Abstract: A light-emitting element mounting substrate includes an insulative substrate including a single-sided printed circuit board, a pair of wiring patterns formed on one surface of the substrate, the wiring patterns being separated with a first distance, a pair of through-holes penetrating through the substrate in a thickness direction, the through-holes being separated with a second distance, and a pair of filled portions including a metal filled in the pair of through-holes to contact the pair of wiring patterns and to be exposed on a surface of the substrate opposite to the one surface. Each of the pair of filled portions has a horizontal projected area of not less than 50% of an area of each the pair of wiring patterns.

Abstract: A light-emitting element mounting substrate includes an insulative substrate including a single-sided printed circuit board, a pair of wiring patterns formed on one surface of the substrate, the wiring patterns being separated with a first distance, a pair of filled portions including a metal filled in a pair of through-holes to contact the pair of wiring patterns and to be exposed on a surface of the substrate opposite to the one surface, the pair of through-holes being formed to penetrate through the substrate in a thickness direction and to be separated with a second distance, and an insulation layer having a light reflectivity formed on the one surface of the substrate. The pair of filled portions each have a horizontal projected area of not less than 50% of each area the pair of wiring patterns, and the insulation layer includes an opening to expose the pair of wiring patterns.

Abstract: A light-emitting element mounting substrate includes an insulative substrate, a pair of wiring patterns formed on one surface of the substrate, and a pair of filled portions including a metal filled in a pair of through-holes to contact the pair of wiring patterns and to be exposed on a surface of the substrate opposite to the one surface, the pair of through-holes penetrating through the substrate in a thickness direction. The pair of filled portions includes a protruding portion that protrudes outward from the pair of wiring patterns when viewed from the one surface side of the substrate.

Abstract: An LED module includes an electrical insulation material including a first surface having a total reflectivity of not less than 80% with respect to light with a wavelength of 450 nm, a via hole penetrating through the electrical insulation material, a wiring pattern on a second surface of the electrical insulation material, a metal filler formed in the via hole and electrically connected to the wiring pattern, and an LED chip bonded to a surface of the metal filler on the first surface of the electrical insulation material, and sealed with a resin.

Abstract: A method for fabricating a solar battery module includes cell preparing step for preparing a solar battery cell having an electrode wiring, wiring substrate preparing step for preparing a base material and a wiring substrate having a wiring pattern provided above the base material, mounting step for electrically connecting the wiring pattern with the electrode wiring and mounting the solar battery cell on the wiring substrate, and exposing step for removing the base material to expose the wiring pattern.

Abstract: An LED module comprises: an LED element having an electrode for flip chip mounting; a wiring board having at least two metal layers and an electrically insulating layer including a polymer resin and being interposed between each two of the metal layers; and a metal film layer of the LED element for conducting heat from the LED element. A first metal layer of the at least two metal layers has a power supply metal pattern and a heat transfer metal pattern that are formed electrically insulated from each other. The power supply metal pattern and the electrode are connected to each other; the heat transfer metal pattern and the metal film layer are connected through an electrically insulating portion interposed therebetween; and the heat transfer metal pattern and the metal layers other than the first metal layer are coupled to each other through a heat transfer portion.

Abstract: An LED module comprises: an LED element having an electrode for flip chip mounting; a wiring board having at least two metal layers and an electrically insulating layer including a polymer resin and being interposed between each two of the metal layers; and a metal film layer of the LED element for conducting heat from the LED element. A first metal layer of the at least two metal layers has a power supply metal pattern and a heat transfer metal pattern that are formed electrically insulated from each other. The power supply metal pattern and the electrode are connected to each other; the heat transfer metal pattern and the metal film layer are connected through an electrically insulating portion interposed therebetween; and the heat transfer metal pattern and the metal layers other than the first metal layer are coupled to each other through a heat transfer portion.

Abstract: The occurrence of burrs and chips in punching an insulating film is suppressed by adjusting an edge tearing resistance of the insulating film. The edge tearing resistance is preferably 50 to 70 kgf/20 mm for the purpose of suppressing the burrs and the chips.

Abstract: The occurrence of burrs and chips in punching an insulating film is suppressed by adjusting an edge tearing resistance of the insulating film. The edge tearing resistance is preferably 50 to 70 kgf/20 mm for the purpose of suppressing the burrs and the chips.