Abstract: The suction device (1) includes: an suction part (2) formed with a plurality of suction holes (8) and adapted to abut against an suction object (9); side walls (3) and a top wall (4) for forming a negative pressure chamber (10) in cooperation with the suction part (2); a pin-shaped valve body (13) extending from the negative pressure chamber (10) into a suction hole (8); and a closing part (16) adapted to close the suction hole (8) in such a way that the valve body (13) slides in the suction hole (8) causing a portion of the valve body (13) and a portion of the inner wall of the suction hole (8) to come into close contact, wherein the valve body (13) has a root part (13a), which is one end thereof located in the negative pressure chamber (10), the root part (13a) is fixed to a plate-shaped flexible body (17) having flexibility and being bridged between and fixed to the side walls (3) in the negative pressure chamber (10), and the flexible body (17) has a plurality of through-holes (19).

Abstract: A spiral probe includes a tapered distal end portion (2) configured to be brought into direct contact with an inspection object, a hollow, nearly cylindrical distal body (3) extending in one direction from the base of the distal end portion (2), a hollow, nearly cylindrical flexible portion (4) integral with and continuously extending in the one direction from the distal body (3) and having a spiral outer peripheral surface, and a hollow, nearly cylindrical proximal end portion (5) integral with and continuously extending in the one direction from the flexible portion (4), wherein the distal body (3), the flexible portion (4) and the proximal end portion (5) have outer peripheral surfaces aligned with each other in the one direction.

Abstract: A circuit board which is formed with bump patterns subject to a narrow variation in height on the surface of the circuit board, and which permits high-density packaging of a semiconductor component thereon. In this circuit board, conductor circuits formed by electroplating are embedded in an insulating base that is formed of a resist layer and an insulating substrate, and bumps are exposed in the surface of the insulating base. The bumps and the conductor circuits are connected electrically with one another by means of pillar-shaped conductors that are formed by electroplating. Each bump is a multilayer structure in two or more layers formed by successively depositing different electrically conductive materials by electroplating.

Abstract: A circuit board which is formed with bump patterns subject to a narrow variation in height on the surface of the circuit board, and which permits high-density packaging of a semiconductor component thereon. In this circuit board, conductor circuits formed by electroplating are embedded in an insulating base that is formed of a resist layer and an insulating substrate, and bumps are exposed in the surface of the insulating base. The bumps and the conductor circuits are connected electrically with one another by means of pillar-shaped conductors that are formed by electroplating. Each bump is a multilayer structure in two or more layers formed by successively depositing different electrically conductive materials by electroplating.

Abstract: A circuit board, which is formed with bump patterns subject to a narrow variation in height on the surface of the circuit board, and which permits high-density packaging of a semiconductor component thereon. In this circuit board, conductor circuits formed by electroplating are embedded in an insulating base that is formed of a resist layer and an insulating substrate, and bumps are exposed in the surface of the insulating base. The bumps and the conductor circuits are connected electrically with one another by means of pillar-shaped conductors that are formed by electroplating. Each bump is a multilayer structure in two or more layers formed by successively depositing different electrically conductive materials by electroplating.