Patents by Inventor No-Sun Kim

No-Sun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device package and fabricating method thereof
    Patent number: 11961867
    Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
  • Apparatus and method for transmitting/receiving a high speed-shared control channel in a high speed downlink packet access communication system
    Patent number: 7426201
    Abstract: An apparatus and method for transmitting/receiving an HS-SCCH in an HSDPA communication system including an HS-DSCH shared among a plurality of UEs and spread with a plurality of channelization codes, and the HS-SCCH for transmitting control information related with the HS-DSCH to enable the UEs to receive the shared channel. In the HS-SCCH transmitting apparatus, the control information is prioritized according to its processing urgency degree. High-priority control information and low-priority control information are generated and encoded in different encoding methods. Then the high-priority control information and the low-priority control information are multiplexed to a control channel signal such that the high-priority control information precedes the low-priority control information.
    Type: Grant
    Filed: December 30, 2002
    Date of Patent: September 16, 2008
    Assignee: Samsung Electroncis Co., Ltd
    Inventors: No-Sun Kim, Yong-Suk Moon, Hun-Kee Kim, Jae-Seung Yoon, Jun-Sung Lee
  • Apparatus and method for transmitting/receiving a high speed-shared control channel in a high speed downlink packet access communication system
    Publication number: 20030123470
    Abstract: An apparatus and method for transmitting/receiving an HS-SCCH in an HSDPA communication system including an HS-DSCH shared among a plurality of UEs and spread with a plurality of channelization codes, and the HS-SCCH for transmitting control information related with the HS-DSCH to enable the UEs to receive the shared channel. In the HS-SCCH transmitting apparatus, the control information is prioritized according to its processing urgency degree. High-priority control information and low-priority control information are generated and encoded in different encoding methods. Then the high-priority control information and the low-priority control information are multiplexed to a control channel signal such that the high-priority control information precedes the low-priority control information.
    Type: Application
    Filed: December 30, 2002
    Publication date: July 3, 2003
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: No-Sun Kim, Yong-Suk Moon, Hun-Kee Kim, Jae-Seung Yoon, Jun-Sung Lee