Abstract: Provided is, among other things, a dry deposition apparatus for depositing grains on a substrate comprising: an electrostatic chuck having one or more collection zones, wherein the substrate is layered on the chuck for processing; a charged grain delivery apparatus for directing charged grains for electrostatic deposition on the substrate at the locations of the collection zones; and an optical detection device for quantifying the amount of grains deposited.

Abstract: Provided is, among other things, a dry deposition apparatus for depositing grains on a substrate comprising:

Abstract: Provided is a method using a dry deposition apparatus for depositing grains on a substrate comprising: an electrostatic chuck having one or more collection zones, wherein the substrate is layered on the chuck for processing; a charged grain delivery apparatus for directing charged grains for electrostatic deposition on the substrate at the locations of the collection zones; and an optical detection device for quantifying the amount of grains deposited.

Abstract: AC waveforms biasing of bead transporter chucks and their accumulated charge sensing circuits tailored for low resistivity substrates and beads where if traditional DC quasi-static biasing potentials were used, the bead attraction potentials of the chuck would undergo rapid RC decay and cause the bead transporter chuck to stop working. Methods for selecting AC waveforms are given, including those that maximize the time average of the bead attraction potential at the bead collection zone of the bead contact surface.

Abstract: AC waveforms biasing of bead transporter chucks and their accumulated charge sensing circuits tailored for low resistivity substrates and beads where if traditional DC quasi-static biasing potentials were used, the bead attraction potentials of the chuck would undergo rapid RC decay and cause the bead transporter chuck to stop working. Methods for selecting AC waveforms are given, including those that maximize the time average of the bead attraction potential at the bead collection zone of the bead contact surface.

Abstract: A substrate is robotically picked up at a station and transported to a measuring station to measure the distance to a reference. The substrate is aligned to a robot before measurement. The measured substrate is then transported to a pharmaceutical or diagnostic powder/grain deposition station where the powder/grains are controllably deposited on the substrate to predetermined thicknesses over a plurality of powder/grain collection zones. The deposited powder/grains are then measured to determine the thickness and area covered by the deposited powder/grains at each collection zone. The substrate is then transported to a lamination station and each collection zone of powder/grains is welded to a cover substrate. The system remembers which collection zones are out of specification so that they can be later selectively discarded.

Abstract: A substrate is roboticaly picked up at a station and transported to a measuring station to measure the distance to a reference. The substrate is aligned to a robot before measurement. The measured substrate is then transported to a pharmaceutical or diagnostic powder/grain deposition station where the powder/grains are controllably deposited on the substrate to predetermined thicknesses over a plurality of powder/grain collection zones. The deposited powder/grains are then measured to determine the thickness and area covered by the deposited powder/grains at each collection zone. The substrate is then transported to a lamination station and each collection zone of powder/grains is welded to a cover substrate. The system remembers which collection zones are out of specification so that they can be later selectively discarded.

Abstract: AC waveforms biasing of bead transporter chucks and their accumulated charge sensing circuits tailored for low resistivity substrates and beads where if traditional DC quasi-static biasing potentials were used, the bead attraction potentials of the chuck would undergo rapid RC decay and cause the bead transporter chuck to stop working. Methods for selecting AC waveforms are given, including those that maximize the time average of the bead attraction potential at the bead collection zone of the bead contact surface.

Abstract: AC waveforms biasing of bead transporter chucks and their accumulated charge sensing circuits tailored for low resistivity substrates and beads where if traditional DC quasi-static biasing potentials were used, the bead attraction potentials of the chuck would undergo rapid RC decay and cause the bead transporter chuck to stop working. Methods for selecting AC waveforms are given, including those that maximize the time average of the bead attraction potential at the bead collection zone of the bead contact surface.

Abstract: Provided is, among other things, a dry deposition apparatus for depositing grains on a substrate comprising:an electrostatic chuck having one or more collection zones, wherein the substrate is layered on the chuck for processing;a charged grain delivery apparatus for directing charged grains for electrostatic deposition on the substrate at the locations of the collection zones; andan optical detection device for quantifying the amount of grains deposited.

Abstract: A tamper detection device can determine whether a housing containing a device has been tampered with either by having the housing penetrated or by an attempt to remove a cover from the housing. The tamper detection device may be a capacitor which is placed across a portion of the housing and whose capacitance changes if it is penetrated. The temper detection device may also be a flexible circuit having conductive strips thereon forming a circuit with means to cause an open circuit if the housing is penetrated or the cover removed from the housing.

Abstract: This invention pertains to a method of transferring a surface relief pattern from a poly(olefin sulfone) layer to a metal layer wherein the poly(olefin sulfone) layer is exposed to ultra violet radiation prior to sputter etching the surface relief pattern into the metal layer.