Abstract: An attachment structure for directly attaching a shield connector to an opening formed in a metal casing is provided. A shield connector for directly mounting on a device is attached to an opening formed in a metal casing. A connector housing is fastened to the casing with bolts from outside the casing. The opening of the metal casing has a diameter-enlarged portion formed in an end portion of the opening in an outside direction of the casing to be enlarged toward the outside direction. The shield shell has a contact piece at an end portion of the shield shell, and the contact piece is housed in and contacts with the diameter-enlarged portion in a state that the shield connector is attached to the opening.

Abstract: A fitting connector includes: a first connector; a second connector; a detection member that is relatively movable to a main locking position with respect to a housing when the housings are completely fitted to each other and is locked to the housing at the main locking position; and first and second holding structures which keep the completely fitted state, in which the first holding structure includes a first locking holder for the housing with a locking portion and a second locking holder provided in the counterpart housing and entering the locking portion to regulate the relative movement between the housings in the completely fitted state, in which the second locking holder includes a protrusion portion entering the locking portion and a flexible portion capable of moving the protrusion portion in a direction opposite to the insertion direction toward the locking portion while being bent.

Abstract: A fitting connector includes: a first connector; a second connector; a detection member that is relatively movable to a main locking position with respect to a housing when the housings are completely fitted to each other and is locked to the housing at the main locking position; and first and second holding structures which keep the completely fitted state, in which the first holding structure includes a first locking holder for the housing with a locking portion and a second locking holder provided in the counterpart housing and entering the locking portion to regulate the relative movement between the housings in the completely fitted state, in which the second locking holder includes a protrusion portion entering the locking portion and a flexible portion capable of moving the protrusion portion in a direction opposite to the insertion direction toward the locking portion while being bent.

Abstract: A female connector includes a female terminal, an inner housing which holds the female terminal, an outer housing relatively movable to the inner housing, tubular first shield shell integrated with the inner housing, and an elastic member which generates a resilient force. The male connector includes a male terminal, a housing which holds the male terminal, and the tubular second shield shell integrated with the housing. First shield shell abuts against the second shield shell on the connector insertion direction side with insertion of the connectors and is pressed against the second shield shell by the resilient force of the elastic member.

Abstract: A connector includes a female terminal; a female housing; a shield shell which is formed in a tubular conductive material in which both ends are opened, the shield shell being integrated with the female housing in a state in which at least one of an outer circumferential side and an inner circumferential side of an end portion on an insertion direction side to the male connector is exposed as an annular exposed surface, and the female terminal and/or the electric wire being disposed inside the shield shell; and a sealing member which has a tubular sealing portion interposed between the male housing of the fitted male connector or the shield shell and the exposed surface as a seal side exposed surface opposed to the male housing or the shield shell, and suppresses entry of liquid therebetween by the sealing member.

Abstract: A connector includes a female terminal; a female housing; a shield shell which is formed in a tubular conductive material in which both ends are opened, the shield shell being integrated with the female housing in a state in which at least one of an outer circumferential side and an inner circumferential side of an end portion on an insertion direction side to the male connector is exposed as an annular exposed surface, and the female terminal and/or the electric wire being disposed inside the shield shell; and a sealing member which has a tubular sealing portion interposed between the male housing of the fitted male connector or the shield shell and the exposed surface as a seal side exposed surface opposed to the male housing or the shield shell, and suppresses entry of liquid therebetween by the sealing member.

Abstract: A connector includes a female terminal; a female housing; a shield shell which is formed in a tubular conductive material in which both ends are opened, the shield shell being integrated with the female housing in a state in which at least one of an outer circumferential side and an inner circumferential side of an end portion on an insertion direction side to the male connector is exposed as an annular exposed surface, and the female terminal and/or the electric wire being disposed inside the shield shell; and a sealing member which has a tubular sealing portion interposed between the male housing of the fitted male connector or the shield shell and the exposed surface as a seal side exposed surface opposed to the male housing or the shield shell, and suppresses entry of liquid therebetween by the sealing member.

Abstract: A female connector includes a female terminal, an inner housing which holds the female terminal, an outer housing relatively movable to the inner housing, tubular first shield shell integrated with the inner housing, and an elastic member which generates a resilient force. The male connector includes a male terminal, a housing which holds the male terminal, and the tubular second shield shell integrated with the housing. First shield shell abuts against the second shield shell on the connector insertion direction side with insertion of the connectors and is pressed against the second shield shell by the resilient force of the elastic member.

Abstract: To provide an image pickup apparatus with excellent optical characteristics as well as high reliability and a method of manufacturing the same, capable of efficiently manufacturing the image pickup apparatus in large quantities. The image pickup apparatus of the present invention includes a support board 10, an image pickup device 20 mounted on the support board 10, and a lens component 30 provided on the light receiving region of the image pickup device 20, wherein the lens component 30 has a protrusion part 33 provided around the lens part 31, and the height of the protrusion part 33 from the surface of image pickup device 20 is greater than that of the top 31A of lens part 31 from the surface of the image pickup device 20.

Abstract: A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

Abstract: A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

Abstract: A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

Abstract: The present invention relates to a Jig and method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

Abstract: The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

Abstract: A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

Abstract: To provide an image pickup apparatus with excellent optical characteristics as well as high reliability and a method of manufacturing the same, capable of efficiently manufacturing the image pickup apparatus in large quantities. The image pickup apparatus of the present invention includes a support board 10, an image pickup device 20 mounted on the support board 10, and a lens component 30 provided on the light receiving region of the image pickup device 20, wherein the lens component 30 has a protrusion part 33 provided around the lens part 31, and the height of the protrusion part 33 from the surface of image pickup device 20 is greater than that of the top 31A of lens part 31 from the surface of the image pickup device 20.

Abstract: A substrate sheet material for semiconductor device and manufacturing method thereof and a manufacturing method of a semiconductor device using the substrate sheet material can suppress and reduce a warp which may occur in the substrate sheet material even when a plurality of semiconductor chips formed in the substrate sheet material are molded all at once. A plurality of substrates to be used for producing semiconductor packages are formed in the substrate sheet material. An outer configuration of the substrate sheet material is made into a circular shape.

Abstract: A substrate sheet material for semiconductor device and manufacturing method thereof and a manufacturing method of a semiconductor device using the substrate sheet material can suppress and reduce a warp which may occur in the substrate sheet material even when a plurality of semiconductor chips formed in the substrate sheet material are molded all at once. A plurality of substrates to be used for producing semiconductor packages are formed in the substrate sheet material. An outer configuration of the substrate sheet material is made into a circular shape.

Abstract: The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame 21, and a rubber film 22 arranged within the outer frame 21 and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film 22 increases, the wafer-fixing jig 20 deforms the rubber film and allows the tapes 2 and 6 arranged between the wafer 1 and the rubber film 22A to be pushed toward the wafer 1 gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

Abstract: First, a board is placed on a board mounting portion with a lower mold and an upper mold being opened. Then, a resin material having such size and shape that correspond to the size and shape of a cavity formed in the lower mold is fitted in the cavity. Thereafter, the resin material is heated resulting in melted resin. Thereafter, the lower mold and the upper mold are closed, with a space formed by the upper mold and the lower mold being reduced in pressure. As a result, chips and wires are immersed in the melted resin. Thereafter, the melted resin is set, so that a resin mold product including the board and the set resin is formed.