Patents by Inventor Noborn Matsuki

Noborn Matsuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making electrodeposited copper foil
    Patent number: 4976826
    Abstract: Disclosed is a method of making electrodeposited copper foil which comprises carrying electrolysis by adding a water-soluble cellulose ether to an electrolytic solution.A profile of the matte side nodules of the electrodeposited copper foil obtained by the method of the present invention can be easily controlled, and the electrodeposited copper foil which is high above IPC specification Class 3 in elongation at room temperature and high temperature can be obtained.
    Type: Grant
    Filed: February 16, 1990
    Date of Patent: December 11, 1990
    Assignee: Furukawa Circuit Foil Co., Ltd.
    Inventors: Toshio Tani, Osamu Kamiyama, Noborn Matsuki, Ryosaku Fukuda, Tsukasa Akutsu, Hiroshi Nakatsugawa