Patents by Inventor Noboru Morioka

Noboru Morioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11081804
    Abstract: A multilayer substrate includes a first dielectric layer and a conductor pattern disposed in at least an interior of the first dielectric layer. A second dielectric layer formed of a different material from a material of the first dielectric layer is disposed on the multilayer substrate. At least one radiation element is formed on the second dielectric layer. A feeding wire connects the radiation element and the conductor pattern. The feeding wire includes a conductor pin that is conductive and extends in a thickness direction of the second dielectric layer. The conductor pin electrically connects the radiation element and the conductor pattern. Provided is an antenna-integrated type communication module having such a structure that the accuracy of circuit simulation is easily enhanced and the degree of freedom in selection of dielectric materials is large.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: August 3, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ryuken Mizunuma, Shinichiro Banba, Michiharu Yokoyama, Hideki Ueda, Hideaki Yamada, Noboru Morioka
  • Patent number: 10757845
    Abstract: A high-frequency component includes a wiring substrate, a component mounted on an upper surface of the wiring substrate, a columnar member formed of a conductive resin and standing on the upper surface of the wiring substrate in a state of a lower end portion of the columnar member being fixed to the upper surface of the wiring substrate, and a shield case covering the component and the columnar member. The shield case has a lid plate disposed so as to face the upper surface of the wiring substrate and a side plate extending from an edge of the lid plate toward the upper surface of the wiring substrate, and an upper end portion of the columnar member is fixed to each of four corner portions of the lid plate, when viewed in a direction perpendicular to the upper surface of the wiring substrate.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: August 25, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshikazu Yagi, Kazushige Sato, Akihiro Hara, Noboru Morioka, Nobumitsu Amachi
  • Publication number: 20190215993
    Abstract: A high-frequency component includes a wiring substrate, a component mounted on an upper surface of the wiring substrate, a columnar member formed of a conductive resin and standing on the upper surface of the wiring substrate in a state of a lower end portion of the columnar member being fixed to the upper surface of the wiring substrate, and a shield case covering the component and the columnar member. The shield case has a lid plate disposed so as to face the upper surface of the wiring substrate and a side plate extending from an edge of the lid plate toward the upper surface of the wiring substrate, and an upper end portion of the columnar member is fixed to each of four corner portions of the lid plate, when viewed in a direction perpendicular to the upper surface of the wiring substrate.
    Type: Application
    Filed: March 12, 2019
    Publication date: July 11, 2019
    Inventors: Yoshikazu YAGI, Kazushige SATO, Akihiro HARA, Noboru MORIOKA, Nobumitsu AMACHI
  • Publication number: 20180205155
    Abstract: A multilayer substrate includes a first dielectric layer and a conductor pattern disposed in at least an interior of the first dielectric layer. A second dielectric layer formed of a different material from a material of the first dielectric layer is disposed on the multilayer substrate. At least one radiation element is formed on the second dielectric layer. A feeding wire connects the radiation element and the conductor pattern. The feeding wire includes a conductor pin that is conductive and extends in a thickness direction of the second dielectric layer. The conductor pin electrically connects the radiation element and the conductor pattern. Provided is an antenna-integrated type communication module having such a structure that the accuracy of circuit simulation is easily enhanced and the degree of freedom in selection of dielectric materials is large.
    Type: Application
    Filed: March 16, 2018
    Publication date: July 19, 2018
    Inventors: Ryuken MIZUNUMA, Shinichiro BANBA, Michiharu YOKOYAMA, Hideki UEDA, Hideaki YAMADA, Noboru MORIOKA
  • Patent number: 7505003
    Abstract: A card device includes a card case, a circuit board disposed in the card case, and an antenna rotatably disposed on the outside of the card case. An antenna rotating shaft is disposed on the base end of the antenna and inserted from the outside into the inside of the card case through a through-hole of the card case such that the antenna rotating shaft extends along the surface of the circuit board and is supported within the card case with the inner part of the antenna rotating shaft being spaced apart from the circuit board and the antenna rotating shaft being freely rotatable. A feed terminal having elasticity that urges the feed terminal against the antenna rotating shaft is disposed between the antenna rotating shaft and a part of the circuit board facing the antenna rotating shaft. The feed terminal is fixed to an antenna connection part of a circuit formed on the circuit board facing the antenna rotating shaft. The feed terminal is urged by its elasticity into contact with the antenna rotating shaft.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: March 17, 2009
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Wataru Kakinoki, Yasutaka Maekawa, Noboru Morioka
  • Publication number: 20070139279
    Abstract: A card device includes a card case, a circuit board disposed in the card case, and an antenna rotatably disposed on the outside of the card case. An antenna rotating shaft is disposed on the base end of the antenna and inserted from the outside into the inside of the card case through a through-hole of the card case such that the antenna rotating shaft extends along the surface of the circuit board and is supported within the card case with the inner part of the antenna rotating shaft being spaced apart from the circuit board and the antenna rotating shaft being freely rotatable. A feed terminal having elasticity that urges the feed terminal against the antenna rotating shaft is disposed between the antenna rotating shaft and a part of the circuit board facing the antenna rotating shaft. The feed terminal is fixed to an antenna connection part of a circuit formed on the circuit board facing the antenna rotating shaft. The feed terminal is urged by its elasticity into contact with the antenna rotating shaft.
    Type: Application
    Filed: August 31, 2004
    Publication date: June 21, 2007
    Inventors: Wataru Kakinoki, Yasutaka Maekawa, Noboru Morioka