Abstract: A component placement machine which picks up a component supplied by a tape feeder and installs the component on a board, includes a block part that includes a fitting hole to which a protrusion extending to a rear side from the tape feeder is fitted and a connection member that is provided in the block part, and connects the protrusion to the block part by elastically pressing a side surface of the protrusion fitted to the fitting hole.

Abstract: A method and device for removing metal fumes inside a snout in a continuous hot-dip plating plant are provided, which are capable of reliably removing metal fumes causing unplating from the snout without heating an outer wall of the snout. Heated inert gas is supplied to an inside of a snout which is formed between a continuous annealing furnace outlet and a hot-dip metal plating bath. Atmospheric temperature of the inside of the snout and temperature of an inner wall of the snout are maintained, gas having a flow rate greater than a gas supply flow rate is exhausted. A gas stream is formed which flows from the continuous annealing furnace to a surface of the hot-dip metal plating bath, which prevents quality defect from occurring caused by metal fumes generated from molten metal surface.

Abstract: A flow regulating member of a hot dip coating tank which is able to suppress stir-up of bottom dross, characterized by being provided with flow regulating member horizontal plates which are respectively arranged horizontally from below two side end parts of a sink roll, which is arranged inside of a coating tank in a rotatable manner, toward outside directions of the sink roll and side members which are arranged at positions separated from the two ends of the sink roll, which extend upward from the end parts of the respective horizontal plates, and in which large numbers of dispersion holes are formed, the side members having an aperture ratio of 20 to 80%, and the dispersion holes having a hole diameter of 5 to 50 mm.

Abstract: In an electronic component mounting system including a plurality of electronic component mounting apparatuses coupled in series, the system mounting an electronic component on a substrate to manufacture a mounted substrate, a substrate carried into a mounting conveyor is temporarily placed in a standby state in a substrate standby area formed by a first transfer conveyor (carry-in conveyor) of one electronic component mounting apparatus and a second transfer conveyor (carry-out conveyor) of another electronic component mounting apparatus positioned upstream of the one electronic component mounting apparatus.

Abstract: A gas sensor including a plate-shaped laminate disposed in a housing and fixed thereto via an element passage member and formed by laminating a gas sensor element and a heating element. The gas sensor element includes a plate-shaped solid electrolyte member, and a pair of detection electrodes formed on front and back surfaces thereof and constituting, in cooperation with the solid electrolyte member, a detection section for detecting the concentration of a specific gas. Insulating substrates mainly composed of alumina are provided on opposite sides of the laminate in the laminating direction. Coating layers mainly composed of a first material higher in toughness than alumina are formed on at least portions of outer surfaces of the insulating substrates in the laminating direction, the portions facing the element passage member. The coating layers are not formed on surfaces of the laminate parallel to the laminating direction.

Abstract: A flow regulating member of a hot dip coating tank which is able to suppress stir-up of bottom dross, characterized by being provided with flow regulating member horizontal plates which are respectively arranged horizontally from below two side end parts of a sink roll, which is arranged inside of a coating tank in a rotatable manner, toward outside directions of the sink roll and side members which are arranged at positions separated from the two ends of the sink roll, which extend upward from the end parts of the respective horizontal plates, and in which large numbers of dispersion holes are formed, the side members having an aperture ratio of 20 to 80%, and the dispersion holes having a hole diameter of 5 to 50 mm.

Abstract: [Object] There are provided a method for removing metal fumes inside a snout and a device for removing metal fumes inside a snout in a continuous hot-dip plating plant, which are capable of reliably removing metal fumes causing unplating from the snout without heating an outer wall of the snout.

Abstract: In a flux transfer unit to be used in an electronic component mounting apparatus for transferring flux to an electronic component picked up from a component feed unit and then mounting the electronic component onto a board, a blade holding head which has a first blade and a second blade for film formation use and scraping use of flux, respectively, and which is reciprocatively driven by a rodless cylinder via a drive transmission pin, is held by a movable member so as to be swingable about a swing support pin, and the movable member is braked with a specified braking force by a plate spring member. Thus, each time the direction of motion of the blade is reversed, the blade holding head swings, so that the first blade and the second blade can be automatically switched over without providing any exclusive drive mechanism.

Abstract: In a flux transfer unit to be used in an electronic component mounting apparatus for transferring flux to an electronic component picked up from a component feed unit and then mounting the electronic component onto a board, a blade holding head which has a first blade and a second blade for film formation use and scraping use of flux, respectively, and which is reciprocatively driven by a rodless cylinder via a drive transmission pin, is held by a movable member so as to be swingable about a swing support pin, and the movable member is braked with a specified braking force by a plate spring member. Thus, each time the direction of motion of the blade is reversed, the blade holding head swings, so that the first blade and the second blade can be automatically switched over without providing any exclusive drive mechanism.

Abstract: In an electronic component mounting system including a plurality of electronic component mounting apparatuses coupled in series, the system mounting an electronic component on a substrate to manufacture a mounted substrate, a substrate carried into a mounting conveyor is temporarily placed in a standby state in a substrate standby area formed by a first transfer conveyor (carry-in conveyor) of one electronic component mounting apparatus and a second transfer conveyor (carry-out conveyor) of another electronic component mounting apparatus positioned upstream of the one electronic component mounting apparatus. This eliminates the waste of time attributable to transfer of substrates and enhances the production efficiency by a compact facility.

Abstract: The inventive electronic component mounting apparatus for mounting an electronic component on a substrate includes a substrate positioning unit for individually positioning a single large-sized substrate or two small-sized substrates carried into a mounting conveyor in respective mounting work positions and a substrate underside support part arranged below the mounting conveyor and including a first underside support part and a second underside support part. It is thus possible to position a single substrate in a mounting work position in case a large-sized substrate is handled and to individually position a plurality of substrates in a plurality of mounting work positions in case a small-sized substrate is handled. This ensures flexible component mounting work on plural types of substrates by a compact facility.

Abstract: A mounting-waiting process for making a substrate to be transferred into a mounting process wait before the mounting process; and a substrate discharge-waiting process for making the substrate transferred from the mounting process wait before the following process are provided. When transfer of an unmounted substrate into the mounting process and transfer of a mounted substrate from the mounting process to the substrate discharge-waiting process are performed simultaneously, it is detected, by a substrate-arrival detecting sensor for detecting the mounted substrate transferred to the substrate discharge-waiting process and a substrate-continuity detecting sensor for detecting the unmounted substrate continuously transferred following to the mounted substrate, that a plurality of substrates have been transferred into the discharge-waiting process continuously.

Abstract: A mounting-waiting process for making a substrate to be transferred into a mounting process wait before the mounting process; and a substrate discharge-waiting process for making the substrate transferred from the mounting process wait before the following process are provided. When transfer of an unmounted substrate into the mounting process and transfer of a mounted substrate from the mounting process to the substrate discharge-waiting process are performed simultaneously, it is detected, by a substrate-arrival detecting sensor for detecting the mounted substrate transferred to the substrate discharge-waiting process and a substrate-continuity detecting sensor for detecting the unmounted substrate continuously transferred following to the mounted substrate, that a plurality of substrates have been transferred into the discharge-waiting process continuously.

Abstract: A compact and high-speed automatic electronic parts mounting apparatus is provided which includes first and second parts feeders, first and second mounting heads, a printed board-holding table, and a controller. Each of the first and second parts feeders includes a plurality of cassettes storing therein electronic parts and having pick-up stations. The second parts feeder is arranged at a preselected interval away from the first parts feeder in a first direction. Each of the first and second mounting heads is movable in the first direction and includes a plurality of pick-up nozzles movable in a vertical direction for picking up the electronic parts from the pick-up stations of the cassettes. The printed board-holding table is disposed within the preselected interval between the first and second parts feeders so as to move in a second direction perpendicular to the first direction.

Abstract: Cassettes contain electronic parts. First and second feeders are operative for feeding the electronic parts from the cassettes. A first mounting head has sucking nozzles for picking up the electronic parts fed by the first feeder. A second mounting head has sucking nozzles for picking up the electronic parts fed by the second feeder. A table arrangement is operative for holding a printed circuit board. The first and second mounting heads are alternately moved along a first direction to a region above the printed circuit board on the table arrangement. The table arrangement includes a mechanism for moving the printed circuit board on the table arrangement in a second direction perpendicular to the first direction. Also, the table arrangement includes a mechanisms for rotating the printed circuit board on the table arrangement about an axis perpendicular to both the first and second directions.