Abstract: A highly reliable RFID tag is provided that is lighter and smaller and has a desired communication distance, and that can be applied to deformable articles. The RFID tag includes a first end of a first power feeding coil that is connected to a first input and output terminal of an RFIC element, a second end of the first power feeding coil that is connected to one end of a second power feeding coil, and the other end of the second power feeding coil is connected to a second input and output terminal of the RFIC element. Moreover, the RFID tag has a spring-shaped antenna that has a first region with magnetic field coupling of the first power feeding coil, and a second region with magnetic field coupling of the second power feeding coil. The first region and the second region are continuous via a region having an inductance component.

Abstract: In a wireless communication device, radiation conductors including a first and second end portions are reformed on an upper surface of a radiation conductor base material. First and second terminal electrodes are provided at a same or substantially the same interval as the first and second end portions, on a lower surface of a RFIC element. A seal includes an adhesive surface larger than a principal surface of the RFIC element. The RFIC element is arranged on the upper surface of the radiation conductor substrate so that each of the first and second terminal electrodes comes into contact with the first and second end portions. The seal is pasted to the radiation conductor substrate so as to cover the RFIC element.

Abstract: An RFID tag manufacturing apparatus that includes an antenna base material conveying part that conveys an antenna base material with antenna patterns in a first direction. Moreover, the apparatus includes a conveying part for an RFIC element that supplies an RFIC element having terminal electrodes for connection with the antenna patterns on one principal surface. A plotter is further provided that conveys the supplied RFIC element to a predetermined position of the antenna patterns and temporarily bonds the RFIC element to the antenna patterns. Finally, the apparatus includes a pressurizing part that applies a pressure to the temporarily bonded RFIC element to permanently bond the RFIC element to the antenna patterns. In an aspect, the plotter includes a fixed arm portion and a movable suction head.

Abstract: An attention tag for a retail article that includes a label having an adhesive region bonded to a retail article and a protruding region that protrudes from the retail article when the label is attached thereto. Moreover, an RFID tag is disposed on the label and includes an RFIC element and an antenna pattern including first and second antenna portions that are respectively connected to first and second ends of the RFIC element. Moreover, the first antenna portion is disposed in the protruding region of the label while the second antenna portion of the RFID tag is disposed in the adhesive region of the label at a position facing a portion of the retail article.

Abstract: An RFID tag is provided that includes a substrate, an RFIC element and a dipole antenna. The dipole antenna includes a first dipole element and a second dipole element. The first dipole element includes a first fold-back portion, and forms a capacitance between the first fold-back portion and a first facing portion. Furthermore, the first dipole element includes a first interposed portion that is interposed between a first open end and the second dipole element. Similarly, the second dipole element includes a second fold-back portion, and forms a capacitance between the second fold-back portion and a second facing portion. Furthermore, the second dipole element includes a second interposed portion that is interposed between a second open end and the first dipole element.

Abstract: An attachable booster antenna attachable to a coil antenna, includes a body; and an antenna including a multiple resonant antennas arrayed on the body, with each resonant antenna including an insulator layer having first and second surfaces; and first and second loop antennas disposed on the first and second surfaces, respectively, so as to confront each other via the insulator layer. Moreover, the first and second loop antennas each having an opening that discontinue a part of a loop and are arranged such that a closed loop is defined by at least a part of the first loop antenna and at least a part of the second loop antenna in a transparent plane viewed from a normal direction of the insulator layer. Furthermore, in the plan view of the insulator layer, the opening of the first and second loop antennas and the opening of the coil antenna overlap each other.

Abstract: A wireless communication device is provided that has a dielectric member attached to a metal surface of an article, an RFIC element including first and second terminal electrodes, a first radiation electrode disposed on the dielectric member in parallel with and oppositely to the metal surface of the article at a predetermined distance and connected to the first terminal electrode of the RFIC element, and a second radiation electrode disposed on the dielectric member in parallel with and oppositely to the metal surface of the article at the predetermined distance and connected to the second terminal electrode of the RFIC element independently of the first radiation electrode. The first and second radiation electrodes extend in respective directions intersecting with each other, with the first radiation electrode having a smaller width and a shorter length in an extending direction than the second radiation electrode.

Abstract: An RFID tag with an RFIC module including a substrate, an RFIC chip disposed on the substrate, and a loop conductor disposed on the substrate and connected to the RFIC chip; and an antenna base material mounted with the RFIC module and including an antenna conductor with a radiating portion radiating radio waves and a coupling portion connected to the radiating portion, for electromagnetic field coupling with the loop conductor. Moreover, the loop conductor includes a first loop pattern formed on a first main surface of the substrate, a second loop pattern formed on a second main surface confronting the first main surface, and an interlayer connection conductor extending through the substrate, for connecting the first and the second loop patterns in series.

Abstract: A plurality of surface mounting components are arranged on a component mounting surface of a transfer substrate. A resin layer is formed on the transfer substrate and the plurality of surface mounting components are buried in the resin layer. The resin layer is peeled off the transfer substrate, with the plurality of surface mounting components buried in the resin layer, to expose a surface resin layer. An intermediate auxiliary layer is provided on the exposed surface of the resin layer. The intermediate auxiliary layer has openings to expose respective mounting terminals of the surface mounting component. Metal materials are arranged in the openings. A wiring sheet which includes a thermoplastic resin sheet with an electrode pattern and a plurality of unmetallized via patterns is joined to the intermediate auxiliary layer so that each of the via patterns aligns with a respective one of the openings in the intermediate auxiliary layer.

Abstract: A method for manufacturing a carrier tape housing electronic components with seal materials includes preparing a tape-shaped main body with housing holes including bottom surfaces along a longitudinal direction, providing chip-shaped electronic components respectively into the housing holes, affixing a tape-shaped seal material having an adhesive layer on one principal surface to the tape-shaped main body such that the adhesive layer covers the housing holes and adheres to the electronic components, and forming cuts in the tape-shaped seal material to separate portions defining and functioning as the seal materials including portions at least partially overlapping with the respective housing holes in a planar view from the other portions.

Abstract: An antenna is connected to a first end of a high-frequency transmission line, and a connector is connected to a second end of the high-frequency transmission line. A characteristic impedance of a microstrip line is higher than characteristic impedances of first and second strip lines, and a characteristic impedance of a coplanar line is higher than a characteristic impedance of the second strip line. Thus, at a certain frequency, a standing wave develops in which the position of the microstrip line and the position of the coplanar line are maximum voltage points and three-quarter-wavelength resonance is a fundamental wave mode. Thus, the cutoff frequency of the high-frequency transmission line is high, and an insertion loss of a signal is significantly reduced to be low over a wide band.

Abstract: A wireless communication device for transmitting/receiving a high-frequency signal having a predetermined communication frequency. The wireless communication device includes an antenna pattern having an inductance component, an RFIC element connected electrically to the antenna pattern and a capacitive coupling portion capacitively coupling specific confronting regions facing each other of the antenna pattern at multiple points on the antenna pattern, to make up an LC parallel resonant circuit.

Abstract: A high-frequency signal transmission line includes a body; a signal line including a first line portion provided to a first layer of the body, a second line portion provided to a second layer of the body alternately being connected; and a first ground conductor provided to the first layer or a third layer positioned on an opposite side of the second layer relative to the first layer, and also overlaid with a plurality of second line portions in planar view from a normal direction of a principal surface of the body, and also not overlaid with a plurality of the first line portions. A property impedance of the first line portion and a property impedance of the second line portion are different from each other.

Abstract: An electromagnetic-coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted and a feeder circuit including a resonant circuit having a predetermined resonant frequency is attached to an article. The article has a radiation element that radiates a transmission signal supplied from the feeder circuit of the electromagnetic-coupling module via electromagnetic coupling and that supplies a received reception signal to the feeder circuit via the electromagnetic coupling.

Abstract: A wireless IC device includes a resin member including first and second surfaces, a substrate including first and second principal surfaces, a coil antenna provided in the resin member, and an RFIC element mounted on the substrate and connected to the coil antenna. The substrate is embedded in the resin member so that the second principal surface is at a second surface side. The coil antenna is defined by first linear conductor patterns on the second surface, first metal posts extending between the first and second surfaces, second metal posts extending between the first and second surfaces, and second linear conductor patterns on the first surface. The RFIC element is disposed in the coil antenna.

Abstract: An RFID tag includes a base material, an RFIC element, and a dipole antenna. The base material has a first end, a second end, a first side, and a second side. The RFIC element is mounted on the base material and includes a first input and output terminal and a second input and output terminal. The dipole antenna includes a first dipole element and a second dipole element. The first dipole element is a conductor pattern that extends from a first connection end toward the first end and meanders toward the first side, and the second dipole element is a conductor pattern that extends from a second connection end toward the second end and meanders toward the second side.

Abstract: An antenna device includes two conductor surfaces at opposing positions with a space interposed between the conductor surfaces, a first connection conductor connecting the two conductor surfaces galvanically at one location, and an antenna coil arranged in proximity to the first connection conductor. The antenna coil is arranged at a position at which the antenna coil causes an induced current to flow through the first connection conductor by electromagnetic induction. Currents in the opposite directions flow through peripheral edge portions of the two conductor surfaces, so that a magnetic field is radiated from A space across which the two conductor surfaces oppose each other. This enables a conductor surface defined by a metal plate or the like to be used as a radiation element without providing a slit or an opening in the metal plate so as to avoid problems of a decrease in mechanical strength, design restrictions, and a decrease in an electric field shielding effect.

Abstract: In a wireless communication device, radiation conductors including a first and second end portions are reformed on an upper surface of a radiation conductor base material. First and second terminal electrodes are provided at a same or substantially the same interval as the first and second end portions, on a lower surface of a RFIC element. A seal includes an adhesive surface larger than a principal surface of the RFIC element. The RFIC element is arranged on the upper surface of the radiation conductor substrate so that each of the first and second terminal electrodes comes into contact with the first and second end portions. The seal is pasted to the radiation conductor substrate so as to cover the RFIC element.

Abstract: An inductor bridge is provided with a flexible flat plate-shaped element body, a first connector, and a second connector. The element body includes therein an inductor portion. The inductor portion is configured by a spiral conductor pattern. The first connector is provided on the element body and is connected to a first circuit. The second connector is provided on the element body and is connected to a second circuit.

Abstract: A method for manufacturing a carrier tape housing electronic components with seal materials includes preparing a tape-shaped main body including housing holes penetrating from one surface to other surface along a longitudinal direction, preparing a tape-shaped seal material including an adhesive layer on the one surface and including pairs of terminal electrodes on the adhesive layer, affixing the adhesive layer to the other surface such that respective portions of the paired terminal electrodes are located within each of the housing holes in a planar view, forming cuts in the tape-shaped seal material to separate portions defining and functioning as the seal materials including portions overlapping with the respective housing holes in a planar view from the other portions, and providing an electronic component into each housing hole and connecting the respective portions of the paired terminal electrodes located within each of the housing holes to the electronic component.