Abstract: A magnetic recording medium includes a substrate, a seed layer, an under layer, and a perpendicular recording layer having a granular structure. (Ms·?·?1.5(1?Rs)0.33), Ms, and ? satisfy (Ms·?·?1.5(1?Rs)0.33)?0.1 [?·emu·(mm)?1.5], Ms?450 [emu/cc], and ??1.2. In the above formulas, Ms indicates a saturated magnetization amount, ? indicates the gradient of a M-H loop around a coercive force Hc, ? indicates the thickness of the perpendicular recording layer, and Rs indicates a squareness ratio.

Abstract: There is provided a magnetic recording medium including a base; a seed layer; a foundation layer; and a recording layer, the seed layer being disposed between the base and the foundation layer, having an amorphous state, including an alloy containing Ti, Cr and O, a percentage of Ti being 30 atomic % to 100 atomic % based on a total amount of Ti and Cr contained in the seed layer, and a percentage of O being 15 atomic % or less based on a total amount of Ti, Cr and O contained in the seed layer. Also, a production method thereof is provided.

Abstract: A magnetic recording medium includes a non-magnetic supporter; a lower non-magnetic layer containing at least inorganic particles and a binder resin; and a magnetic layer containing at least a magnetic powder and a binder resin and having a thickness of 100 nm or less, the lower non-magnetic layer and the magnetic layer being laminated on a main surface of the non-magnetic supporter, wherein the magnetic layer is formed by a process including applying a paint for forming the lower non-magnetic layer; drying the applied paint; and applying a magnetic paint while the lower non-magnetic layer is kept in a film state after drying.

Abstract: A magnetic read/write system includes a magnetic read/write apparatus containing a magnetoresistive head having at least one flux guide; and a magnetic recording medium including a magnetic layer on a nonmagnetic support; the magnetoresistive head including a static charge-removing unit for removing static charges, the thickness of the magnetic layer constituting the magnetic recording medium being 0.3 ?m or less, and the surface electric resistivity of the surface of the magnetic layer being in the range of 1×108 to 1×1013 ?/sq.

Abstract: The coating-type magnetic recording medium has a non-magnetic layer mainly composed of a non-magnetic powder and binder, and a magnetic layer mainly composed of a ferromagnetic powder and a binder, which are stacked in this order on a non-magnetic substrate, wherein dispersion ?L/L of long-axis length of all ferromagnetic powder particles contained in the magnetic layer falls in a range of ?L/L?±10%, where L is an average long-axis length and ?L is a standard deviation thereof, and dispersion ?W/W of short-axis length of all ferromagnetic powders contained in the magnetic layer falls in a range of ?W/W?±15%, where W is an average short-axis length and ?W is a standard deviation thereof. The average long-axis length L is typically adjusted within the range of 0.08 ?m and 0.12 ?m, and the Switching Field Distribution (SFD) of the medium is adjusted to 0.25 or less.

Abstract: An electronics packaging system (1) including a printer (3), a placing unit (4) and a reflow unit (5), wherein a printed wiring board (2) is carried while being kept in an upright position. The printed wiring board (2) has solder printed on all the lands thereof at the same time, the electronic parts (10) are all placed on the lands at the same time, and the electronic parts (10) are all soldered to the lands at the same time. Thus, the system (1) can be designed more compact, and the electronic parts packaged in a shorter time.

Abstract: The coating-type magnetic recording medium has a non-magnetic layer mainly composed of a non-magnetic powder and binder, and a magnetic layer mainly composed of a ferromagnetic powder and a binder, which are stacked in this order on a non-magnetic substrate, wherein dispersion &sgr;L/L of long-axis length of all ferromagnetic powder particles contained in the magnetic layer falls in a range of &sgr;L/L≦±10%, where L is an average long-axis length and &sgr;L is a standard deviation thereof, and dispersion &sgr;W/W of short-axis length of all ferromagnetic powders contained in the magnetic layer falls in a range of &sgr;W/W≦±15%, where W is an average short-axis length and &sgr;W is a standard deviation thereof. The average long-axis length L is typically adjusted within the range of 0.08 &mgr;m and 0.12 &mgr;m, and the Switching Field Distribution (SFD) of the medium is adjusted to 0.25 or less.

Abstract: A semiconductor device includes an IC chip, a frame on which the IC chip is mounted, a conductive plate disposed beneath and spaced from the frame, a first external terminal and a second external terminal that electrically connect the IC chip, the frame, and the conductive plate, and a molding compound covering and encapsulating the IC chip, the frame, and the conductive plate.

Abstract: The semiconductor device includes IC chip 2, frame 3 on which the IC chip 2 is mounted, conductive plate 3a disposed beneath the frame 3 at given interval from the frame 3, first external terminal 6a and second external terminal 6b that electrically connects the IC chip 2, the frame 3, and the conductive plate 3a, and molding compound 8 covering and encapsulating the IC chip 2, the frame 3, and the conductive plate 3a.

Abstract: A method of producing a semiconductor device having a polymetal wiring structure fabricated by a polycrystalline silicon film, a reaction preventing film, and a tungsten film comprising steps of forming a polycrystalline silicon film 4 and a tungsten nitride film 13 on a silicon substrate 1; forming a tungsten film 14 using a target of tungsten containing fluorine of 10 ppm or less by a sputtering method; and forming a gate electrode 15 by patterning a polycrystalline silicon film 4, the tungsten nitride film 13, and the tungsten film 14, whereby a content of fluorine can be reduced, a film separation is prevented, and a preferable transistor property is obtainable.

Abstract: In an electronics packaging system (1) including a printer (3), placing unit (4) and reflow unit (5), a printed wiring board (2) is carried while being kept in upright position. The printed wiring board (2) has solder printed on lands thereof at the same time, electronic parts (10) placed on the lands at the same time, and the electronic parts (10) solder to the lands at the same time. Thus, the system (1) can be designed more compact, and package electronic parts in a shorter time.

Abstract: If a packaged IC chip is judged to be defective during inspection just before its shipment, then, optimum correction information is calculated from the results of the electric characteristics of the IC chip. The calculated correction information is written in a nonvolatile memory for correction in the semiconductor chip to correct the electric characteristics of the semiconductor chip. The characteristics corrected IC chip is then inspected again.

Abstract: The semiconductor device with the alignment mark includes a convex portion as a film growth control region for forming side surfaces approximately parallel to sidewalls on surfaces opposite to the sidewalls of first metal interconnection layer formed in a recess portion of the alignment mark at the time of deposition of first metal interconnection layer. Thus, the semiconductor device with the alignment mark and manufacturing method thereof allowing the easy and accurate detection of the location of a layer deposited on side surfaces of the alignment mark can be provided.

Abstract: The method of combating bacterial infection of fish which comprises supplying to such fish or to their water an antibacterially effective amount of a quinoline derivative, salt or hydrate thereof of the formula ##STR1## in which R.sub.1 is hydrogen or a lower alkyl or lower hydroxy alkyl group, andR.sub.2 is hydrogen or a lower alkyl group.

Abstract: Improvement in an annular seal for use in a hydraulic actuator is obtained in accordance with the present invention, which annular seal is of the type including fitting holes to be inserted by projections formed in a piston guide and is adapted to be mounted between a piston guide sleeve and the piston guide, by the provision of annular projections extending in an annular shape and in the axial direction of the seal in the inner and outer circumferential portions with respect to the location of the fitting holes or in the circumferential area of the piston guide corresponding to that circumferential portions.