Abstract: A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.

Abstract: A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.

Abstract: A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.

Abstract: A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.

Abstract: A continuous extrusion molding system for continuously extrusion molding a weather strip for an automobile includes a prickly gear, rotatable while pressed in contact with the weather strip being extruded, and disposed so as to be adjacent to a mouth piece of an extruder. Tiny holes having a depth reaching a core bar are defined preferably in a groove bottom of a U-like shape of a part of a slightly foamed solid rubber portion, in such a way as to be arranged in line along the longitudinal direction of the weather strip by use of the prickly gear.

Abstract: There is provided a weather strip for an automobile, wherein a void due to a gas pocket is prevented from occurring to a boundary part between a core bar and a slightly foamed solid rubber portion, and a continuous extrusion molding system for molding the same. The weather strip for the automobile comprises a U-shaped trim formed by embedding the core bar in the slightly foamed solid rubber portion, foamed so as to have a specific gravity of 0.8 to 1.2, and tiny holes having a depth reaching the core bar are defined in part of the slightly foamed solid rubber portion in such a way as to be arranged in line along the longitudinal direction of the weather strip.

Abstract: There is provided a weather strip for an automobile, wherein a void due to a gas pocket is prevented from occurring to a boundary part between a core bar and a slightly foamed solid rubber portion, and a continuous extrusion molding system for molding the same. The weather strip for the automobile comprises a U-shaped trim formed by embedding the core bar in the slightly foamed solid rubber portion, foamed so as to have a specific gravity of 0.8 to 1.2, and tiny holes having a depth reaching the core bar are defined in part of the slightly foamed solid rubber portion in such a way as to be arranged in line along the longitudinal direction of the weather strip.

Abstract: There is provided a weather strip for an automobile, wherein a void due to a gas pocket is prevented from occurring to a boundary part between a core bar and a slightly foamed solid rubber portion, and a continuous extrusion molding system for molding the same. The weather strip for the automobile comprises a U-shaped trim formed by embedding the core bar in the slightly foamed solid rubber portion, foamed so as to have a specific gravity of 0.8 to 1.2, and tiny holes having a depth reaching the core bar are defined in part of the slightly foamed solid rubber portion in such a way as to be arranged in line along the longitudinal direction of the weather strip.

Abstract: A lightweight mixed dielectric and a manufacturing method thereof is described, which is prepared by mixing metal-coated expanded particles of plastic, glass or silica, thin-wall metal pipes or metal coated thin-wall plastic pipes and uncoated expanded particles of plastic, glass or silica and then forming the resulting mixture into a desired shape by thermal expansion or by the use of binder with the provision that these uncoated expanded particles are only made of plastic when the forming step is carried out by thermal expansion.