Patents by Inventor Noah Sturcken
Noah Sturcken has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200168394Abstract: Power and/or data are transmitted through variable magnetic fields between a first transceiver coil on a transceiver apparatus and a second transceiver coil in an inductor integrated into a multilevel wiring structure on a semiconductor integrated circuit chip. The first transceiver apparatus generates magnetic fields and can transmit data by varying a characteristic of the magnetic fields. The second transceiver coil receives the power from and/or detects data in the magnetic fields from the first transceiver apparatus. The inductor can include a ferromagnetic core that concentrates magnetic flux to improve data or power transmission efficiency to miniaturize the second transceiver coil while maintaining adequate inductive coupling between the coils. The second transceiver coil can transmit data by varying the impedance of the inductor and/or the integrated circuit. The semiconductor integrated circuit chip can be coupled to an object and the second transceiver coil can transmit data relating to the object.Type: ApplicationFiled: January 31, 2020Publication date: May 28, 2020Inventors: Michael Lekas, Noah Sturcken
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Patent number: 10658331Abstract: A power management module comprises one or more power converter chips that are mounted on a power management package substrate. First and second electrical contacts are disposed on opposing first and second sides of the power management package substrate. The power management module can be mounted on a processor module to supply power to one or more processor chips in the processor module. In one example, the processor chip(s) are mounted on a first side of a processor package substrate and the power management module is mounted on an opposing second side of the processor package substrate. The power management module and the processor module can be centered and aligned with respect to each other or they can be offset laterally from each other. In another embodiment, the processor chip(s) are embedded in the processor package substrate.Type: GrantFiled: September 12, 2018Date of Patent: May 19, 2020Assignee: Ferric Inc.Inventors: Noah Sturcken, Ehsan Kalami, Joseph Meyer, Michael Lekas
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Publication number: 20200152364Abstract: A ferromagnetic actuator is disposed between first and second semiconductor devices that include first and second inductors. Each inductor is disposed on top of a multilevel wiring structure. Current flows through the first inductor to generate a first magnetic field that attracts the ferromagnetic actuator towards the first inductor causing the ferromagnetic actuator to transition from a first state to a second state. In the second state, a portion of the ferromagnetic actuator is disposed closer to the first inductor than it is in the first state. Current flows through the second inductor to generate a second magnetic field that attracts the ferromagnetic actuator towards the second inductor causing the ferromagnetic actuator to transition from the first or second state to a third state. In the third state, a portion of the ferromagnetic actuator is disposed closer to the first inductor than it is in the first state.Type: ApplicationFiled: November 8, 2018Publication date: May 14, 2020Inventors: Noah Sturcken, Ryan Davies, Michael Lekas
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Patent number: 10629357Abstract: Inductive elements comprising anisotropic media and biasing coils for magnetically biasing thereof and methods of manufacture and operation for use in applications such as microelectronics. Application of an electrical current through the bias coils generates a magnetic field that biases the magnetic material such that a desirable orientation of anisotropy is achieved throughout the magnetic core and enables modulation of the inductive response of the device. Electrical conductors coupled to interconnects are magnetically coupled to magnetic core layers to produce self and/or mutual inductors.Type: GrantFiled: March 5, 2018Date of Patent: April 21, 2020Assignee: Ferric Inc.Inventors: Noah Sturcken, Ryan Davies, Hao Wu
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Patent number: 10593470Abstract: Power and/or data are transmitted through variable magnetic fields between a first transceiver coil on a transceiver apparatus and a second transceiver coil in an inductor integrated into a multilevel wiring structure on a semiconductor integrated circuit chip. The first transceiver apparatus generates magnetic fields and can transmit data by varying a characteristic of the magnetic fields. The second transceiver coil receives the power from and/or detects data in the magnetic fields from the first transceiver apparatus. The inductor can include a ferromagnetic core that concentrates magnetic flux to improve data or power transmission efficiency to miniaturize the second transceiver coil while maintaining adequate inductive coupling between the coils. The second transceiver coil can transmit data by varying the impedance of the inductor and/or the integrated circuit. The semiconductor integrated circuit chip can be coupled to an object and the second transceiver coil can transmit data relating to the object.Type: GrantFiled: August 30, 2018Date of Patent: March 17, 2020Assignee: Ferric Inc.Inventors: Michael Lekas, Noah Sturcken
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Publication number: 20200075233Abstract: Power and/or data are transmitted through variable magnetic fields between a first transceiver coil on a transceiver apparatus and a second transceiver coil in an inductor integrated into a multilevel wiring structure on a semiconductor integrated circuit chip. The first transceiver apparatus generates magnetic fields and can transmit data by varying a characteristic of the magnetic fields. The second transceiver coil receives the power from and/or detects data in the magnetic fields from the first transceiver apparatus. The inductor can include a ferromagnetic core that concentrates magnetic flux to improve data or power transmission efficiency to miniaturize the second transceiver coil while maintaining adequate inductive coupling between the coils. The second transceiver coil can transmit data by varying the impedance of the inductor and/or the integrated circuit. The semiconductor integrated circuit chip can be coupled to an object and the second transceiver coil can transmit data relating to the object.Type: ApplicationFiled: August 30, 2018Publication date: March 5, 2020Inventors: Michael Lekas, Noah Sturcken
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Publication number: 20200075541Abstract: A power management module comprises one or more power converter chips that are mounted on a power management package substrate. First and second electrical contacts are disposed on opposing first and second sides of the power management package substrate. The power management module can be mounted on a processor module to supply power to one or more processor chips in the processor module. In one example, the processor chip(s) are mounted on a first side of a processor package substrate and the power management module is mounted on an opposing second side of the processor package substrate. The power management module and the processor module can be centered and aligned with respect to each other or they can be offset laterally from each other. In another embodiment, the processor chip(s) are embedded in the processor package substrate.Type: ApplicationFiled: September 12, 2018Publication date: March 5, 2020Inventors: Noah Sturcken, Ehsan Kalami, Joseph Meyer, Michael Lekas
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Patent number: 10431371Abstract: A method of forming an inductor assembly includes depositing a magnetic core on a planar substrate lying in a core plane, forming an inductor coil that generates a magnetic field that passes through the magnetic core in a closed loop parallel to the core plane, and annealing the magnetic core while applying an external magnetic field that passes through the magnetic core in a radial direction to permanently fix the easy axis of magnetization parallel to the radial direction. As a result, the hard axis of magnetization of the magnetic core is permanently oriented in a generally circular closed path parallel to the closed loop of the inductor's magnetic field.Type: GrantFiled: September 2, 2016Date of Patent: October 1, 2019Assignee: Ferric Inc.Inventors: Noah Sturcken, Ryan Davies, Hao Wu
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Patent number: 10367415Abstract: A power management module comprises one or more power converter chips that are mounted on a power management package substrate. First and second electrical contacts are disposed on opposing first and second sides of the power management package substrate. The power management module can be mounted on a processor module to supply power to one or more processor chips in the processor module. In one example, the processor chip(s) are mounted on a first side of a processor package substrate and the power management module is mounted on an opposing second side of the processor package substrate. The power management module and the processor module can be centered and aligned with respect to each other or they can be offset laterally from each other. In another embodiment, the power management module and the processor chip(s) are mounted on the same side of the processor package substrate.Type: GrantFiled: August 28, 2018Date of Patent: July 30, 2019Assignee: Ferric Inc.Inventors: Noah Sturcken, Ehsan Kalami, Joseph Meyer, Michael Lekas
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Patent number: 10354950Abstract: A magnetic polymer for use in microelectronic fabrication includes a polymer matrix and a plurality of ferromagnetic particles disposed in the polymer matrix. The magnetic polymer can be part of an insulation layer in an inductor formed in one or more backend wiring layers of an integrated device. The magnetic polymer can also be in the form of a magnetic epoxy layer for mounting contacts of the integrated device to a package substrate.Type: GrantFiled: February 25, 2016Date of Patent: July 16, 2019Assignee: Ferric Inc.Inventors: Noah Sturcken, Ryan Davies
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Patent number: 10347709Abstract: Methods of manufacturing are disclosed for an inductor that includes a magnetic core lying in a core plane. The magnetic core includes a vertical laminated structure with respect to the core plane of alternating ferromagnetic vertical layers and insulator vertical layers. An easy axis of magnetization can be permanently or semi-permanently fixed in the ferromagnetic vertical layers along a first axis orthogonal to the core plane. A hard axis of magnetization can be permanently or semi-permanently induced in the ferromagnetic vertical layers, the hard axis of magnetization lying in a plane that is orthogonal to the first axis.Type: GrantFiled: January 30, 2017Date of Patent: July 9, 2019Assignee: Ferric Inc.Inventors: Noah Sturcken, Ryan Davies, Hao Wu, Michael Lekas
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Patent number: 10326366Abstract: A switched-mode power converter includes timing control feedback loop circuits to minimize or eliminate the potential difference across a high-power switch and a low-power switch during their transitions times. A first feedback circuit compares the measured voltage across the high-power switch at the moment the high-power switch closes with the input voltage to the high-power switch to control a low-to-high delay time. A second feedback circuit compares the measured voltage across the low-power switch at the moment the low-power switch closes with the input voltage to the low-power switch to control a high-to-low delay time. A third feedback circuit compares the measured voltage across the low-power switch at the moment the low-power switch opens. The output of the third feedback circuit is provided as inputs to the first and second feedback circuits. The third feedback circuit also controls the frequency of the power converter.Type: GrantFiled: January 12, 2018Date of Patent: June 18, 2019Assignee: Ferric Inc.Inventors: William Lee, David Jew, Joseph Meyer, Noah Sturcken
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Publication number: 20190182957Abstract: A switched inductor DC-DC power converter chiplet includes a CMOS power switch, an LC filter, regulation circuitry, feedback control circuitry, and interface control circuitry integrated on a common substrate. The inductor for the LC filter can be formed on the same surface or on opposing surfaces of the substrate as the electrical terminations for the substrate. Another embodiment includes a switched inductor DC-DC power converter chiplet having a first powertrain phase and multiple second powertrain phases. When the load current is less than or equal to a threshold load current, the power conversion efficiency can be improved by only operating the first powertrain phase. When the load current is greater than the threshold load current, the power conversion efficiency can be improved by operating one or more second powertrain phases.Type: ApplicationFiled: February 19, 2019Publication date: June 13, 2019Inventors: Noah Sturcken, Joseph Meyer, Michael Lekas, Ryan Davies, David Jew, William Lee
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Publication number: 20190172624Abstract: Inductive elements comprising anisotropic media and a bias coil for magnetically biasing thereof and methods of manufacture and operation for use in applications such as microelectronics. The bias coil generates a magnetic field that biases a magnetic core material during deposition thereof such that a desirable orientation of anisotropy is achieved throughout the magnetic core and enables modulation of the inductive response of the device. The bias coil can generate the magnetic field by application of electrical current therethrough. Alternatively, the bias coil can include or can be replaced with a permanent magnet that can generate the magnetic field without application of electrical current therethrough.Type: ApplicationFiled: January 25, 2019Publication date: June 6, 2019Inventors: Noah Sturcken, Ryan Davies, Michael Lekas
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Patent number: 10244633Abstract: A switched inductor DC-DC power converter chiplet includes a CMOS power switch, an LC filter, regulation circuitry, feedback control circuitry, and interface control circuitry integrated on a common substrate. The inductor for the LC filter can be formed on the same surface or on opposing surfaces of the substrate as the electrical terminations for the substrate.Type: GrantFiled: December 15, 2017Date of Patent: March 26, 2019Assignee: Ferric Inc.Inventors: Noah Sturcken, David Jew, Joseph Meyer, Ryan Davies, Michael Lekas
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Patent number: 10210986Abstract: An inductor includes a magnetic core lying in a core plane. The magnetic core includes a vertical laminated structure with respect to the core plane of alternating ferromagnetic vertical layers and insulator vertical layers. An easy axis of magnetization can be permanently or semi-permanently fixed in the ferromagnetic vertical layers along an axis orthogonal to the core plane. Methods of manufacturing same are also disclosed.Type: GrantFiled: December 27, 2016Date of Patent: February 19, 2019Assignee: Ferric, Inc.Inventors: Noah Sturcken, Ryan Davies, Hao Wu, Michael Lekas
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Publication number: 20180302986Abstract: An inductor comprises a planar laminated magnetic core and a conductive winding. The core includes an alternating sequence of (a) a magnetic layer having a thickness of about 100 angstroms to about 10,000 angstroms and (b) a non-magnetic layer having a thickness of about 10 angstroms to about 2,000 angstroms. Magnetic flux passes through a first magnetic layer parallel to a first easy axis of magnetization of the first magnetic layer and the magnetic flux passes through a second magnetic layer, disposed adjacent to the first magnetic layer, parallel to a second easy axis of magnetization of the second magnetic layer. The magnetic flux path extends through the first and second magnetic layers parallel to the first and second easy axes of magnetization, respectively. At least one orthogonal magnetic layer can be disposed laterally from the core such that the magnetic flux path extends through the orthogonal magnetic layer(s).Type: ApplicationFiled: June 13, 2018Publication date: October 18, 2018Inventors: Noah Sturcken, Ryan Davies, Michael Lekas
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Publication number: 20180295726Abstract: A structure comprises a semiconductor integrated circuit, an inductor, and a magnetic flux closure layer. The inductor is integrated into a multilevel wiring network in the semiconductor integrated circuit. The inductor includes a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The planar laminated magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The magnetic flux closure layer is disposed within about 100 ?m of a face of the planar laminated magnetic core, the face of the planar magnetic core parallel to a principal plane of the planar laminated magnetic core. A second magnetic flux closure layer can be disposed within about 100 ?m of an opposing face of the planar laminated magnetic core.Type: ApplicationFiled: June 13, 2018Publication date: October 11, 2018Inventors: Noah Sturcken, Ryan Davies, Michael Lekas
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Publication number: 20180295725Abstract: A structure includes a semiconductor integrated circuit comprising a multilevel wiring network and an inductor integrated into the multilevel wiring network. The inductor includes a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The planar laminated magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The magnetic layer comprises a ferromagnetic alloy having an iron composition of about 10 atomic percent to about 90 atomic percent.Type: ApplicationFiled: June 13, 2018Publication date: October 11, 2018Inventors: Noah Sturcken, Ryan Davies, Michael Lekas
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Publication number: 20180295724Abstract: An inductor includes a planar laminated magnetic core and a conductive winding. The planar magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The non-magnetic layer includes an insulating layer that is disposed between first and second interface layers. The conductive winding turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The inductor can be integrated into a multilevel wiring network in a semiconductor integrated circuit to form a microelectronic device, such as a transformer, a power converter, or a microprocessor.Type: ApplicationFiled: June 12, 2018Publication date: October 11, 2018Inventors: Noah Sturcken, Ryan Davies, Michael Lekas