Abstract: An analysis system for analyzing circuits and other appropriate devices as well as its method of use are disclosed. In one embodiment, a system may include one or more electromagnetic field generators configured to generate an electromagnetic field proximate to a circuit. The system may also include one or more electromagnetic field sensors configured to scan the circuit by detecting an electromagnetic field induced in the circuit. An associated computing device may be configured to receive the scan of the circuit and compare the scan to a reference scan of the circuit to determine whether the circuit is different from the reference scan.

Abstract: Eddy current detection probes and related methods are disclosed. In some embodiments, the eddy current detection probes are hybrid probes, including a solid state sensor and a detection loop. In some embodiments, the eddy current detection probes include a drive coil and a detection loop, with the detection loop having a sensitive axis that is not parallel to principal axis of the drive coil. In some such embodiments, the sensitive axis of the detection loop is perpendicular to the principal axis of the drive coil.

Abstract: A backlight assembly emits light out of two light emitting faces using a light source such as side-emitting LEDs that send light into an optical guide or body of optical material that diffuses the light uniformly and emits bi-facially. In this way, two displays, such as LCDs, can be illuminated at the same time and the efficiency is increased. The backlight assembly can be incorporated into an eyewear system such as a binocular display system.

Abstract: An optical system for a head mounted display includes a light pipe having two parallel surfaces along which modes can travel by total internal reflection. An illumination element allows selection of modes so that the desired modes can be transmitted along the light pipe, either axially or by total internal reflection.

Abstract: A micro-electromechanical optical switch assembly is provided for an optical network. The switch assembly includes arrays of input and output optical fibers and optical components for selecting light paths that connect any selected pair of input and output fibers. The optical components include optical switching elements, such as torsionally supported micromechanical mirrors that are electrostatically actuated to rotate to direct the light beam along the desired light path. The mirrors are bulk micromachined into a semiconductor wafer, preserving their optical qualities, and formed into a chip mated to a cover. The package incorporates alignment elements to ensure correct position and orientation of the optical components in the package.

Abstract: A micro-electromechanical optical switch assembly is provided for an optical network. The switch assembly includes arrays of input and output optical fibers and optical components for selecting light paths that connect any selected pair of input and output fibers. The optical components include optical switching elements, such as torsionally supported micromechanical mirrors that are electrostatically actuated to rotate to direct the light beam along the desired light path. The mirrors are bulk micromachined into a semiconductor wafer, preserving their optical qualities, and formed into a chip mated to a cover. The package incorporates alignment elements to ensure correct position and orientation of the optical components in the package.