Abstract: A parabolic cylindrical reflector antenna that comprises two or more antenna feeds each directed towards a parabolic cylindrical reflector, wherein the antenna feeds are positioned in one or more line-arrays parallel to a focal line of the parabolic cylindrical reflector, and the line-array is substantially centered opposing the reflector. The antenna comprises a controller configured to scan along a straight edge of the reflector by electronically adjusting a phase of each of the antenna feeds, thereby changing the incident angle of an energy beam relative to the reflector. The controller is configured to scan along a curved edge of the reflector by moving, using a mechanical positioning mechanism, the antenna feeds in a direction parallel to a directrix of the reflector while maintaining the positioning or by electronically selecting one of two or more parallel line-arrays.

Abstract: A parabolic cylindrical reflector antenna that comprises two or more antenna feeds each directed towards a parabolic cylindrical reflector, wherein the antenna feeds are positioned in one or more line-arrays parallel to a focal line of the parabolic cylindrical reflector, and the line-array is substantially centered opposing the reflector. The antenna comprises a controller configured to scan along a straight edge of the reflector by electronically adjusting a phase of each of the antenna feeds, thereby changing the incident angle of an energy beam relative to the reflector. The controller is configured to scan along a curved edge of the reflector by moving, using a mechanical positioning mechanism, the antenna feeds in a direction parallel to a directrix of the reflector while maintaining the positioning or by electronically selecting one of two or more parallel line-arrays.

Abstract: A parabolic cylindrical reflector antenna that comprises two or more antenna feeds each directed towards a parabolic cylindrical reflector, wherein the antenna feeds are positioned in one or more line-arrays parallel to a focal line of the parabolic cylindrical reflector, and the line-array is substantially centered opposing the reflector. The antenna comprises a controller configured to scan along a straight edge of the reflector by electronically adjusting a phase of each of the antenna feeds, thereby changing the incident angle of an energy beam relative to the reflector. The controller is configured to scan along a curved edge of the reflector by moving, using a mechanical positioning mechanism, the antenna feeds in a direction parallel to a directrix of the reflector while maintaining the positioning or by electronically selecting one of two or more parallel line-arrays.

Abstract: A joined structure which is configured such that a space between adjacent substrates is filled with a filling material. The joined structure includes a first substrate having a first conductor formed on a surface of the first substrate, a second substrate having a second conductor formed on a surface of the second substrate, arranged so that a surface of the first substrate faces a surface of the second substrate, a connecting conductor which electrically connects the first conductor and the second conductor, and a filling material between the first substrate and the second substrate. The filling material is formed into such a shape that a space is provided which corresponds to at least one of the first conductor, the second and the connecting conductor.

Abstract: An assembly for confining electromagnetic radiation in a waveguide. The assembly comprises a waveguide, comprising walls surrounding a cavity and an aperture in the walls that opens to the cavity, and a substrate assembly disposed in the aperture. The substrate assembly comprises a substrate comprising an antenna, wherein the antenna is located within the cavity and is configured for transmission of radiation within the cavity. The substrate assembly comprises an integrated circuit (IC) electrically connected to the substrate, where the IC comprises semi-conductor components and a ground plane on one side of the IC. The ground plane is located between the IC semi-conductor components and the antenna. The ground plane is located across the aperture to reduce the area of the aperture and to reflect some of the radiation directed to the aperture back into the cavity.

Abstract: An apparatus providing a direct chip to waveguide transition, comprising: one or more waveguides, a chip partially embedding each of the waveguides at a transition area positioned at a narrow side of each waveguide, and a transmitting element disposed at each of the transition areas, thereby providing one or more simultaneous, direct transitions between the chip and the waveguides.

Abstract: A joined structure which is configured such that a space between adjacent substrates is filled with a filling material. The joined structure includes a first substrate having a first conductor formed on a surface of the first substrate, a second substrate having a second conductor formed on a surface of the second substrate, arranged so that a surface of the first substrate faces a surface of the second substrate, a connecting conductor which electrically connects the first conductor and the second conductor, and a filling material between the first substrate and the second substrate. The filling material is formed into such a shape that a space is provided which corresponds to at least one of the first conductor, the second and the connecting conductor.

Abstract: A joined structure which is configured such that a space between adjacent substrates is filled with a filling material. The joined structure includes a first substrate having a first conductor formed on a surface of the first substrate, a second substrate having a second conductor formed on a surface of the second substrate, arranged so that a surface of the first substrate faces a surface of the second substrate, a connecting conductor which electrically connects the first conductor and the second conductor, and a filling material between the first substrate and the second substrate. The filling material is formed into such a shape that a space is provided which corresponds to at least one of the first conductor, the second and the connecting conductor.

Abstract: An assembly for confining electromagnetic radiation in a waveguide. The assembly comprises a waveguide, comprising walls surrounding a cavity and an aperture in the walls that opens to the cavity, and a substrate assembly disposed in the aperture. The substrate assembly comprises a substrate comprising an antenna, wherein the antenna is located within the cavity and is configured for transmission of radiation within the cavity. The substrate assembly comprises an integrated circuit (IC) electrically connected to the substrate, where the IC comprises semi-conductor components and a ground plane on one side of the IC. The ground plane is located between the IC semi-conductor components and the antenna. The ground plane is located across the aperture to reduce the area of the aperture and to reflect some of the radiation directed to the aperture back into the cavity.

Abstract: A novel and useful method of visualization by detection of EM radiation being irradiated or reflected from objects in the imager's field of view using Finite Element Method (FEM) simulation software tools. The methodology provides a verification method of antenna operation from an electrical point of view since bolometer performance cannot be estimated using regular antenna parameters such as directivity, gain, impedance matching, etc. as the bolometer does not behave as an antenna but rather behaves as an absorber. An incident wave is triggered on the absorber and the absorption of the bolometer structure is estimated using commercially available Finite Element Method (FEM) software (e.g., ANSYS® HFSS software, CST MICROWAVE STUDIO®, etc.). How much of the energy is reflected is subsequently measured. The energy which is not reflected is considered to be absorbed by the absorber.

Abstract: A parabolic cylindrical reflector antenna that comprises two or more antenna feeds each directed towards a parabolic cylindrical reflector, wherein the antenna feeds are positioned in one or more line-arrays parallel to a focal line of the parabolic cylindrical reflector, and the line-array is substantially centered opposing the reflector. The antenna comprises a controller configured to scan along a straight edge of the reflector by electronically adjusting a phase of each of the antenna feeds, thereby changing the incident angle of an energy beam relative to the reflector. The controller is configured to scan along a curved edge of the reflector by moving, using a mechanical positioning mechanism, the antenna feeds in a direction parallel to a directrix of the reflector while maintaining the positioning or by electronically selecting one of two or more parallel line-arrays.

Abstract: An assembly for confining electromagnetic radiation in a waveguide. The assembly comprises a waveguide, comprising walls surrounding a cavity and an aperture in the walls that opens to the cavity, and a substrate assembly disposed in the aperture. The substrate assembly comprises a substrate comprising an antenna, wherein the antenna is located within the cavity and is configured for transmission of radiation within the cavity. The substrate assembly comprises an integrated circuit (IC) electrically connected to the substrate, where the IC comprises semi-conductor components and a ground plane on one side of the IC. The ground plane is located between the IC semi-conductor components and the antenna. The ground plane is located across the aperture to reduce the area of the aperture and to reflect some of the radiation directed to the aperture back into the cavity.

Abstract: An assembly for confining electromagnetic radiation in a waveguide. The assembly comprises a waveguide, comprising walls surrounding a cavity and an aperture in the walls that opens to the cavity, and a substrate assembly disposed in the aperture. The substrate assembly comprises a substrate comprising an antenna, wherein the antenna is located within the cavity and is configured for transmission of radiation within the cavity. The substrate assembly comprises an integrated circuit (IC) electrically connected to the substrate, where the IC comprises semi-conductor components and a ground plane on one side of the IC. The ground plane is located between the IC semi-conductor components and the antenna. The ground plane is located across the aperture to reduce the area of the aperture and to reflect some of the radiation directed to the aperture back into the cavity.

Abstract: An apparatus providing a direct chip to waveguide transition, comprising: one or more waveguides, a chip partially embedding each of the waveguides at a transition area positioned at a narrow side of each waveguide, and a transmitting element disposed at each of the transition areas, thereby providing one or more simultaneous, direct transitions between the chip and the waveguides.

Abstract: An apparatus providing a direct chip to waveguide transition, comprising: one or more waveguides, a chip partially embedding each of the waveguides at a transition area positioned at a narrow side of each waveguide, and a transmitting element disposed at each of the transition areas, thereby providing one or more simultaneous, direct transitions between the chip and the waveguides.

Abstract: An apparatus providing a direct chip to waveguide transition, comprising: one or more waveguides, a chip partially embedding each of the waveguides at a transition area positioned at a narrow side of each waveguide, and a transmitting element disposed at each of the transition areas, thereby providing one or more simultaneous, direct transitions between the chip and the waveguides.

Abstract: A joined structure which is configured such that a space between adjacent substrates is filled with a filling material. The joined structure includes a first substrate having a first conductor formed on a surface of the first substrate, a second substrate having a second conductor formed on a surface of the second substrate, arranged so that a surface of the first substrate faces a surface of the second substrate, a connecting conductor which electrically connects the first conductor and the second conductor, and a filling material between the first substrate and the second substrate. The filling material is formed into such a shape that a space is provided which corresponds to at least one of the first conductor, the second and the connecting conductor.

Abstract: A mmWave electronics package constructed from common Printed Circuit Board (PCB) technology and a metal cover. Assembly of the package uses standard pick and place technology and heat is dissipated directly to a pad on the package. Input/output of mmWave signal(s) is achieved through a rectangular waveguide. Mounting of the electronic package to an electrical printed circuit board (PCB) is performed using conventional reflow soldering processes and includes a waveguide I/O connected to an mmWave antenna. The electronic package provides for transmission of low frequency, dc and ground signals from the semiconductor chip inside the package to the PCB it is mounted on. An impedance matching scheme matches the chip to high frequency board transition by altering the ground plane within the chip. A ground plane on the high frequency board encircles the high frequency signal bump to confine the electromagnetic fields to the bump region reducing radiation loss.

Abstract: There is provided a high responsivity device for thermal sensing in a Terahertz (THz) radiation detector. A load impedance connected to an antenna heats up due to the incident THz radiation received by the antenna. The heat generated by the load impedance is sensed by a thermal sensor such as a transistor. To increase the responsivity of the sense device without increasing the thermal mass, the device is located underneath a straight portion of an antenna arm. The transistor runs substantially the entire length of the antenna arm alleviating the problem caused by placing large devices on the side of the antenna and the resulting large additional thermal mass that must be heated. This boosts the responsivity of the pixel while retaining an acceptable level of noise and demanding a dramatically smaller increase in the thermal time constant.

Abstract: A bolometer device for use in a bolometer array. The bolometer device of the present invention measures radiation-induced temperature and includes a bolometer sensor and at least one holding element. The bolometer sensor includes at least two antenna elements. The antenna elements are coupled together with one of their ends at a center position. The bolometer sensor also includes a temperature sensing element attached at the center position of the at least two antenna elements, and detects a temperature at the center position. The temperature sensing element also provides an electrical measure in response to the temperature it detects. The holding elements provide support for the bolometer sensor at an end portion of one of the antenna elements. At least one of the holding elements is made of electrically conductive material so an electrical measure can be read out through the holding element.