Abstract: It is able to restrict increase of a chip area even if the pad pitch is reduced and the pad length is increased in a semiconductor device by arranging pads (4, 5), comprising electrically connected first and second regions having different number of wiring layers, above an I/O circuit (2).

Abstract: A semiconductor integrated circuit having an embedded array wherein basic cells are arranged in a matrix is designed and manufactured (S1); a test is performed on whether an electrical behavior of a prototype of a semiconductor integrated circuit meets required specifications (S2); if meets, a non-use-area pattern in an embedded array area is detected and removed based on layout data of contact holes to get modified pattern (S4); a mask with a modified pattern is prepared (S5); and the mask is substituted for the mask before modification, thereby manufacturing a semiconductor integrated circuits from which a non-use area is removed (S6).

Abstract: A semiconductor integrated circuit having an embedded array wherein basic cells are arranged in a matrix is designed and manufactured (S1); a test is performed on whether an electrical behavior of a prototype of a semiconductor integrated circuit meets required specifications (S2); if meets, a non-use-area pattern in an embedded array area is detected and removed based on layout data of contact holes to get modified pattern (S4); a mask with a modified pattern is prepared (S5); and the mask is substituted for the mask before modification, thereby manufacturing a semiconductor integrated circuits from which a non-use area is removed (S6).

Abstract: A semiconductor integrated circuit having an embedded array wherein basic cells are arranged in a matrix is designed and manufactured (S1); a test is performed on whether an electrical behavior of a prototype of a semiconductor integrated circuit meets required specifications (S2); if meets, a non-use-area pattern in an embedded array area is detected and removed based on layout data of contact holes to get modified pattern (S4); a mask with a modified pattern is prepared (S5); and the mask is substituted for the mask before modification, thereby manufacturing a semiconductor integrated circuits from which a non-use area is removed (S6).

Abstract: A semiconductor integrated circuit having an embedded array wherein basic cells are arranged in a matrix is designed and manufactured (S1); a test is performed on whether an electrical behavior of a prototype of a semiconductor integrated circuit meets required specifications (S2); if meets, a non-use-area pattern in an embedded array area is detected and removed based on layout data of contact holes to get modified pattern (S4); a mask with a modified pattern is prepared (S5); and the mask is substituted for the mask before modification, thereby manufacturing a semiconductor integrated circuits from which a non-use area is removed (S6).

Abstract: A semiconductor integrated circuit having an embedded array wherein basic cells are arranged in a matrix is designed and manufactured (S1); a test is performed on whether an electrical behavior of a prototype of a semiconductor integrated circuit meets required specifications (S2); if meets, a non-use-area pattern in an embedded array area is detected and removed based on layout data of contact holes to get modified pattern (S4); a mask with a modified pattern is prepared (S5); and the mask is substituted for the mask before modification, thereby manufacturing a semiconductor integrated circuits from which a non-use area is removed (S6).

Abstract: A semiconductor integrated circuit having an embedded array wherein basic cells are arranged in a matrix is designed and manufactured (S1); a test is performed on whether an electrical behavior of a prototype of a semiconductor integrated circuit meets required specifications (S2); if meets, a non-use-area pattern in an embedded array area is detected and removed based on layout data of contact holes to get modified pattern (S4); a mask with a modified pattern is prepared (S5); and the mask is substituted for the mask before modification, thereby manufacturing a semiconductor integrated circuits from which a non-use area is removed (S6).

Abstract: A semiconductor integrated circuit having an embedded array wherein basic cells are arranged in a matrix is designed and manufactured (S1); a test is performed on whether an electrical behavior of a prototype of a semiconductor integrated circuit meets required specifications (S2); if meets, a non-use-area pattern in an embedded array area is detected and removed based on layout data of contact holes to get modified pattern (S4); a mask with a modified pattern is prepared (S5); and the mask is substituted for the mask before modification, thereby manufacturing a semiconductor integrated circuits from which a non-use area is removed (S6).

Abstract: A semiconductor integrated circuit having an embedded array wherein basic cells are arranged in a matrix is designed and manufactured (S1); a test is performed on whether an electrical behavior of a prototype of a semiconductor integrated circuit meets required specifications (S2); if meets, a non-use-area pattern in an embedded array area is detected and removed based on layout data of contact holes to get modified pattern (S4); a mask with a modified pattern is prepared (S5); and the mask is substituted for the mask before modification, thereby manufacturing a semiconductor integrated circuits from which a non-use area is removed (S6).

Abstract: A semi-custom integrated circuit comprises a basic cell array comprising a plurality of basic cells aligned in a first direction, the basic cells comprising a transistor unit, a capacitor unit and a resistor unit arranged in a second direction perpendicular to the first direction. The transistor unit is positioned between the capacitor unit and the resistor unit. The transistor unit has a terminal portion for connection of wiring, the capacitor unit having a terminal portion for connection of wiring, the resistor unit having a terminal portion for connection of wiring. The terminal portions of said transistor unit, capacitor unit and resistor unit are aligned along a line.

Abstract: A load cell has a cantilever-type load-sensitive element with an upper beam and a lower beam, each having formed thereon a pair of strain-generating parts which generates a strain corresponding to an applied load. Only one of these two beams has an indented part formed on its surface and strain-detecting elements are attached to its bottom surface at positions corresponding to the strain-generating parts. A moisture-proof sheet is attached to the beam to completely seal the interior of this indented part to protect the strain-detecting elements from humidity and moisture.