Patents by Inventor Nizamuddin SHAIK

Nizamuddin SHAIK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HIGH SPEED GRID ARRAY MODULE
    Publication number: 20220272880
    Abstract: A system board includes a module board that connects to the system board with an interposer having compressible connectors. The module board can further be covered by a shield that has a metal alloy having an element to provide good electrical conductivity and an element to provide structural integrity and heat transfer. The module board can further include gaskets to interconnect the shield to a ground plane of the module board. the interposer board can further include an extra column of ground connections to reduce signaling noise between the interposer board and the system board.
    Type: Application
    Filed: May 10, 2022
    Publication date: August 25, 2022
    Inventors: Shailendra Singh CHAUHAN, Raghavendra RAO, Ranjul BALAKRISHNAN, Nizamuddin SHAIK, Bijendra SINGH, Siva Prasad JANGILI GANGA, Dong-Ho HAN