. Houghton, Nitin Parbhoo, Richard P. Volant