Patents by Inventor Noam Ophir

Noam Ophir has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200232878
    Abstract: A method and structure are provided for testing photonic circuits with integrated optical mixers having idle ports. A test port is provided for coupling test light into one or more idle ports of the mixer. Light exiting output ports of the mixer may be measured with photodetectors. Phase errors of optical hybrids may be determined by using waveguides of different lengths to inject test light into two input ports of the mixer and scanning the test wavelength. The method and structure may be used for on-wafer and off-wafer measurements of integrated photonic circuits implementing coherent optical receivers.
    Type: Application
    Filed: January 17, 2019
    Publication date: July 23, 2020
    Inventors: Yangjin Ma, Ruizhi Shi, Noam Ophir, Ran Ding
  • Publication number: 20180342411
    Abstract: Otherwise-unused metal pads are utilized for mechanically marking an identification number on each chip in each reticle of each semiconductor wafer. A chip-specific marking pattern is scribed into selected metal pads using a standard commercial wafer probe controlled by a custom-built controller to direct the probe or probe stage to implement the pattern. Visual inspection (manual and automated) may then be used for die identification based on the probe-marked pattern, including incorporating the visual inspection of these pads into the product building process.
    Type: Application
    Filed: July 17, 2018
    Publication date: November 29, 2018
    Inventors: Noam Ophir, Xiaoliang Zhu, Ari Novack, Michael J. Hochberg
  • Publication number: 20180269091
    Abstract: Otherwise-unused metal pads are utilized for mechanically marking an identification number on each chip in each reticle of each semiconductor wafer. A chip-specific marking pattern is scribed into selected metal pads using a standard commercial wafer probe controlled by a custom-built controller to direct the probe or probe stage to implement the pattern. Visual inspection (manual and automated) may then be used for die identification based on the probe-marked pattern, including incorporating the visual inspection of these pads into the product building process.
    Type: Application
    Filed: March 16, 2017
    Publication date: September 20, 2018
    Inventors: Noam Ophir, Xiaoliang Zhu, Ari Novack, Michael J. Hochberg