Patents by Inventor Noboru OTABE
Noboru OTABE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220149549Abstract: [Problem] To provide an electrical connecting apparatus that can realize a stable electrical connecting property by expanding a contact area between an electrode region of a wiring substrate and a connector as compared to the prior art, and suppressing contact resistance.Type: ApplicationFiled: December 13, 2019Publication date: May 12, 2022Inventors: Shou HARAKO, Noboru OTABE, Hiroshi KAMIYA, Yoshiyuki FUKAMI, Shogo MIZUTANI
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Patent number: 11099227Abstract: Included are an insulating plate 41 including a plurality of insulating synthetic resin layers, wiring circuits 44a, 44b, and 44c provided in the insulating plate 41, a thin-film resistor 46 formed to be buried in the insulating plate 41 and electrically connected to the wiring circuits 44a, 44b, and 44c, a heat dissipating portion 47 provided over one surface of the insulating plate to be opposed to the thin-film resistor 46 via a part of the plurality of insulating synthetic resin layers and having higher heat conductivity than that of the insulating plate 41, a pedestal portion 48 formed to be buried in the insulating plate 41 and provided to be opposed to the thin-film resistor 46 via a part of the plurality of insulating synthetic resin layers on an opposite side of the heat dissipating portion 47 and having higher heat conductivity than that of the insulating plate 41, and a heat dissipation and pedestal connecting portion 49 connecting the heat dissipating portion 47 to the pedestal portion 48 and haviType: GrantFiled: April 6, 2017Date of Patent: August 24, 2021Assignee: Kabushiki Kaisha Nihon MicronicsInventors: Noboru Otabe, Yoshiyuki Fukami
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Publication number: 20200400739Abstract: Included are an insulating plate 41 including a plurality of insulating synthetic resin layers, wiring circuits 44a, 44b, and 44c provided in the insulating plate 41, a thin-film resistor 46 formed to be buried in the insulating plate 41 and electrically connected to the wiring circuits 44a, 44b, and 44c, a heat dissipating portion 47 provided over one surface of the insulating plate to be opposed to the thin-film resistor 46 via a part of the plurality of insulating synthetic resin layers and having higher heat conductivity than that of the insulating plate 41, a pedestal portion 48 formed to be buried in the insulating plate 41 and provided to be opposed to the thin-film resistor 46 via a part of the plurality of insulating synthetic resin layers on an opposite side of the heat dissipating portion 47 and having higher heat conductivity than that of the insulating plate 41, and a heat dissipation and pedestal connecting portion 49 connecting the heat dissipating portion 47 to the pedestal portion 48 and haviType: ApplicationFiled: April 6, 2017Publication date: December 24, 2020Inventors: Noboru OTABE, Yoshiyuki FUKAMI
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Patent number: 10705122Abstract: Provided is a probe card with which the adjustment of height deviations of needle tip parts of probes and the adjustment of parallelism between the probes and an object to be inspected are simplified. The probe card 1 has: a wiring substrate 2 having wiring 4 therein or on a surface thereof or the like; a plurality of probes 3; and a dielectric film 6. The dielectric film 6 is disposed to be spaced a distance away from a main surface 8 of the wiring substrate 2 at a position spaced away further from the wiring substrate 2 than the needle tip parts 13 of the probes 3, so that one surface 21 of the dielectric film 6 faces the needle tip parts 13 and faces the main surface 8 that is a probe installation surface of the wiring substrate 2. The probe card 1 configures a state in which the needle tip parts 13 face an electrode of an object to be inspected with the dielectric film 6 interposed between the probe card 1 and the needle tip parts 13, during an inspection of the object to be inspected.Type: GrantFiled: March 21, 2017Date of Patent: July 7, 2020Assignee: Kabushiki Kaisha Nihon MicronicsInventors: Yoshiyuki Fukami, Hidehiro Kiyofuji, Noboru Otabe
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Publication number: 20190154730Abstract: Provided is a probe card with which the adjustment of height deviations of needle tip parts of probes and the adjustment of parallelism between the probes and an object to be inspected are simplified. The probe card 1 has: a wiring substrate 2 having wiring 4 therein or on a surface thereof or the like; a plurality of probes 3; and a dielectric film 6. The dielectric film 6 is disposed to be spaced a distance away from a main surface 8 of the wiring substrate 2 at a position spaced away further from the wiring substrate 2 than the needle tip parts 13 of the probes 3, so that one surface 21 of the dielectric film 6 faces the needle tip parts 13 and faces the main surface 8 that is a probe installation surface of the wiring substrate 2. The probe card 1 configures a state in which the needle tip parts 13 face an electrode of an object to be inspected with the dielectric film 6 interposed between the probe card 1 and the needle tip parts 13, during an inspection of the object to be inspected.Type: ApplicationFiled: March 21, 2017Publication date: May 23, 2019Inventors: Yoshiyuki FUKAMI, Hidehiro KIYOFUJI, Noboru OTABE
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Patent number: 9271393Abstract: A multilayer wiring base plate includes an insulating plate including a plurality of synthetic resin layers made of an insulating material, a wiring circuit provided in the insulating plate, a thin-film resistor formed along at least one of the synthetic resin layers to be buried in the synthetic resin layer and inserted in the wiring circuit, and a heat expansion and contraction restricting layer formed to be buried in the synthetic resin layer adjacent to the synthetic resin layer in which the thin-film resistor is formed to be buried, arranged along the thin-film resistor, and having a smaller linear expansion coefficient than a linear expansion coefficient of the adjacent synthetic resin layers.Type: GrantFiled: July 16, 2013Date of Patent: February 23, 2016Assignee: Kabushiki Kaisha Nihon MicronicsInventors: Noboru Otabe, Toshinori Omori, Takayasu Sugai
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Patent number: 9113546Abstract: A method for manufacturing an electric film body is made by forming a film body to have a shape in accordance with a desired electric characteristic and includes a film forming process for forming an electric film body on a board layer, an electric characteristic measuring process for measuring an electric characteristic in a surface of the electric film body formed in the film forming process, an electric film body shape setting process for setting a shape of the electric film body based on the electric characteristic measured in the electric characteristic measuring process, and an electric film body forming process for forming the electric film body formed in the shape set in the electric film body shape setting process.Type: GrantFiled: August 28, 2013Date of Patent: August 18, 2015Assignee: KABUSHIKI KAISHA NIHON MICRONICSInventors: Takayasu Sugai, Noboru Otabe
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Publication number: 20140118017Abstract: A multilayer wiring base plate includes an insulating plate including a plurality of synthetic resin layers made of an insulating material, a wiring circuit provided in the insulating plate, a thin-film resistor formed along at least one of the synthetic resin layers to be buried in the synthetic resin layer and inserted in the wiring circuit, and a heat expansion and contraction restricting layer formed to be buried in the synthetic resin layer adjacent to the synthetic resin layer in which the thin-film resistor is formed to be buried, arranged along the thin-film resistor, and having a smaller linear expansion coefficient than a linear expansion coefficient of the adjacent synthetic resin layers.Type: ApplicationFiled: July 16, 2013Publication date: May 1, 2014Inventors: Noboru OTABE, Toshinori OMORI, Takayasu SUGAI
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Publication number: 20140072780Abstract: A method for manufacturing an electric film body is made by forming a film body to have a shape in accordance with a desired electric characteristic and includes a film forming process for forming an electric film body on a board layer, an electric characteristic measuring process for measuring an electric characteristic in a surface of the electric film body formed in the film forming process, an electric film body shape setting process for setting a shape of the electric film body based on the electric characteristic measured in the electric characteristic measuring process, and an electric film body forming process for forming the electric film body formed in the shape set in the electric film body shape setting process.Type: ApplicationFiled: August 28, 2013Publication date: March 13, 2014Applicant: KABUSHIKI KAISHA NIHON MICRONICSInventors: Takayasu SUGAI, Noboru OTABE