Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.

Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.

Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.

Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.

Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.

Abstract: A method for inspecting a wafer including a multiplicity of dies, the method including dividing an image of at least a portion of the wafer into a plurality of sub-images each representing a sub-portion of the wafer and selecting at least one defect candidate within each sub-image by comparing each sub-image to a corresponding sub-image of a reference including a representation, which is assumed to be faultless, of the portion of the wafer.

Abstract: A programmable spatial filter for use as a Fourier plane filter in dark field wafer inspection systems, based on the use of MEMS (Micro-Electro-Mechanical Systems) devices. In comparison with prior art systems, especially those using LCD's, the use of MEMS devices provide a number of potential advantages, including good transmission in the UV, a high fill factor, polarization independence and a high extinction ratio since the shutter is opaque when closed. The MEMS devices can be flap devices, artificial eyelid, or double shutter devices. Additionally, a novel spatial light modulator (SLM) assembly having a double layer of SLM arrays is described, in which the fill factor is increased in comparison to a single layer SLM using the same devices, by positioning the dead areas of the elements of both arrays collinearly in the modulated beam. This SLM assembly can be implemented using pixelated LCD arrays or MEMS arrays.

Abstract: An inspection system for inspecting an object, the system comprising an illuminator including at least one pulsed light source, a detector assembly, and a relative motion provider operative to provide motion of the object relative to the detector assembly, along an axis of motion, the detector assembly comprising a plurality of 2-dimensional detector units whose active areas are arranged at intervals.

Abstract: A fiber optical illumination delivery system, which is effective in reducing the effects of source coherence. The system preferably utilizes either a single bundle of optical fibers, or serial bundles of optical fibers. In the single bundle embodiment, the differences in optical lengths between different fibers of the bundle is preferably made to be equal to even less than the coherence length of the source illumination. In the serial bundle embodiment, the fibers in the other bundle are arranged as groups of fibers of the same length, and it is the difference in lengths of these groups which is made equal to, or even more preferably, less than the overall difference in length between the shortest and the longest fibers in the other bundle. Both of these fiber systems enable construction of illumination systems delivering a higher level of illumination, but without greatly affecting the coherence breaking abilities of the system, thus enabling a generally more applicable system to be constructed.

Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.

Abstract: A fiber optical illumination delivery system, which is effective in reducing the effects of source coherence. The system preferably utilizes either a single bundle of optical fibers, or serial bundles of optical fibers. In the single bundle embodiment, the differences in optical lengths between different fibers of the bundle is preferably made to be equal to even less than the coherence length of the source illumination. In the serial bundle embodiment, the fibers in the other bundle are arranged as groups of fibers of the same length, and it is the difference in lengths of these groups which is made equal to, or even more preferably, less than the overall difference in length between the shortest and the longest fibers in the other bundle. Both of these fiber systems enable construction of illumination systems delivering a higher level of illumination, but without greatly affecting the coherence breaking abilities of the system, thus enabling a generally more applicable system to be constructed.

Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.

Abstract: A fiber optical illumination delivery system, which is effective in reducing the effects of source coherence. The system preferably utilizes either a single bundle of optical fibers, or serial bundles of optical fibers. In the single bundle embodiment, the differences in optical lengths between different fibers of the bundle is preferably made to be equal to even less than the coherence length of the source illumination. In the serial bundle embodiment, the fibers in the other bundle are arranged as groups of fibers of the same length, and it is the difference in lengths of these groups which is made equal to, or even more preferably, less than the overall difference in length between the shortest and the longest fibers in the other bundle. Both of these fiber systems enable construction of illumination systems delivering a higher level of illumination, but without greatly affecting the coherence breaking abilities of the system, thus enabling a generally more applicable system to be constructed.

Abstract: A system and a method for fast characterization of sample's material composition, which is especially beneficial for semiconductor fabrication. The material composition is characterized by analyzing secondary electrons emission from the sample. According to one feature, electron detector is used to collect secondary electrons emanating from the sample. The detector is controlled to collect a specific narrow band of secondary electrons, and the band is controlled to allow for collection of SE at different energies. Two modes are disclosed: spot mode and secondary electron spectroscopy material imaging (SESMI). In the spot mode, a spectrum of SE is obtained from a single spot on the sample, and its characteristics are investigated to obtain information of the material composition of the spot. In the SESMI mode, an SEM image of an area on the sample is obtained. The SE spectrum at each pixel is investigated and correlated to a particular spectrum group.

Abstract: According to one aspect of the present invention, there is provided a method for controlling of charged particle beam to compensate for a potential being present on a specimen, the method comprising the steps of: moving a charged particle beam over the specimen; measuring at least one secondary product and/or backscattered particles coming from the specimen to produce an image signal; scoring the image signal; changing the beam energy; analyzing the scores achieved with different beam energies; and adjusting the beam energy based on the analysis, to compensate for the potential being present on the specimen.

Abstract: An apparatus and method are disclosed for reviewing defects on an object. The apparatus includes a stage for receiving the object thereon, and both an optical microscope and a scanning electron microscope (SEM). The optical microscope is used to redetect previously mapped defects on the object surface, and includes an illumination source that directs a beam of light toward a selected portion of the object surface. The optical microscope is configured to generate either, or both, bright field and dark field illumination. Once the defect has been redetected, a translation system moves the stage a predetermined displacement such that the defect is positioned for review by the SEM. The apparatus can be configured to automatically focus the defect for viewing by the SEM, and rotate the stage to obtain varying perspectives of the defect.

Abstract: A method and system for automatic EDX analysis of defects quantitatively take into consideration x-ray signals attributable to the background. The method and system are capable of automatically identifying suitable locations for background and defect x-ray sampling. The method and system are also capable of effectively and quantitatively, rather than qualitatively, removing signals attributable to the background and not the defect. One advantageous feature that enables the method and system to have a high throughput is termed “trace element analysis.” The method and system are particularly beneficial for analysis of defects on semiconductor wafers and, due to automation, are suitable for in-line inspection of wafers in the fabrication plant.

Abstract: A SEM review station provides a plurality of images of a defect area of a wafer structure, particularly a semiconductor integrated circuit, during manufacture. Inspection of the multiple images provides a depth determination and/or contour information. Knowing the depth of a defect is useful for determining a corresponding manufacturing step and chamber in which a defect was introduced. One SEM review station provides a stereoscopic SEM image signal by combining signals from two images taken from different perspectives, and determines the depth of a defect. Another SEM review station provides contour information through three images taken with varying directions of electron detection so is that shading differences can be used to characterize the defect as flat, as a protrusion, or as a recess.

Abstract: A system for inspecting a display panel including a plurality of pixels, the system including a selective pixel actuator which causes only some of the plurality of pixels to be actuated, a sensor for acquiring an image of a pattern which is generated on the panel, and an image processor operative to identify nonuniformities in the intensities of pixels of the panel.

Abstract: Disclosed is a system and method for enhancing edge, topography, and materials in SEM images. The enhancements are achieved by collecting secondary electrons at narrow energy bands. This allows construction of various “primary” images having specific features enhanced. Further enhancement is achieved by various manipulations and combinations of the “primary” images to obtain a final enhanced image. Yet further enhancements are achieved by assigning color to various “primary” images before constructing the final image.