Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Abstract: The present invention relates to the stabilization of an effective ingredient by using a mineral material. In the present invention, the effective ingredient can be stably supported using the mineral material, and a microcapsule obtained by the manufacturing method according to the present invention, when discharged to nature, causes no environmental problems due to encapsulation ingredients thereof being the same as soil ingredients, and thus can avoid micro-plastic issues.

Abstract: A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device structure (e.g., a sensor device structure), and method for manufacturing thereof, that comprises a three-dimensional package structure free of wire bonds, through silicon vias, and/or flip-chip bonding.

Abstract: The present invention provides a screen shooting range and a method of playing a screen shooting game using artificial intelligence technologies. The screen shooting range includes a set studio including a plurality of shooting spaces virtually divided so as to continue a movement line of a user, wherein each of the divided shooting spaces is decorated according to different themes; a plurality of structures disposed in the shooting spaces; a sensor unit configured to detect a motion or position of the user; a plurality of image display units disposed in the shooting space to display images; a moving means provided so that the structure or the image display unit can be moved; a main server for storing a plurality of images as a manual and receiving position information of the laser point; and a controller for controlling internal configurations of the shooting space as a whole.

Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Abstract: The system for operating a match-up game includes a display unit having a plurality of player screen regions configured to display game screens a first input unit configured to receive an input from a first player a second input unit configured to receive an input from a second player a first air outlet configured to discharge air to the first player a second air outlet configured to discharge air to the second player; a control unit configured to control the display unit to count a game time and change the game screens displayed on the player screen regions for each counted game time, and when receiving an input to the first input unit from the first player, control the second air outlet so as to discharge air corresponding to the received input. The system for operating a match-up game may increase a player's sense of immersion.

Abstract: The present invention provides a 4D screen shooting range, which includes: a wall body forms a shooting space having a predetermined size, and has an entrance formed in any portion thereof; a screen installed on the wall body by avoiding the entrance and aimed or pointed at with a personal weapon held by a user; a projection unit configured to project an image onto the screen according to a shooting game content selected by the user; a shooting zone formed by including a center of the shooting space on the floor in a predetermined size with being spaced apart from the screen, in which a setting box operated to set a shooting game according to a selection of the user is disposed; and an action structure disposed in the shooting space to add a producing effect to a shooting game content image selected by the user.

Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Abstract: A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device structure (e.g., a sensor device structure), and method for manufacturing thereof, that comprises a three-dimensional package structure free of wire bonds, through silicon vias, and/or flip-chip bonding.

Abstract: The present invention provides a screen shooting range and a method of playing a screen shooting game using artificial intelligence technologies. The screen shooting range includes a set studio including a plurality of shooting spaces virtually divided so as to continue a movement line of a user, wherein each of the divided shooting spaces is decorated according to different themes; a plurality of structures disposed in the shooting spaces; a sensor unit configured to detect a motion or position of the user; a plurality of image display units disposed in the shooting space to display images; a moving means provided so that the structure or the image display unit can be moved; a main server for storing a plurality of images as a manual and receiving position information of the laser point; and a controller for controlling internal configurations of the shooting space as a whole.

Abstract: A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device structure (e.g., a sensor device structure), and method for manufacturing thereof, that comprises a three-dimensional package structure free of wire bonds, through silicon vias, and/or flip-chip bonding.

Abstract: The system for operating a match-up game includes a display unit having a plurality of player screen regions configured to display game screens a first input unit configured to receive an input from a first player a second input unit configured to receive an input from a second player a first air outlet configured to discharge air to the first player a second air outlet configured to discharge air to the second player; a control unit configured to control the display unit to count a game time and change the game screens displayed on the player screen regions for each counted game time, and when receiving an input to the first input unit from the first player, control the second air outlet so as to discharge air corresponding to the received input. The system for operating a match-up game may increase a player's sense of immersion.

Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Abstract: A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device structure (e.g., a sensor device structure), and method for manufacturing thereof, that comprises a three-dimensional package structure free of wire bonds, through silicon vias, and/or flip-chip bonding.

Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Abstract: A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device structure (e.g., a sensor device structure), and method for manufacturing thereof, that comprises a three-dimensional package structure free of wire bonds, through silicon vias, and/or flip-chip bonding.

Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Abstract: A semiconductor package and manufacturing method thereof are disclosed and may include a first semiconductor device comprising a first bond pad on a first surface of the first semiconductor device, a first encapsulant material surrounding side edges of the first semiconductor device, and a redistribution layer (RDL) formed on the first surface of the first semiconductor device and on a first surface of the encapsulant material. The RDL may electrically couple the first bond pad to a second bond pad formed above the first surface of the encapsulant material. A second semiconductor device comprising a third bond pad on a first surface of the second semiconductor device may face the first surface of the first semiconductor device and be electrically coupled to the first bond pad on the first semiconductor device. The first surface of the first semiconductor device may be coplanar with the first surface of the encapsulant material.

Abstract: A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device structure (e.g., a sensor device structure), and method for manufacturing thereof, that comprises a three-dimensional package structure free of wire bonds, through silicon vias, and/or flip-chip bonding.