Patents by Inventor NO UI KIM

NO UI KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate cleaning equipment, substrate treatment system including the same, and method of fabricating semiconductor device using the substrate cleaning equipment
    Patent number: 11791173
    Abstract: Substrate cleaning equipment includes a substrate holder which supports a substrate, a swing body, a head, a first cleaning liquid supply structure, and a second cleaning liquid supply structure. The swing body moves along a sweep line on a main surface of the substrate. The head is coupled to the swing body and includes a pad attachment surface facing the substrate holder. The first cleaning liquid supply structure is coupled to the swing body and sprays a first cleaning liquid onto the main surface of the substrate. The second cleaning liquid supply structure sprays a second cleaning liquid onto the main surface of the substrate. A buffing pad is attached to the pad attachment surface.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: October 17, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung Hoon Choi, Ja Eung Koo, No Ui Kim, Hyun Kyo Seo, Tae Min Earmme, Bo Un Yoon, Youn Cheol Jeong
  • SUBSTRATE CLEANING EQUIPMENT, SUBSTRATE TREATMENT SYSTEM INCLUDING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SUBSTRATE CLEANING EQUIPMENT
    Publication number: 20200303218
    Abstract: Substrate cleaning equipment includes a substrate holder which supports a substrate, a swing body, a head, a first cleaning liquid supply structure, and a second cleaning liquid supply structure. The swing body moves along a sweep line on a main surface of the substrate. The head is coupled to the swing body and includes a pad attachment surface facing the substrate holder. The first cleaning liquid supply structure is coupled to the swing body and sprays a first cleaning liquid onto the main surface of the substrate. The second cleaning liquid supply structure sprays a second cleaning liquid onto the main surface of the substrate. A buffing pad is attached to the pad attachment surface.
    Type: Application
    Filed: January 13, 2020
    Publication date: September 24, 2020
    Inventors: SEUNG HOON CHOI, JA EUNG KOO, NO UI KIM, HYUN KYO SEO, TAE MIN EARMME, BO UN YOON, YOUN CHEOL JEONG