Abstract: The present invention includes a ferro fuse cell comprising a ferroelectric storage capacitor electrically connected to a plate on one side and to a sense amplifier on the other side. A ferroelectric measurement capacitor is electrically connected between the ferroelectric storage capacitor and the sense amplifier.

Abstract: A ferroelectric memory device includes a memory cell array having memory cells arranged in a matrix form. Each of the memory cells includes a cell transistor and a ferroelectric capacitor. It further includes a first dummy bit line arranged outside a bit line arranged on an end portion of the memory cell array and separated from the bit line arranged on the end portion of the memory cell array with an interval which is the same as a pitch between the bit lines in the memory cell array and having the same width as the bit line, and a first dummy memory cell connected to the first dummy bit line and having the same structure as the memory cell.

Abstract: The present invention provides a test mode section for facilitating a worst case product test sequence for signal margin to ensure full product functionality over the entire component lifetime taking all aging effects into account. A semiconductor memory test mode configuration includes a first capacitor for storing digital data and connecting a cell plate line to a first bit line through a first select transistor. The first select transistor activated through a connection to a word line. A second capacitor stores digital data and connects the cell plate line to a second bit line through a second select transistor. The second select transistor is activated through a connection to the word line. A sense amplifier is connected to the first and second bit lines and measures a differential read signal on the first and second bit lines. A third transistor transfers charge between the first and second bit lines third to reduce the differential read signal.

Abstract: A ferroelectric memory device includes a memory cell array having memory cells arranged in a matrix form. Each of the memory cells includes a cell transistor and a ferroelectric capacitor. It further includes a first dummy bit line arranged outside a bit line arranged on an end portion of the memory cell array and separated from the bit line arranged on the end portion of the memory cell array with an interval which is the same as a pitch between the bit lines in the memory cell array and having the same width as the bit line, and a first dummy memory cell connected to the first dummy bit line and having the same structure as the memory cell.

Abstract: A data storage device comprises a controller, a FeRAM memory unit, and a flash memory unit having a much higher data storage capacity than the FeRAM memory unit. Initially, when data is received by the data storage device, the controller stores it in the FeRAM memory unit. This can be done very quickly, since FeRAM devices have a high write rate. Subsequently, the controller transfers the data to the flash memory unit. Thus, the data storage device combines the high storage rate ability of FeRAM devices and the high storage capacity of flash memory devices.

Abstract: A ferroelectric memory device includes a memory cell array having memory cells arranged in a matrix form. Each of the memory cells includes a cell transistor and a ferroelectric capacitor. It further includes a first dummy bit line arranged outside a bit line arranged on an end portion of the memory cell array and separated from the bit line arranged on the end portion of the memory cell array with an interval which is the same as a pitch between the bit lines in the memory cell array and having the same width as the bit line, and a first dummy memory cell connected to the first dummy bit line and having the same structure as the memory cell.

Abstract: A ferroelectric memory device includes a memory cell array having memory cells arranged in a matrix form. Each of the memory cells includes a cell transistor and a ferroelectric capacitor. It further includes a first dummy bit line arranged outside a bit line arranged on an end portion of the memory cell array and separated from the bit line arranged on the end portion of the memory cell array with an interval which is the same as a pitch between the bit lines in the memory cell array and having the same width as the bit line, and a first dummy memory cell connected to the first dummy bit line and having the same structure as the memory cell.

Abstract: The present invention provides a test mode section for facilitating a worst case product test sequence for signal margin to ensure full product functionality over the entire component lifetime taking all aging effects into account A semiconductor memory test mode configuration includes a first capacitor for storing digital data connecting a cell plate line to a first bit line through a first select transistor. The first select transistor is activated through a connection to a word line. A second capacitor stores digital data and connects the cell plate line to a second bit line through a second select transistor. The second select transistor is activated through a connection to the word line. A sense amplifier is connected to the first and second bit lines for measuring a differential read signal on the first and second bit lines.

Abstract: The present invention provides a test mode section for facilitating a worst case product test sequence for signal margin to ensure full product functionality over the entire component lifetime taking all aging effects into account. A semiconductor memory test mode configuration includes a first capacitor for storing digital data and connecting a cell plate line to a first bit line through a first select transistor. The first select transistor activated through a connection to a word line. A second capacitor stores digital data and connects the cell plate line to a second bit line through a second select transistor. The second select transistor is activated through a connection to the word line. A sense amplifier is connected to the first and second bit lines and measures a differential read signal on the first and second bit lines. A third transistor transfers charge between the first and second bit lines third to reduce the differential read signal.

Abstract: The present invention provides a test mode section for facilitating a worst case product test sequence for signal margin to ensure full product functionality over the entire component lifetime taking all aging effects into account. A semiconductor memory test mode configuration includes a first capacitor for storing digital data connecting a cell plate line to a first bit line through a first select transistor. The first select transistor is activated through a connection to a word line. A second capacitor stores digital data and connects the cell plate line to a second bit line through a second select transistor. The second select transistor is activated through a connection to the word line.