Patents by Inventor No Hoon PARK

No Hoon PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device package and fabricating method thereof
    Patent number: 11961867
    Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
  • Dielectric ceramic composition, dielectric material, and multilayer ceramic capacitor containing the same
    Patent number: 9576730
    Abstract: A dielectric ceramic composition contains a base material main ingredient and an accessory ingredient. The base material main ingredient includes a first base material main ingredient containing BaTiO3 and a second base material main ingredient containing (Na1-yKy)NbO3. The base material main ingredient is represented by (1?x)BaTiO3-x(Na1-yKy)NbO3, in which x and y satisfy 0.005?x?0.5 and 0.3?y?1.0, respectively.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: February 21, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yun Jung Park, Seok Hyun Yoon, Chang Hoon Kim, Song Je Jeon, No Hoon Park, Soo Kyong Jo
  • Dielectric composition for low-temperature sintering, multilayer ceramic electronic component containing the same, and method of manufacturing multilayer ceramic electronic component
    Patent number: 9472316
    Abstract: There are provided a dielectric composition for low-temperature sintering and a multilayer ceramic electronic component manufactured using the dielectric composition and the dielectric composition may contains: BaTiO3 as a main ingredient; and a Li2O—BaO compound as an accessory ingredient, wherein the accessory ingredient is contained in an amount of 0.2 mol % to 0.8 mol %, on the basis of 100 mol % of the main ingredient.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: October 18, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Bong Lim, Seok Hyun Yoon, No Hoon Park, Doo Young Kim, Chang Hoon Kim
  • DIELECTRIC CERAMIC COMPOSITION, DIELECTRIC MATERIAL, AND MULTILAYER CERAMIC CAPACITOR CONTAINING THE SAME
    Publication number: 20160217923
    Abstract: A dielectric ceramic composition contains a base material main ingredient and an accessory ingredient. The base material main ingredient includes a first base material main ingredient containing BaTiO3 and a second base material main ingredient containing (Na1-yKy)NbO3. The base material main ingredient is represented by (1-x)BaTiO3-x(Na1-yKy)NbO3, in which x and y satisfy 0.005?x?0.5 and 0.3?y?1.0, respectively.
    Type: Application
    Filed: October 8, 2015
    Publication date: July 28, 2016
    Inventors: Yun Jung PARK, Seok Hyun YOON, Chang Hoon KIM, Song Je JEON, No Hoon PARK, Soo Kyong JO
  • DIELECTRIC COMPOSITION FOR LOW-TEMPERATURE SINTERING, MULTILAYER CERAMIC ELECTRONIC COMPONENT CONTAINING THE SAME, AND METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT
    Publication number: 20160055933
    Abstract: There are provided a dielectric composition for low-temperature sintering and a multilayer ceramic electronic component manufactured using the dielectric composition and the dielectric composition may contains: BaTiO3 as a main ingredient; and a Li2O—BaO compound as an accessory ingredient, wherein the accessory ingredient is contained in an amount of 0.2 mol % to 0.8 mol %, on the basis of 100 mol % of the main ingredient.
    Type: Application
    Filed: April 9, 2015
    Publication date: February 25, 2016
    Inventors: Jong Bong LIM, Seok Hyun YOON, No Hoon PARK, Doo Young KIM, Chang Hoon KIM